公开(公告)号：US11786223B2

公开(公告)日：2023-10-17

申请号：US17189292

申请日：2021-03-02

Applicant: Hitachi, Ltd.

Inventor： Wataru Sawada ,  Toru Watanabe

IPC: A61B8/00 ,  B06B1/06 ,  H10N30/80 ,  H10N30/87

CPC classification number: A61B8/546 ,  A61B8/4488 ,  B06B1/067 ,  B06B1/0622 ,  H10N30/80 ,  H10N30/875 ,  B06B2201/76

Abstract: An ultrasonic probe has a transduction layer in which a plurality of transducers are placed, a backing layer provided at a rear side of the transduction layer with a wiring layer therebetween, and a plurality of heat dissipation members provided in the backing layer. The plurality of heat dissipation members extend in a line form in the backing layer, and are placed with an aligned direction of extension. An area occupancy percentage of the heat dissipation member at a center region of the backing layer is larger than that at an outer side of the center region. The center region is not positioned at ends of the cross section intersecting the direction of extension of the heat dissipation member, includes a center of gravity of the cross section, and occupies an area less than or equal to a half of an area of the cross section.

公开(公告)号：US11771398B1

公开(公告)日：2023-10-03

申请号：US18074222

申请日：2022-12-02

Applicant: Aronix LLC

Inventor： Arun Narayan Patil ,  Anand Raghunath Bhave ,  Sunanda Narayan Patil ,  Pratibha Narayan Patil

IPC: A61B8/08 ,  A61B8/00 ,  B06B1/02 ,  B06B1/06

CPC classification number: A61B8/0866 ,  A61B8/0883 ,  A61B8/54 ,  A61B8/587 ,  B06B1/0215 ,  B06B1/0633 ,  B06B2201/76

Abstract: The present invention relates to an improved fetal heart rate transducer that overcomes shortcomings of prior transducers in several ways including utilizing an ultra slow-cure epoxy in combination with a piezo-electric disc bonding method to improve ultrasound transmission and reception characteristics, utilizing a slow-cure epoxy in combination with a frontend PCB bonding method to improve transducer reliability, utilizing a metal insert design in combination with molding-in techniques versus press fitting to improve the mechanical stability of the transducer, and utilizing a failsafe LVDS circuit to improve cable error detection and thus improve fetal monitor system reliability. In addition, a method of use of the present invention includes quantitively determining the integrity of each of the piezo-electric disc bonds with the plastic substrate as well as the integrity of the ultrasound field using various height water phantoms that simulate the human body.

公开(公告)号：US20230302300A1

公开(公告)日：2023-09-28

申请号：US18041531

申请日：2021-09-13

Applicant: UNM Rainforest Innovations

Inventor： Nathan Morrow Jackson

IPC: A61B5/00 ,  B06B1/06 ,  A61B5/293 ,  B06B1/02 ,  A61N7/00 ,  B01L3/00

CPC classification number: A61N7/00 ,  A61B5/293 ,  A61B5/4839 ,  B01L3/502715 ,  B06B1/0292 ,  B06B1/0629 ,  B06B1/0666 ,  A61B2562/028 ,  A61B2562/046 ,  A61N2007/0026 ,  A61N2007/0047 ,  A61N2007/0078 ,  B01L2300/0645 ,  B01L2300/0819 ,  B01L2400/0439 ,  B06B2201/76

Abstract: Apparatus, systems, and methods associated with microfabricated ultrasound transducer array for neural stimulation are applicable in a variety of applications. Microfabricated micro-scale ultrasound transducers can be integrated with microelectrode arrays for high spatial stimulation of neurons. Ultrasound stimulation of neurons can be combined with electrical recording to monitor neural activity. Such high spatial stimulation devices can be implemented for in-vitro and in-vivo applications. In-vivo applications can include high frequency ultrasound transducers incorporated into brain probes that are implanted at a specific area in the brain, where the high frequency ultrasound transducer can stimulate neurons at that target location.

