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公开(公告)号:US20210127527A1
公开(公告)日:2021-04-29
申请号:US16711734
申请日:2019-12-12
Applicant: TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.LTD.
Inventor: SHIN-WEN CHEN , JING-WEI LI , JIAN-CHAO SONG , SHENG-JIE DING
Abstract: A heat dissipation structure mounted in an electronic device includes a base body defining a seal chamber, a heat transfer medium in the seal chamber, and a connecting element. The seal chamber includes interconnected evaporation and condensation portions. The connecting element is coupled to the evaporation portion and a camera module of the electronic device. Heat generated by the camera module is transferred to the evaporation portion via the connecting element, the heat transfer medium turns to gas, and the gas flows into the condensation portion and condenses, dissipating the heat to the outside of the electronic device. The disclosure further provides an electronic device using the heat dissipation structure.
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公开(公告)号:US20210021739A1
公开(公告)日:2021-01-21
申请号:US16536436
申请日:2019-08-09
Applicant: TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.LTD.
Inventor: SHIN-WEN CHEN , JING-WEI LI , SHENG-JIE DING , JIAN-CHAO SONG
Abstract: A lens module includes a circuit board, a photosensitive chip, a filter, and a lens unit. The photosensitive chip is fixed on one surface of the circuit board. The filter faces the photosensitive chip. The lens unit includes a lens holder and a lens. The lens faces the filter. The lens holder is adhered to the circuit board and covers the photosensitive chip and the filter. The filter is fixed to an inner wall of a receiving hole defined in the lens holder.
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公开(公告)号:US20200348509A1
公开(公告)日:2020-11-05
申请号:US16438654
申请日:2019-06-12
Applicant: TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.LTD.
Inventor: SHENG-JIE DING , SHIN-WEN CHEN , JING-WEI LI , JIAN-CHAO SONG , SHUAI-PENG LI
Abstract: A camera module includes a lens base, a lens group, and a switching mechanism. The lens base defines a through hole. The lens group is received within the through hole. The switching mechanism includes a switching base, an optical path conversion member, and a driving member. The switching base is mounted on the lens base and defines a light guide cavity communicating with the through hole. The switching base defines a front aperture and a rear aperture. The front aperture and the rear aperture communicate with the light guide cavity. The optical path conversion member includes a reflective surface. The driving member is mounted within the light guide cavity. The driving member drives the optical light conversion member to rotate to cause the reflective surface to reflect light entering through the front aperture or the rear aperture to the lens group.
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34.
公开(公告)号:US20200218027A1
公开(公告)日:2020-07-09
申请号:US16390134
申请日:2019-04-22
Applicant: TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.LTD.
Inventor: SHIN-WEN CHEN , JIAN-CHAO SONG , SHENG-JIE DING , JING-WEI LI
Abstract: A photosensitive chip includes a photosensitive region, a non-photosensitive region and an adhesive layer. The non-photosensitive region protrudes from a periphery of the photosensitive region to surround the photosensitive region. The adhesive layer covers the non-photosensitive region to absorb light and reduce an intensity of light reflected from the adhesive layer. The disclosure also provides a lens module having the photosensitive chip, and an electronic device having the lens module.
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公开(公告)号:US20200186684A1
公开(公告)日:2020-06-11
申请号:US16547841
申请日:2019-08-22
Applicant: TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.LTD.
Inventor: SHIN-WEN CHEN , SHENG-JIE DING , JING-WEI LI , JIAN-CHAO SONG
Abstract: A circuit board assembly for a twin-camera module to avoid any heat-induced misalignments in manufacture is disclosed, to improve the production yield of the camera module. The circuit board assembly comprises at least two daughter boards and at least one first flexible printed circuit board. Each of the flexible printed circuit boards connects to adjacent two of the daughter boards. The disclosure also provides the twin-camera module comprising the circuit board assembly, and an electronic device comprising the camera module.
