Abstract:
A transparent conductive film. The film comprises a transparent polymer comprising fused latex polymer particles. A plurality of nanowires comprising silver are partially dispersed in the transparent polymer. Devices employing the transparent conductive film and methods of making the devices are also disclosed.
Abstract:
A method of digitally printing a solder mask. The method includes providing a solder mask ink composition including: 1) a resin and 2) a solvent in an amount of at least 20% by weight relative to the total weight of the solder mask ink composition. The composition has a viscosity that is less than 1000 cps at a shear rate of 10 s−1 and a temperature of 25° C. An aerosol stream is generated from the solder mask ink composition with a pneumatic atomizer using an atomization gas. The aerosol stream is directed through a nozzle and focused using a sheath gas onto a substrate while changing the position of the nozzle with respect to the substrate to selectively deposit a solder mask pattern. The solder mask pattern is cured.
Abstract:
Processes for preparing stabilized metal-containing nanoparticles comprising silver and/or a silver alloy composite by reacting a silver compound with a reducing agent comprising a hydrazine compound at a temperature between about 20° C. and about 60° C. The reaction being carried out by incrementally adding the silver compound or a mixture of the silver compound and a stabilizer to a solution comprising the reducing agent, a stabilizer, and a solvent. Conductive ink compositions containing stabilized metal-containing nanoparticles prepared by such processes.
Abstract:
A composition for forming a conductive film. The composition comprises a plurality of nanowires comprising silver; a latex comprising polymer particles; and an aqueous-based carrier.
Abstract:
A process including selecting a printing system; selecting an ink composition having ink properties that match the printing system; depositing the ink composition onto a substrate to form an image, to form deposited features, or a combination thereof; optionally, heating the deposited features to form conductive features on the substrate; and performing a post-printing treatment after depositing the ink composition.
Abstract:
A semiconductor composition includes a semiconducting polymer containing a diketopyrrolopyrrole (DKPP) moiety and carbon nanotubes dispersed into the semiconducting polymer. An electronic device contains a semiconductor layer including a semiconductor composition having a semiconducting polymer including a diketopyrrolopyrrole (DKPP) moiety and carbon nanotubes dispersed into the semiconducting polymer. A semiconductor composition contains a semiconducting polymer including a diketopyrrolopyrrole (DKPP) moiety, a solvent selected from the group consisting of tetrachloroethane, dichlorobenzene, chlorobenzene, chlorotoluene, and a mixture thereof, and a carbon nanotube.
Abstract:
A high silver content nanosilver conductive ink includes at least about 65% weight of silver nanoparticles, a non-polar organic solvent and, a polymer binder. The conductive ink has a has a conductivity of from about 1.0×104 (S/cm) to about 4.0×105 (S/cm). and a viscosity of from about 20 cps to about 1,000 cps.
Abstract:
Processes for purifying diketopyrrolopyrrole (DPP) copolymers are disclosed. An organic phase containing the DPP copolymer is treated with an aqueous ammonia solution and then with a palladium scavenger. The DPP copolymer is then isolated, and has a very low palladium content. The resulting DPP copolymer has high mobility.
Abstract:
An ink composition suitable for ink jet printing, including printing on deformable substrates. In embodiments, the stretchable ink composition is based on a solventless monomer-based ink formulation comprising a mixture of acrylic ester oligomer and monomers of acrylic ester and aromatic acrylate.
Abstract:
A non-catalytic palladium precursor composition is disclosed, including a palladium salt and an organoamine, wherein the composition is substantially free of water. The composition permits the use of solution processing methods to form a palladium layer on a wide variety of substrates, including in a pattern to form circuitry or pathways for electronic devices.