公开(公告)号：US20180344245A1

公开(公告)日：2018-12-06

申请号：US16054366

申请日：2018-08-03

Applicant: International Business Machines Corporation

Inventor： John U. Knickerbocker ,  Shriya Kumar ,  Jae-Woong Nah

IPC: A61B5/00 ,  H05K3/40 ,  A61M5/00 ,  B23K3/06 ,  H01L21/48 ,  H01L21/768 ,  H01L23/15 ,  H01L23/498 ,  H01L23/532 ,  H05K1/03 ,  H01L23/00 ,  H01L23/66 ,  H01L23/538 ,  B23K101/36

CPC classification number: A61B5/68 ,  A61B2562/12 ,  A61M5/00 ,  A61M2207/00 ,  B23K3/0638 ,  B23K2101/36 ,  H01L21/486 ,  H01L21/76816 ,  H01L21/76852 ,  H01L21/76883 ,  H01L21/76898 ,  H01L23/15 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/53228 ,  H01L23/53233 ,  H01L23/53238 ,  H01L23/53242 ,  H01L23/53252 ,  H01L23/53266 ,  H01L23/5389 ,  H01L23/66 ,  H01L24/19 ,  H01L24/20 ,  H01L24/27 ,  H01L24/32 ,  H01L24/64 ,  H01L24/69 ,  H01L24/83 ,  H01L24/89 ,  H01L2223/6677 ,  H01L2224/27312 ,  H01L2224/32111 ,  H01L2224/32235 ,  H01L2224/325 ,  H01L2224/64 ,  H01L2224/69 ,  H01L2224/83801 ,  H01L2224/89 ,  H01L2224/96 ,  H01L2924/014 ,  H01L2924/1434 ,  H01L2924/15332 ,  H05K1/0306 ,  H05K3/4038 ,  H05K2201/0305

Abstract: An apparatus includes a substrate having one or more vias formed therein. At least one of the vias has at least one liner disposed on at least one sidewall thereof. The apparatus also includes at least one interconnect formed through the at least one via. The one or more interconnects comprise a solder material filled using injection molded soldering.

公开(公告)号：US20180242449A1

公开(公告)日：2018-08-23

申请号：US15898986

申请日：2018-02-19

Applicant: IMEC VZW

Inventor： Riet LABIE ,  Frederic DUFLOS

IPC: H05K1/03 ,  H05K3/30 ,  H05K1/11

CPC classification number: H05K1/038 ,  H01R12/62 ,  H01R43/205 ,  H05K1/115 ,  H05K1/141 ,  H05K3/0058 ,  H05K3/301 ,  H05K3/325 ,  H05K3/4046 ,  H05K2201/0281 ,  H05K2201/029 ,  H05K2201/0305 ,  H05K2201/10287 ,  H05K2201/10295

Abstract: According to an aspect of the present inventive concept there is provided a system comprising: a conductive textile including conductive fibers, an electronic circuit unit arranged on a first main surface of the conductive textile and including circuitry and a carrier supporting the circuitry, the carrier having a first main surface and a second main surface facing the first main surface of the textile and including a through-hole extending from the first main surface to the second main surface, a conductive pin including an leg segment arranged at least partly in the through-hole, and a grip segment arranged to grip about at least one fiber of the conductive textile. There is also provided a method for mounting an electronic circuit unit on a conductive textile.

公开(公告)号：US09603236B2

公开(公告)日：2017-03-21

申请号：US14462331

申请日：2014-08-18

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Hyoung Kim

IPC: F28F7/00 ,  H05K1/02 ,  H05K3/42 ,  H05K3/46

CPC classification number: H05K1/0206 ,  H05K1/0209 ,  H05K3/429 ,  H05K3/4679 ,  H05K2201/0305 ,  H05K2201/09536 ,  H05K2201/096 ,  H05K2201/09809

Abstract: There is provided a heat dissipating substrate including: a base substrate having a first through hole formed therein; a first substrate disposed on an upper end portion of the base substrate and including a second through hole having a diameter smaller than that of the first through hole; and a heat dissipating pad disposed on an upper end portion of the second through hole. In addition, a flow phenomenon of a thermal conduction member (lead) may be reduced using the thermal conduction member by forming a second through hole smaller than a first through hole.

