Abstract:
A silicon MEMS device can have at least one solder contact formed thereupon. The silicon MEMS device can be configured to be mounted to a circuit board via the solder contact(s). The silicon MEMS device can be configured to be electrically connected to the circuit board via the solder contact(s).
Abstract:
Microelectronic devices may be fabricated while being protected from damage by electrostatic discharge. In one embodiment, a shorting circuit is connected to elements of the microelectronic device, where the microelectronic device is part of a chip-on-glass system. In one aspect of this embodiment, a portion of the shorting circuit is in an area of a substrate where a microchip is bonded. In another embodiment, shorting links of the shorting circuit are comprised of a fusible material, where the fusible material may be disabled by an electrical current capable of fusing the shorting links.
Abstract:
A display apparatus includes a first substrate, a plurality of microelectromechanical systems (MEMS) light modulators formed from a structural material coupled to the first substrate and a second substrate separated from the first substrate. A plurality of spacers extend from the first substrate to keep the second substrate a minimum distance away from the plurality of light modulators. The spacers include a first polymer layer having a surface in contact with the first substrate, a second polymer layer encapsulating the first polymer layer and a layer of the structural material encapsulating the second polymer layer. The spacers can be used as fluid barriers and configured to surround more than one but less than all of the MEMS light modulators in the display apparatus.
Abstract:
A method of fabricating a liquid film is provided. The method comprises the steps of applying hydrophilic liquid onto a substrate with an electrode formed thereunder, covering the hydrophilic liquid with a protection film comprising hydrophobic liquid, dispersing surfactant for reducing the surface tension between the hydrophilic liquid and the protection film, and applying voltage to the hydrophilic liquid and the electrode to wet the substrate with the hydrophilic liquid. With the surfactant and the electro-wetting principle, a contact angle between the hydrophilic liquid and the substrate is controlled. The liquid film having a uniform thickness in nano size is thus formed on the substrate. The protection film prevents the evaporation of the liquid film in the air to thereby secure the stability of the liquid film.
Abstract:
Embodiments of MEMS devices include a movable layer supported by overlying support structures, and may also include underlying support structures. In one embodiment, the residual stresses within the overlying support structures and the movable layer are substantially equal. In another embodiment, the residual stresses within the overlying support structures and the underlying support structures are substantially equal. In certain embodiments, substantially equal residual stresses are be obtained through the use of layers made from the same materials having the same thicknesses. In further embodiments, substantially equal residual stresses are obtained through the use of support structures and/or movable layers which are mirror images of one another.
Abstract:
A laser rangefinder includes a laser emitter for emitting parallel laser beams, a micro electro mechanical system reflector including a plurality of micro reflecting units and configured for reflecting the parallel laser beams toward different points on an object, a micro electro mechanical system photoreceiver configured for receiving the laser beams reflected by and from the different points on the object, a time interval counter configured for recording the time intervals between a first time when the laser emitter emitting the parallel laser beams and second times when the laser beams are received by the micro electro mechanical system photoreceiver, and a processor configured for calculating the distances to the different points of the object based on the time intervals.
Abstract:
A three-dimensional oblique microstructure with press down and engagement mechanisms. A pair of corresponding first lugs is disposed on the both sides of the oblique body, and the bottom part of the oblique body has a first push pad. A pair of corresponding second lugs respectively disposed on the inner sides of the two supports of the α-shaped supporting rack, a second push pad is disposed on the bottom part of the U-shaped supporting rack. Thus, by pressing down the first and the second push pad, the oblique body rotates through the first twist bar and the U-shaped supporting rack rotates through the second twist bar so as to engage the first lugs with the second lugs, such that the three-dimensional microstructures with different angles can be packed to satisfy the needs of varied optical platform applications, and simplify semiconductor fabrication for higher production efficiency and product yield.
Abstract:
Devices, methods, and systems comprising a MEMS device, for example, an interferometric modulator, that comprises a cavity in which a layer coats multiple surfaces. The layer is conformal or non-conformal. In some embodiments, the layer is formed by atomic layer deposition (ALD). Preferably, the layer comprises a dielectric material. In some embodiments, the MEMS device also exhibits improved characteristics, such as improved electrical insulation between moving electrodes, reduced stiction, and/or improved mechanical properties.
Abstract:
A MEMS based alignment technology based on mounting an optical component on a released micromechanical lever configuration that uses multiple flexures rather than a single spring. The optical component may be a lens. The use of multiple flexures may reduce coupling between lens rotation and lens translation, and reduce effects of lever handle warping on lens position. The device can be optimized for various geometries.
Abstract:
A method for sensing the actuation and/or release voltages of a electromechanical system or a microelectromechanical device include applying a varying voltage to the device and sensing its state and different voltage levels. In one embodiment, the device is part of a system comprising an array of interferometric modulators suitable for a display. The method can be used to compensate for temperature dependent changes in display pixel characteristics.