Abstract:
A harmonics generating device including a supporting substrate; a wavelength conversion layer having a three-dimensional optical waveguide provided with a periodic domain inversion structure therein, a base adhesive layer for adhering a lower face of the wavelength conversion layer to the supporting substrate; an upper-side substrate provided on an upper face side of the wavelength conversion layer; an upper-side adhesive layer for adhering the wavelength conversion layer to the upper-side substrate; an incident face of a fundamental wave, a projection face of higher harmonics, a first side face between the incident face and the projection face; and a second side face opposing the first side face. A first conductive material contacts the first side face, a second conductive material contacts the second side face, and the first and second conductive materials are electrically connected.
Abstract:
A voltage is applied on an interdigitated electrode provided on one main face of a single-domain ferroelectric single crystal substrate to form a periodic domain inversion structure 9. The interdigitated electrode is then removed. The optical waveguide 20 is then formed in the substrate 18. An optical intensity center P1 of the optical waveguide is kept away from a location P0 of the end of the interdigitated electrode.
Abstract:
A polymer well may be formed over a thermal oxide formed over a semiconductor substrate in one embodiment. The well may include a waveguide and a pair of heaters adjacent the waveguide. Each heater may be mounted on a platform of insulating material to reduce heat loss through the substrate and the thermal oxide, in one embodiment.
Abstract:
Compact optical devices and methods of constructing the same are disclosed. The optical devices are formed with perpendicular orientations to the surface of a supporting layer (e.g., substrate), and have three-dimensional structures rather than planar structures. The optical devices can be formed with high density on supporting layers without the need for several built-up layers. Maintaining the processing temperatures within the cure profiles of polymer optical layers is readily achieved.
Abstract:
A polymer well may be formed over a thermal oxide formed over a semiconductor substrate in one embodiment. The well may include a waveguide and a pair of heaters adjacent the waveguide. Each heater may be mounted on a platform of insulating material to reduce heat loss through the substrate and the thermal oxide, in one embodiment.
Abstract:
A multilayer semiconductor portion is provided on a semiconductor substrate on side faces of a semiconductor portion. A second conductive type III-V compound semiconductor layer is provided on the semiconductor portion and the multilayer semiconductor portion. The multilayer semiconductor portion has first to fourth semiconductor layers sequentially arranged on the semiconductor substrate. The first semiconductor layer is a first conductive type III-V compound semiconductor layer extending along the side face of the semiconductor portion and a principal surface of the semiconductor substrate. The second semiconductor layer is a second conductive type III-V group compound semiconductor layer extending along the first semiconductor layer. The third semiconductor layer is a first conductive type III-V compound semiconductor layer extending along the second semiconductor layer. The fourth semiconductor layer is a second conductive type III-V compound semiconductor layer provided on the third semiconductor layer.
Abstract:
A light source that includes first and second waveguides and a passive resonator for coupling light between the waveguides. The waveguides include a gain region for amplifying light of a desired wavelength, a transparent region, and an absorption region. The passive resonator couples light of the desired wavelength between the first and second transparent regions of the first and second waveguides and has a resonance at that wavelength. The resonator is preferably a microdisk resonator. The index of refraction of the microdisk resonator can be altered to select the desired wavelength. A second microdisk resonator having a different radius may be incorporated to increase the tuning range of the light source. The resonator is preferably constructed over the waveguides with an air gap between the resonator and the substrate in which the waveguides are constructed.
Abstract:
A band discontinuity reduction layer having a band gap energy larger than that of that of an MQW (multiple quantum well) absorption layer and smaller than that of a p-InP clad layer is provided between the MQW absorption layer and the p-InP clad layer. In addition, a band discontinuity reduction layer having a band gap energy larger than that of the MQW absorption layer and smaller than that of an n-InP clad layer is provided between the MQW absorption layer and the n-InP clad layer. Consequently, as a pile-up of carriers is suppressed, a semiconductor light modulator with an enhanced response speed can be obtained.
Abstract:
A waveguide optical semiconductor device, a method of fabricating the same and an optical device module. The semiconductor device includes a substrate, a waveguide formed on the substrate, an electrode layer formed on the waveguide, and bumpers formed on the substrate. The bumpers are disposed on both side of the waveguide, and top surfaces of the bumpers are higher than a top surface of the electrode layer. The method of fabrication includes forming semiconductor layers for waveguide on a substrate, forming another semiconductor layer on the semiconductor layers, removing the another semiconductor layer and at least a part of the semiconductor layers selectively so that grooves are formed on both side of a region where the waveguide are expected to be formed, removing the another semiconductor layer at the region, remained portions of the another semiconductor layer form bumpers. The module includes a waveguide optical semiconductor device having bumpers disposed on both side of the waveguide, and a carrier having a mounting region in contact with the top surfaces of the bumpers.
Abstract:
A light modulator having a reduced parasitic static capacitance includes a semiconductor substrate having a mesa section and a bonding pad section. A primary insulating film on the substrate continuously covers the mesa section and the bonding pad section. After a mask has been formed on a portion of the primary insulating film opposite the bonding pad section, the remaining portion of the primary insulating film is etched, followed by removal of the mask. After the removal of the mask, a second insulating film is formed continuously covering the primary insulating film opposite the bonding pad section and the mesa section so that a relatively thick insulating layer is present only opposite the bonding pad section.