公开(公告)号：US20170062688A1

公开(公告)日：2017-03-02

申请号：US15249920

申请日：2016-08-29

Applicant: Johnson Electric S.A.

Inventor： Peng ZHU ,  Steven Eric DEAN ,  Jean-Francois ROY

IPC: H01L33/64 ,  H01L33/62

CPC classification number: H01L33/647 ,  F21V29/70 ,  F21Y2115/10 ,  H01L33/62 ,  H05K1/0204 ,  H05K1/056 ,  H05K1/189 ,  H05K2201/0305 ,  H05K2201/10106 ,  H05K2201/10416

Abstract: A thermally-efficient electrical assembly comprising: an electrically-conductive layer; a heat sink layer; an electrically-insulating interconnecting layer interposed between the electrically-conductive layer and heat sink layer; an electrical component in electrical communication with the electrically-conductive layer; and a metallic thermal bridge in thermal communication with the electrical component and in direct contact with the heat sink layer, thereby bypassing the electrically-insulating layer.

Abstract translation: 一种热效率电气组件，包括：导电层; 散热层; 插入在导电层和散热层之间的电绝缘互连层; 与所述导电层电连通的电气部件; 以及与电气部件热连通并与散热层直接接触的金属热桥，由此绕过电绝缘层。

公开(公告)号：US09537197B2

公开(公告)日：2017-01-03

申请号：US14559503

申请日：2014-12-03

Applicant: QUALCOMM Incorporated

Inventor： Darryl Jessie ,  Lan Nan

IPC: H01P3/00 ,  H01L23/00 ,  H01L23/66 ,  H01L21/768 ,  H01L23/528

CPC classification number: H01P3/006 ,  H01L21/768 ,  H01L23/5225 ,  H01L23/525 ,  H01L23/528 ,  H01L23/66 ,  H01L24/11 ,  H01L24/14 ,  H01L2223/6605 ,  H01L2223/6627 ,  H01P3/003 ,  H05K1/0219 ,  H05K2201/0305 ,  H05K2201/09236 ,  H05K2201/09336 ,  H05K2201/09618

Abstract: In an integrated circuit package that houses radio-frequency (RF) circuits or components using wafer-level packaging (WLP), an RF-signal transmission structure includes a signal-carrying conductive line positioned between grounded conductive lines to avoid undesirable coupling between the signal-carrying conductive line and other RF circuits or components in the same package.

Abstract translation: 在使用晶片级封装（WLP）容纳射频（RF）电路或部件的集成电路封装中，RF信号传输结构包括位于接地导线之间的信号承载导线，以避免信号之间的不期望的耦合 - 同一封装中的导线和其他RF电路或组件。

公开(公告)号：US09504142B2

公开(公告)日：2016-11-22

申请号：US14629697

申请日：2015-02-24

Applicant: YAZAKI CORPORATION

Inventor： Hisashi Hanazaki

IPC: H05K1/02 ,  H01B7/08 ,  H05K1/18 ,  H05K1/03 ,  H05K3/10 ,  H05K3/12

CPC classification number: H05K1/0263 ,  H01B7/0838 ,  H05K1/0265 ,  H05K1/028 ,  H05K1/0293 ,  H05K1/0393 ,  H05K1/181 ,  H05K3/101 ,  H05K3/102 ,  H05K3/125 ,  H05K3/1275 ,  H05K2201/0305 ,  H05K2201/09281 ,  H05K2201/09727 ,  H05K2201/09736 ,  H05K2201/10181 ,  H05K2203/107

Abstract: A flexible flat circuit includes a pair of insulation sheets, and a plurality of conductors that are held between and covered with the pair of insulation sheets in a state that the plurality of conductors are separated to each other. Among from the plurality of conductors, at least conductors with different current capacities are different in thickness to each other.