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公开(公告)号:US20200014893A1
公开(公告)日:2020-01-09
申请号:US16051125
申请日:2018-07-31
Inventor: JING-WEI LI , SHENG-JIE DING , JIAN-CHAO SONG , SHIN-WEN CHEN
Abstract: An optical projection module with improved heat dissipation efficiency includes a circuit board, a semiconductor substrate mounted on a surface of the circuit board, and a light source and an optical member mounted on a surface of the semiconductor substrate opposite from the circuit board. A hollow area is defined in the circuit board and in the semiconductor substrate to draw heat directly away from the light source and thus avoid physical distortion of the hardware which would otherwise reduce the quality of light beams emitted.
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37.
公开(公告)号:US20230388634A1
公开(公告)日:2023-11-30
申请号:US17897577
申请日:2022-08-29
Applicant: TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.LTD.
Inventor: JIAN-CHAO SONG , DING-NAN HUANG , SHIN-WEN CHEN , KUN LI
CPC classification number: H04N5/23296 , H04N5/2254 , G02B7/09
Abstract: A zoom lens assembly for periscope use which is effectively soundless in operation includes a lens barrel defined with a through hole, a plurality of optical lenses disposed within the through hole, and a focusing member disposed between any two of the plurality of optical lenses. The focusing member in a camera module includes a bottom plate, a cover plate, a piezoelectric element, and a variable transparent body. The variable transparent body is between the bottom plate and the cover plate, the piezoelectric element is disposed on a surface of the cover plate that faces away from the variable transparent body. Electricity fed to the piezoelectric element causes movement of the element which deforms the variable transparent body and changes the focal length of the camera module.
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38.
公开(公告)号:US20230375827A1
公开(公告)日:2023-11-23
申请号:US17865574
申请日:2022-07-15
Applicant: TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.LTD.
Inventor: KUN LI , DING FENG , JIAN-CHAO SONG , WU-TONG WANG
CPC classification number: G02B27/0006 , G03B11/043
Abstract: A dustproof member includes a base plate, a dustproof plate, and a connecting portion. A first through hole is defined by an inner surface of the base plate. A second through hole is defined by an inner surface of the dustproof plate. The connecting portion has a shape of a hollow barrel and defines a hollow cavity. Two opposite ends of the connecting portion are respectively connected to an end of the inner surface of the base plate and an end of the inner surface of the dustproof plate, thereby forming a dust collecting groove between the base plate and the dustproof plate. A camera module having the dustproof member and an electronic device having the camera module are also provided.
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公开(公告)号:US20230126847A1
公开(公告)日:2023-04-27
申请号:US17562303
申请日:2021-12-27
Applicant: TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.LTD.
Inventor: JIAN-CHAO SONG , JING-WEI LI , SHIN-WEN CHEN , YU-SHUAI LI
Abstract: A lens module includes a circuit board and a photosensitive chip. The first rigid portion includes a first through hole. The lens module further includes a metal board. The metal board includes a metal body and a convex box located on one of the surfaces of the metal body. The circuit board is mounted on a surface of the metal board. The convex box is received in the first through hole. The photosensitive chip is mounted on the convex box. The disclosure also provides an electronic device having the lens module.
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40.
公开(公告)号:US20230065258A1
公开(公告)日:2023-03-02
申请号:US17719515
申请日:2022-04-13
Applicant: TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.LTD.
Inventor: YU-SHUAI LI , SHIN-WEN CHEN , JING-WEI LI , JIAN-CHAO SONG
Abstract: A lens base with improved strength and reduced size includes a bracket and a lens holder connected to the bracket. The bracket includes a cover plate and a side plate, the side plate connects to the cover plate to form a receiving groove, the cover plate defines a first aperture, the first aperture penetrates the cover plate. The lens holder faces away from the receiving groove, the lens holder defines a second aperture, the second aperture faces the first aperture.
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