公开(公告)号：US11730451B2

公开(公告)日：2023-08-22

申请号：US17155940

申请日：2021-01-22

Applicant: eXo Imaging, Inc.

Inventor： Janusz Bryzek ,  Sandeep Akkaraju ,  Yusuf Haque ,  Joe Adam

IPC: B06B1/06 ,  A61B8/00 ,  H01L23/00 ,  B06B1/02 ,  G01S15/89 ,  B81B7/00

CPC classification number: A61B8/4494 ,  A61B8/4488 ,  B06B1/0215 ,  B06B1/067 ,  B06B1/0622 ,  B06B1/0666 ,  B06B1/0681 ,  B81B7/0058 ,  G01S15/8938 ,  G01S15/8965 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  B06B2201/76 ,  B81B2207/012 ,  B81B2207/053 ,  B81B2207/098 ,  H01L2224/16145 ,  H01L2224/32225 ,  H01L2224/48225 ,  H01L2224/73207 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2924/1461

Abstract: Described are transducer assemblies and imaging devices comprising: a microelectromechanical systems (MEMS) die including a plurality of piezoelectric elements; a complementary metal-oxide-semiconductor (CMOS) die electrically coupled to the MEMS die by a first plurality of bumps and including at least one circuit for controlling the plurality of piezoelectric elements; and a package secured to the CMOS die by an adhesive layer and electrically connected to the CMOS die.

公开(公告)号：US11701688B2

公开(公告)日：2023-07-18

申请号：US16700903

申请日：2019-12-02

Applicant: GE Precision Healthcare LLC

Inventor： Edouard Dacruz ,  Flavien Daloz ,  Jason Barrett

IPC: B06B1/06 ,  B06B1/02 ,  A61B8/00 ,  H10N30/03 ,  H10N30/20

CPC classification number: B06B1/0269 ,  A61B8/4494 ,  B06B1/0607 ,  B06B1/0614 ,  H10N30/03 ,  A61B8/4488 ,  B06B2201/76 ,  H10N30/20

Abstract: Various methods and systems are provided for a multi-frequency transducer array. In one example, the transducer array is fabricated by forming an interdigitated structure from a first comb structure with a first sub-element and a second comb structure with a second sub-element. The interdigitated structure is coupled to a base package, a matching layer, and a backing layer to form a plurality of multi-frequency transducers.

公开(公告)号：US20230191455A1

公开(公告)日：2023-06-22

申请号：US18170349

申请日：2023-02-16

Applicant: GE Precision Healthcare LLC

Inventor： Edouard Dacruz ,  Flavien Daloz ,  Jason Barrett

IPC: B06B1/02 ,  A61B8/00 ,  B06B1/06 ,  H10N30/03

CPC classification number: B06B1/0269 ,  A61B8/4494 ,  B06B1/0607 ,  B06B1/0614 ,  H10N30/03 ,  A61B8/4488 ,  B06B2201/76 ,  H10N30/20

Abstract: An example of a method for a multi-frequency transducer array can include forming a first comb structure with a first sub-element having a first resonance frequency, forming a second comb structure, complementary in geometry to the first comb structure with a second sub-element having a second resonance frequency, combining the first and second comb structures to form an interdigitated structure, forming a third acoustic stack by coupling the interdigitated structure to a base package, and coupling the third acoustic stack to a matching layer block and a backing layer block to form a plurality of multi-frequency transducers.

公开(公告)号：US20230173540A1

公开(公告)日：2023-06-08

申请号：US17924165

申请日：2021-05-07

Applicant: KONINKLIJKE PHILIPS N.V.