Abstract translation: 柔性扁平电路包括一对绝缘片，以及多个导体，其以多个导体彼此分离的状态保持在一对绝缘片之间并被其覆盖。 在多个导体中，至少具有不同电流容量的导体的厚度彼此不同。

公开(公告)号：US20160336258A1

公开(公告)日：2016-11-17

申请号：US15221015

申请日：2016-07-27

Applicant: INTEL CORPORATION

Inventor： Yueli Liu

IPC: H01L23/498 ,  H05K1/18 ,  H01L23/00

CPC classification number: H01L23/49811 ,  H01L21/311 ,  H01L21/4803 ,  H01L21/4853 ,  H01L21/486 ,  H01L21/565 ,  H01L23/49827 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/03828 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/11849 ,  H01L2224/32225 ,  H01L2224/73267 ,  H05K1/181 ,  H05K1/185 ,  H05K2201/0305 ,  H05K2201/10674 ,  H05K2203/1469

Abstract: Embodiments of the present disclosure describe techniques and configurations for package assembly including an embedded element and a molded insulator material. In some embodiments, an apparatus includes an electrical element (such as a die or a bridge interconnect structure) positioned on a surface of an insulator layer, a conductive pad positioned on the surface of the insulator layer and spaced apart from the electrical element, and a molded insulator material disposed on the surface of the insulator layer adjacent to the electrical element and on the conductive pad. Other embodiments may be described and/or claimed.

公开(公告)号：US20140328596A1

公开(公告)日：2014-11-06

申请号：US14371537

申请日：2012-01-31

Applicant: Sagi Varghese Mathai ,  Michael Renne Ty Tan ,  Paul Kessler Rosenberg ,  Wayne Victor Sorin ,  Georgios Panotopoulos ,  Susant K. Patra ,  Joseph Straznicky

Inventor： Sagi Varghese Mathai ,  Michael Renne Ty Tan ,  Paul Kessler Rosenberg ,  Wayne Victor Sorin ,  Georgios Panotopoulos ,  Susant K. Patra ,  Joseph Straznicky

IPC: H04B10/25 ,  H01L31/02 ,  H01L31/0203 ,  H01L31/167

CPC classification number: H04B10/2504 ,  G02B6/4245 ,  H01L31/02005 ,  H01L31/0203 ,  H01L31/167 ,  H05K1/0274 ,  H05K2201/0305 ,  H05K2201/10121 ,  H05K2201/10977

Abstract: A combination underfill-dam and electrical-interconnect structure for an opto-electronic engine. The structure includes a first plurality of electrical-interconnect solder bodies. The first plurality of electrical-interconnect solder bodies includes a plurality of electrical interconnects. The first plurality of electrical-interconnect solder bodies, is disposed to inhibit intrusion of underfill material into an optical pathway of an opto-electronic component for the opto-electronic engine. A system and an opto-electronic engine that include the combination underfill-dam and electrical interconnect structure are also provided.

Abstract translation: 用于光电发动机的组合底部填充坝和电互连结构。 该结构包括第一多个电互连焊料体。 第一组多个电互连焊料体包括多个电互连。 第一组多个电互连焊料体设置成阻止底部填充材料侵入光电子发动机的光电子部件的光路中。 还提供了包括组合底部填充坝和电互连结构的系统和光电发动机。

公开(公告)号：US08539666B2

公开(公告)日：2013-09-24

申请号：US13293671

申请日：2011-11-10

Applicant: Michael Raymond Weatherspoon ,  Louis Joseph Rendek, Jr. ,  Lawrence Wayne Shacklette ,  Robert Patrick Maloney ,  David M. Smith

Inventor： Michael Raymond Weatherspoon ,  Louis Joseph Rendek, Jr. ,  Lawrence Wayne Shacklette ,  Robert Patrick Maloney ,  David M. Smith

IPC: H01F7/06

CPC classification number: H01F27/2804 ,  H01F5/00 ,  H01F17/0006 ,  H01F41/041 ,  H01F2017/0046 ,  H01F2017/0073 ,  H05K1/165 ,  H05K3/146 ,  H05K3/16 ,  H05K3/20 ,  H05K2201/0141 ,  H05K2201/0305 ,  H05K2201/1003 ,  H05K2203/016 ,  Y10T29/4902 ,  Y10T29/49071 ,  Y10T29/49073 ,  Y10T29/49075

