公开(公告)号：US11092392B2

公开(公告)日：2021-08-17

申请号：US16504834

申请日：2019-07-08

Applicant: Raytheon Company

Inventor： Christopher R. Koontz ,  David Filgas

IPC: F28F21/00 ,  F28F21/02 ,  F28F21/04 ,  F28F21/08 ,  F28F3/02 ,  G02B7/00 ,  G02B7/18 ,  H01S3/04 ,  H01S5/024 ,  H01S3/23 ,  F28F3/04

Abstract: In one aspect, a transparent heat exchanger includes a first transparent substrate optically attached to a heat source, one or more fins to transfer heat from the heat source, the one or more fins comprising transparent material and further comprising one of a manifold coupled to the first transparent substrate or a facesheet coupled to the first transparent material.

公开(公告)号：US20210072074A1

公开(公告)日：2021-03-11

申请号：US16567756

申请日：2019-09-11

Applicant: RAYTHEON COMPANY

Inventor： James R. Chow ,  Edward Ward, JR. ,  Christopher R. Koontz ,  Hans P. Naepflin ,  Steven E. Persh ,  Stephen J. Schiller ,  Stephanie Lin

IPC: G01J1/08 ,  G01J5/00

Abstract: A broadband calibrator assembly is provided and includes a medium/long wave infrared (MW/LW IR) assembly and multiple ultraviolet (UV)/visible and near IR (VNIR)/short wave IR (SWIR) assemblies.

公开(公告)号：US10763633B2

公开(公告)日：2020-09-01

申请号：US15825593

申请日：2017-11-29

Applicant: Raytheon Company

Inventor： Stephen H. McGanty ,  David M. Filgas ,  Christopher R. Koontz

IPC: H01S3/04 ,  H01S3/042 ,  H01S3/06 ,  H01S3/063 ,  G02B6/10 ,  H01S3/13 ,  H01S3/131 ,  H01S3/23

Abstract: This disclosure provides planar waveguides with enhanced support and/or cooling. One or more endcaps could be disposed between coating/cladding layers at one or more ends of a core region, where the core region is doped with at least one active ion species and each endcap is not doped with any active ion species that creates substantial absorption at pump and signal wavelengths. A core region could include at least one crystal or crystalline material, and at least one cladding layer could include at least one glass. Different types of coolers could be disposed on or adjacent to different coating/cladding layers. Side claddings could be disposed on opposite sides of a planar waveguide, where the opposite sides represent longer sides of the waveguide. Endcaps and one or more coolers could be sealed to a housing, and coolant can flow through a substantially linear passageway along a length of the waveguide. One side of a planar waveguide could be uncooled.

公开(公告)号：US20200049429A1

公开(公告)日：2020-02-13

申请号：US16589840

申请日：2019-10-01

Applicant: Raytheon Company

Inventor： Christopher R. Koontz ,  Scott T. Johnson ,  Shadi S. Merhi

IPC: F28F7/02 ,  H01L23/40 ,  H01L23/473

Abstract: A threaded cooling apparatus includes a head having a heat exchanger and a shaft having a threaded section configured to mechanically fasten the head to a structure. The heat exchanger is configured to exchange heat with a coolant flowing through the head. The shaft also includes first and second cooling channels. The first cooling channel is configured to deliver the coolant to the heat exchanger, and the second cooling channel is configured to exhaust the coolant from the heat exchanger. The apparatus may also include a first seal between the head and the structure that is configured to reduce or prevent coolant loss. The apparatus may further include a second seal that is configured to reduce or prevent coolant flow between the first and second cooling channels that bypasses the heat exchanger.

公开(公告)号：US09972960B1

公开(公告)日：2018-05-15

申请号：US15381521

申请日：2016-12-16

Applicant: RAYTHEON COMPANY

Inventor： Christopher R. Koontz ,  David M. Filgas ,  Kurt S. Ketola ,  Carl W. Townsend

IPC: G02B6/10 ,  H01S3/063 ,  H01S3/04 ,  H01S3/094 ,  H01S3/16

CPC classification number: H01S3/0637 ,  H01S3/04 ,  H01S3/0405 ,  H01S3/094003 ,  H01S3/1608 ,  H01S3/161 ,  H01S3/1611 ,  H01S3/1616 ,  H01S3/1618 ,  H01S3/1643 ,  H01S5/02461 ,  H01S5/02476

Abstract: An active optical planar waveguide apparatus includes a planar core layer comprising an active laser ion; one or more cladding layers in optical contact with at least one surface of the planar core layer; a metallic binder layer chemically bonded to an outermost cladding layer of the one or more cladding layers; a metallic adhesion layers disposed on the metallic binder layer; a heatsink for dissipating heat from the planar waveguide; and a metallic thermal interface material (TIM) layer providing a metallurgical bond between the metallic adhesion layer and the heatsink.

公开(公告)号：US20180090901A1

公开(公告)日：2018-03-29

申请号：US15825593

申请日：2017-11-29

Applicant: Raytheon Company

Inventor： Stephen H. McGanty ,  David M. Filgas ,  Christopher R. Koontz

IPC: H01S3/04 ,  H01S3/06 ,  H01S3/042 ,  H01S3/063

Abstract: This disclosure provides planar waveguides with enhanced support and/or cooling. One or more endcaps could be disposed between coating/cladding layers at one or more ends of a core region, where the core region is doped with at least one active ion species and each endcap is not doped with any active ion species that creates substantial absorption at pump and signal wavelengths. A core region could include at least one crystal or crystalline material, and at least one cladding layer could include at least one glass. Different types of coolers could be disposed on or adjacent to different coating/cladding layers. Side claddings could be disposed on opposite sides of a planar waveguide, where the opposite sides represent longer sides of the waveguide. Endcaps and one or more coolers could be sealed to a housing, and coolant can flow through a substantially linear passageway along a length of the waveguide. One side of a planar waveguide could be uncooled.

