Abstract:
The invention is a curable composition comprising the following component (A) and component (B):Component (A): a curable polysilsesquioxane compound having a repeating unit represented by the following specific formula (a-1): R1—D—SiO3/2 (a-1) Component (B): a silane coupling agent having a nitrogen atom in its molecule, anda method for producing the curable composition, anda cured product obtained by curing the curable composition, anda method for using the curable composition as an adhesive for an optical element-fixing material, anda method for using the curable composition as a sealant for an optical element-fixing material, andan optical device obtained by using the curable composition as an adhesive or a sealant for an optical element-fixing material.One aspect of the curable composition according to one embodiment of the invention can provide a cured product excellent in adhesiveness and heat resistance and having a low refractive index.
Abstract:
The use of an amidine of formula (I) and/or a conversion product thereof as a catalyst for the crosslinking of a composition based on silane group-containing polymers. The amidine of formula (I) and the conversion products thereof are essentially odourless at room temperature and non-volatile and accelerate the crosslinking of the composition very well without impairing the storage stability of the composition, and are very compatible in the composition. As a result, the compositions do not have a tendency to separate, migrate or evaporate the catalyst.
Abstract:
A method for manufacturing a semiconductor device includes: bonding at least a part of the rear surface of a semiconductor wafer, and a supporting substrate in use of using a silane coupling agent; forming a functional structure on a front surface of the semiconductor wafer; placing a condensation point of laser light transmitted through the semiconductor wafer on a bonding interface between the semiconductor wafer and the supporting substrate, and irradiating the bonding interface with the laser light, thereby forming a fracture layer on at least a part of an outer circumferential section of the bonding interface; separating the bonding interface; and carrying out rear surface processing on the rear surface of the semiconductor wafer.
Abstract:
An adhesion promoter that can achieve excellent initial adhesion improvement effects towards various types of substrates, a curable organopolysiloxane composition containing the adhesion promoter, and a protective agent or adhesive composition for electric and electronic components, are provided. The adhesion promoter comprises the following components (A) to (C) in a specific weight ratio: (A) a reaction mixture of an organoalkoxysilane having an amino group and an organoalkoxysilane having an epoxy group; (B) an organic compound having at least two alkoxysilyl groups in a molecule and having a bond other than a silicone-oxygen bond between these silyl groups; and (C) a silane containing an epoxy group or a partially hydrolyzed condensate thereof.
Abstract:
A compound has at least three functionalities, including a first functionality (a) that is a sulfonate group or a sulfate group of the formula —(O)d—SO3M with d=0 or 1 and with M=hydrogen or a monovalent metal cation or a corresponding portion of a multivalent metal cation; a second functionality (b) that is a (meth)acryl residue; and a third functionality (c) that is a carboxylic acid function and/or a thioether group. When the compound is free of silicon, the sulfonate or sulfate group and the (meth)acryl residue are separated from each other by a hydrocarbon-containing residue having a carbon chain. The carbon chain is interrupted by S or NH, or the carbon chain contains a linking group, selected from C(O)NH, NHC(O), NR8C(O), NHC(O)O, NR8C(O)O, NHC(O)NH, C(O)NHC(O) and —C(O)S—, wherein R8 is alkyl or alkenyl or a (meth)acryl group.
Abstract:
The invention relates to a compound, comprising at least three functionalities, that is (a) a sulfonate or sulfate group of the formula —(O)d—SO3M with d=0 or 1 and M=hydrogen or a monovalent metal cation or the corresponding fraction of a polyvalent metal cation, (b) a (meth)acryl group, and (c) either (c1) at least one further (meth)acryl group or an inorganically condensable group, and/or (c2) a further carboxylic acid function, and/or (c3) a function which increases the refractive index of a material produced from the compounds, that is a thioether group, with the proviso that a sulfonate or sulfate group and a (meth)acrylate group are separated from one another in a silicon-free compound via a hydrocarbon-containing group, the carbon chain of which is either interrupted by O, S or NH or contains a linking group.
Abstract:
An article including a first substrate with an adhesive layer disposed thereon, the adhesive layer including a plurality of stripes of a first pressure-sensitive adhesive and of a second pressure-sensitive adhesive, arranged in a generally alternating pattern.
Abstract:
A light-reflective anisotropic conductive adhesive used for anisotropic conductive connection of a light-emitting element to a wiring substrate includes a thermosetting resin composition, conductive particles, and light-reflective insulating particles. The thermosetting resin composition includes a diglycidyl isocyanuryl modified polysiloxane represented by the formula (1), and a curing agent for an epoxy resin.
Abstract:
Heat-activatable siloxane-based adhesive articles include a substrate and a heat-activatable adhesive layer that includes a hot melt processable siloxane-based elastomeric polymer. The siloxane-based elastomeric polymer is a urea-containing segmented copolymer or an oxamide-containing segmented copolymer. The adhesive layers are substantially free of tackifying resins and are non-tacky and non-adhesive until heated to a temperature of at least 50 C. The adhesive layers may be optically clear and may have a microstructured surface.