Abstract: A method is for making an electrical inductor. The method includes forming a first subunit having a sacrificial substrate, and an electrically conductive layer defining the electrical inductor and including a first metal on the sacrificial substrate. The method includes forming a second subunit having a dielectric layer and an electrically conductive layer thereon defining electrical inductor terminals and having the first metal, and coating a second metal onto the first metal of one of the first and second subunits. The method includes aligning the first and second subunits together, heating and pressing the aligned first and second subunits to form an intermetallic compound of the first and second metals bonding adjacent metal portions together, and removing the sacrificial substrate.

公开(公告)号：US08486833B2

公开(公告)日：2013-07-16

申请号：US11920483

申请日：2006-05-18

Applicant: Derek A. Bruzewicz ,  Mila Boncheva-Bettex ,  George M. Whitesides ,  Adam Siegel ,  Douglas B. Weibel ,  Sergey S. Shevkoplyas ,  Andres Martinez

Inventor： Derek A. Bruzewicz ,  Mila Boncheva-Bettex ,  George M. Whitesides ,  Adam Siegel ,  Douglas B. Weibel ,  Sergey S. Shevkoplyas ,  Andres Martinez

IPC: H01L21/44 ,  H01L21/4763

CPC classification number: H05K3/101 ,  B01L3/5027 ,  B01L3/502707 ,  B01L2200/12 ,  B01L2300/0645 ,  B01L2300/0816 ,  B01L2300/0874 ,  B01L2400/0415 ,  B33Y80/00 ,  H05K1/0272 ,  H05K1/032 ,  H05K3/389 ,  H05K2201/0162 ,  H05K2201/0305 ,  H05K2203/128 ,  Y10T29/49117

Abstract: Disclosed herein are a variety of microfluidic devices and solid, typically electrically conductive devices that can be formed using such devices as molds. In certain embodiments, the devices that are formed comprise conductive pathways formed by solidifying a liquid metal present in one or more microfluidic channels (such devices hereinafter referred to as “microsolidic” devices). In certain such devices, in which electrical connections can be formed and/or reformed between regions in a microfluidic structure; in some cases, the devices/circuits formed may be flexible and/or involve flexible electrical components. In certain embodiments, the solid metal wires/conductive pathways formed in microfluidic channel(s) may remain contained within the microfluidic structure. In certain such embodiments, the conductive pathways formed may be located in proximity to other microfluidic channel(s) of the structure that carry flowing fluid, such that the conductive pathway can create energy (e.g. electromagnetic and/or thermal energy) that interacts withy and/or affects the flowing fluid and/or a component contained therein or carried thereby. In other embodiments, a microsolidic structure may be removed from a microfluidic mold to form a stand-alone structure. In certain embodiments, the solid metal structures formed may interact with light energy incident upon a structure or may be used to fabricate a light-weight electrode. Another aspect of the invention relates to the formation of self-assembled structures that may comprise these electrically conductive pathways/connections.

Abstract translation: 本文公开了各种微流体装置和可以使用诸如模具的装置形成的固体，通常导电的装置。 在某些实施方案中，所形成的装置包括通过固化存在于一个或多个微流体通道中的液体金属形成的导电通路（以下称为“微溶体”装置）。 在某些这样的器件中，其中可以在微流体结构中的区域之间形成和/或重组电连接; 在一些情况下，形成的器件/电路可以是柔性的和/或涉及柔性电气部件。 在某些实施方案中，在微流体通道中形成的固体金属线/导电路径可以保持在微流体结构内。 在某些这样的实施例中，所形成的导电路径可以位于结构的其它微流体通道附近，其携带流动的流体，使得导电路径可以产生与其相互作用的能量（例如电磁和/或热能） /或影响流动的流体和/或其中所含的或由其携带的部件。 在其它实施方案中，微溶体结构可以从微流体模具中移除以形成独立结构。 在某些实施方案中，所形成的固体金属结构可与入射到结构上的光能相互作用，或者可用于制造轻质电极。 本发明的另一方面涉及可以包括这些导电路径/连接的自组装结构的形成。