Inventor： Antonia Cornelia van Rens ,  Vincent Adrianus Henneken ,  Johan Hendrik Klootwijk

IPC: B06B1/02

CPC classification number: B06B1/0292 ,  B06B2201/76

Abstract: An ultrasound transducer has a control circuit with an array of circuit portions which together define a circuit area. cMUT elements are provided over the top of the control circuit. Vias provide a coupling between each cMUT element and a respective one of the circuit portions beneath. The vias are located at spaces between the cMUT elements and connect to the circuit portion beneath at a position relative to the shape of the circuit portion. The pitch of the array is greater than the pitch of the circuit portions in at least one direction of the array such that in said at least one direction, the cMUT elements extend beyond one or both sides of the circuit rea. This makes tiling easier and enables a modular design.

公开(公告)号：US20230157671A1

公开(公告)日：2023-05-25

申请号：US18095439

申请日：2023-01-10

Applicant: SHENZHEN MINDRAY BIO-MEDICAL ELECTRONICS CO., LTD. ,  RUIJIN HOSPITAL, SCHOOL OF MEDICINE, SHANGHAI JIAOTONG UNIVERSITY

Inventor： Shuangshuang LI ,  Jianqiao Zhou

IPC: A61B8/08 ,  B06B1/02 ,  B06B3/00

CPC classification number: A61B8/485 ,  A61B8/5223 ,  B06B1/0215 ,  B06B3/00 ,  B06B2201/76 ,  A61B8/14

Abstract: The present disclosure relates to an ultrasound elastography system and method. The system may include a transmitting/receiving unit which transmits ultrasound pulses to a target and receives ultrasound echoes from the target to obtain the ultrasound echo signals; an imaging unit which processes the ultrasound echo signals and displays the obtained image; and an analysis unit which detects a region of interest and a shell region selected by an operator in the image, calculate elasticity parameters in a reference region and the shell region respectively, and analyzes the elasticity parameters to obtain an analysis result.

公开(公告)号：US11642695B2

公开(公告)日：2023-05-09

申请号：US16768863

申请日：2018-08-23

Applicant: Hitachi, Ltd.

Inventor： Shuntaro Machida ,  Akifumi Sako ,  Yasuhiro Yoshimura

IPC: B06B1/02 ,  A61B8/00 ,  H01L23/498 ,  H01L23/00

CPC classification number: B06B1/0292 ,  A61B8/4444 ,  A61B8/54 ,  H01L23/4985 ,  H01L24/08 ,  B06B2201/76 ,  H01L2224/16227

Abstract: An ultrasonic probe includes a semiconductor chip in which an ultrasonic transducer is formed and an electrode pad electrically connected to an upper electrode or a lower electrode of the ultrasonic transducer is provided and a flexible substrate in which a bump electrically connected to the electrode pad is provided and the bump is disposed in a portion overlapping with a stepped portion of the semiconductor chip. Further, a height of a connection surface of the electrode pad of the semiconductor chip connected to the bump is lower than a height of a lower surface of the lower electrode.

公开(公告)号：US20190231313A1

公开(公告)日：2019-08-01

申请号：US16336329

申请日：2017-09-28

Applicant: KONINKLIJKE PHILIPS N.V.

Inventor： Princeton Saroha ,  Jeremy Stigall

IPC: A61B8/00 ,  A61B8/12 ,  A61B8/08 ,  B06B1/02 ,  B06B1/06

CPC classification number: A61B8/4494 ,  A61B8/0891 ,  A61B8/12 ,  A61B8/445 ,  A61B8/4477 ,  A61B8/4488 ,  A61B8/54 ,  B06B1/0292 ,  B06B1/0622 ,  B06B1/0633 ,  B06B2201/76 ,  G10K11/004 ,  H05K1/189 ,  H05K2201/10151

Abstract: An intraluminal imaging device includes a flexible elongate member sized and shaped for insertion into a vessel of a patient, the flexible elongate member including a proximal portion and a distal portion; and an imaging assembly disposed at the distal portion of the flexible elongate member, the imaging assembly including a flex circuit disposed in a rolled configuration, the flex circuit comprising a spine member and a plurality of rib members extending from the spine member. Associated devices, systems, and methods are also provided.