公开(公告)号：US20170353005A1

公开(公告)日：2017-12-07

申请号：US15233238

申请日：2016-08-10

Applicant: Raytheon Company

Inventor： David M. Filgas ,  Stephen H. McGanty ,  Christopher R. Koontz

IPC: H01S5/024 ,  H01S5/022 ,  H01S5/20 ,  H01S5/04 ,  F21V8/00 ,  H01S3/02

CPC classification number: H01S5/02423 ,  G02B6/00 ,  G02B6/0011 ,  G02B6/0081 ,  G02B6/0085 ,  G02B6/4204 ,  G02B6/4214 ,  G02B6/4296 ,  G02B27/0927 ,  G02B27/0994 ,  H01S3/025 ,  H01S3/0407 ,  H01S3/042 ,  H01S3/0632 ,  H01S3/094057 ,  H01S3/09415 ,  H01S3/1301 ,  H01S3/1305 ,  H01S3/1307 ,  H01S3/1312 ,  H01S3/2308 ,  H01S5/02236 ,  H01S5/02296 ,  H01S5/041 ,  H01S5/2018

Abstract: A system includes a laser system having a master oscillator and a planar waveguide (PWG) amplifier having one or more laser diode pump arrays, a PWG pumphead, input optics, and output optics. The PWG pumphead is configured to receive a low-power optical beam from the master oscillator and generate a high-power optical beam. The PWG pumphead includes a laser gain medium, a cartridge, and a pumphead housing. The cartridge is configured to receive and retain the laser gain medium, and the cartridge includes one or more cooling channels configured to transport coolant in order to cool the laser gain medium. The pumphead housing is configured to receive and retain the cartridge, where the cartridge is removable from the housing.

公开(公告)号：US20170237220A1

公开(公告)日：2017-08-17

申请号：US15041909

申请日：2016-02-11

Applicant: Raytheon Company

Inventor： Stephen H. McGanty ,  David M. Filgas ,  Christopher R. Koontz

IPC: H01S3/04 ,  H01S3/06 ,  H01S3/063

CPC classification number: H01S3/0407 ,  H01S3/0405 ,  H01S3/042 ,  H01S3/0621 ,  H01S3/0625 ,  H01S3/0632 ,  H01S3/1305 ,  H01S3/1312 ,  H01S3/2308

Abstract: This disclosure provides planar waveguides with enhanced support and/or cooling. One or more endcaps could be disposed between coating/cladding layers at one or more ends of a core region, where the core region is doped with at least one active ion species and each endcap is not doped with any active ion species that creates substantial absorption at pump and signal wavelengths. A core region could include at least one crystal or crystalline material, and at least one cladding layer could include at least one glass. Different types of coolers could be disposed on or adjacent to different coating/cladding layers. Side claddings could be disposed on opposite sides of a planar waveguide, where the opposite sides represent longer sides of the waveguide. Endcaps and one or more coolers could be sealed to a housing, and coolant can flow through a substantially linear passageway along a length of the waveguide. One side of a planar waveguide could be uncooled.

公开(公告)号：US20150380343A1

公开(公告)日：2015-12-31

申请号：US14317998

申请日：2014-06-27

Applicant: Raytheon Company

Inventor： Christopher R. Koontz ,  Jason G. Milne ,  Tse E. Wong ,  Ethan S. Heinrich

IPC: H01L23/495 ,  H01L23/48 ,  H01L21/48

CPC classification number: H01L23/49534 ,  H01L21/4825 ,  H01L21/4871 ,  H01L23/367 ,  H01L23/481 ,  H01L23/4951 ,  H01L23/49541 ,  H01L23/5227 ,  H01L23/562 ,  H01L24/08 ,  H01L24/16 ,  H01L2223/6616 ,  H01L2223/6627 ,  H01L2223/6677 ,  H01L2223/6683 ,  H01L2224/0401 ,  H01L2224/0557 ,  H01L2224/08225 ,  H01L2224/131 ,  H01L2224/16238 ,  H01L2224/80896 ,  H01L2924/1423 ,  H01L2924/00014 ,  H01L2924/014

Abstract: A flip-chip mounted semiconductor structure having a flip chip mounting pad and a circuit structure flip-chip mounted to the flip chip mounting pad. The circuit structure includes: a semiconductor die; and a stiffener structure attached to the die, the stiffener structure having a conduit passing through the stiffener structure between a front side of the stiffener structure and a hack side of the stiffener structure, the stiffener and attached die having a degree of rigidity greater than the die alone.

Abstract translation: 一种倒装芯片安装的半导体结构，其具有倒装芯片安装焊盘和安装到倒装芯片安装焊盘的倒装芯片的电路结构。 电路结构包括：半导体管芯; 以及加强件结构，其附接到所述模具，所述加强结构具有穿过所述加强件结构的导管，所述加强件结构在所述加强结构的前侧和所述加强结构的前侧之间，所述加强件和连接的模具具有大于 一个人死亡