Abstract:
A scanning exposure apparatus using microlens arrays, includes a plurality of microlens arrays is arrayed in a direction perpendicular to a scanning direction above a substrate to be exposed, and the microlens arrays are supported on a support substrate. The microlens arrays can be supported on a support substrate so as to be capable of being inclined from a direction parallel to the exposure substrate, relative to the direction in which the microlens arrays are arranged. The inclination angles of these microlens arrays are configured so as to gradually increase or decrease along the arrangement direction.
Abstract:
A method for producing surface convexes or concaves disposes a mask member having light transmitting sections and non-light transmitting sections over and spaced from one side of a photosensitive film including a photosensitive resin composition, and a light diffusing member is disposed on the opposite side of the photosensitive film across the mask member. Light is irradiated from a light source disposed on the opposite side of the mask member across the light diffusing member to subject the photosensitive film to light exposure through the light diffusing member and the light transmitting sections of the mask member. Exposed portions or unexposed portions of the photosensitive film are removed by development to produce convexes or concaves on the photosensitive film in shapes determined by shapes of the exposed portions or unexposed portions. In exposure, conditions such as haze of the light diffusing member are controlled to control the shapes of the exposed portions or unexposed portions.
Abstract:
The disclosed method for producing a microstructure can form a complicated three-dimensionally formed microstructure with few steps.A first mask pattern (22) containing a light transmitting section and a light blocking section is disposed along an unexposed photosensitive resin (42), and a second mask pattern (32) containing a light transmitting section and a light blocking section is disposed on the reverse side of the first mask pattern (22) from the photosensitive resin (42). Additionally, by means of integrally rotating the photosensitive resin (42) and the first mask pattern (22) around a central axis (Z) that passes through the photosensitive resin (42) and the first mask pattern (22), and at the same time radiating exposure light from the reverse side of the second mask pattern (32) from the photosensitive resin (42) and the first mask pattern (22) in a direction that is inclined obliquely with respect to the direction of the central axis (Z), the light beam of the exposure light that is transmitted through the light transmitting section of the second mask pattern (32) and the light transmitting section of the first mask pattern (22) exposes the photosensitive resin (42).
Abstract:
The disclosure relates to an optical arrangement for three-dimensionally patterning a radiation-sensitive material layer, such as a projection exposure apparatus for microlithography. The optical arrangement includes a mask for forming a three-dimensional radiation pattern, a substrate with the radiation-sensitive material layer, and a projection optical unit for imaging the three-dimensional radiation pattern from the mask into the radiation-sensitive material layer. The optical arrangement is designed to compensate for spherical aberrations along the thickness direction of the radiation-sensitive material layer in order to generate a stigmatic image of the three-dimensional radiation pattern.
Abstract:
The present invention relates to polymer patterns of various shapes formed using modifications of means and methods used in the prior lithography process, and the metal film patterns, metal patterns and plastic molds using the polymer patterns, as well as methods of forming these patterns and molds. The method of forming the polymer patterns comprises the steps of: (a) depositing a photosensitive polymer on the substrate to form a polymer film; (b) placing a photomask on the polymer film; and (c) irradiating the polymer film with a light moving in random direction through the photomask, so as to form at least one pattern which is concave from the surface of the polymer film in a direction perpendicular to the substrate and extends in a direction parallel to the substrate. The inventive polymer patterns have at least one pattern which is concave from the surface of the polymer film in a direction perpendicular to the substrate and extends in a direction parallel to the substrate. The vertical cross-section of the concave patterns has at least one curved surface.
Abstract:
An exposure system is provided for illuminating a fine pattern that may have features extending along orthogonal first and second linear directions. An illumination source may be provided having decreased intensity portions at a center and defined along the first and second directions.
Abstract:
An apparatus, a method, and a plate made by the method, e.g., using the apparatus. The apparatus includes a light tunnel of light reflective walls with polygonal cross-section like a kaleidoscope, and a light source, located at one end to produce light radiation to the inside of the light tunnel towards the other end. Light entering the light tunnel towards an inner reflective surface of a wall is reflected off the inner reflective surface so that it can emerge from the other end to cure a plate having photo-curable material thereon.
Abstract:
Container structures for use in integrated circuits and methods of their manufacture without the use of mechanical planarization such as chemical-mechanical planarization (CMP), thus eliminating CMP-induced defects and variations. The methods utilize localized masking of holes for protection of the inside of the holes during non-mechanical removal of exposed surface layers. The localized masking is accomplished through differential exposure of a resist layer to electromagnetic or thermal energy. The container structures are adapted for use in memory cells and apparatus incorporating such memory cells, as well as other integrated circuits.
Abstract:
A method and system of creating one or more waveguides and/or patterning these waveguides to form a 3D microstructure that uses mask and collimated light. In one embodiment, the system includes at least one collimated light source selected to produce a collimated light beam; a reservoir having a photo-monomer adapted to polymerize by the collimated light beam; and a mask having at least one aperture and positioned between the at least one collimated light source and the reservoir. Here, the at least one aperture is adapted to guide a portion of the collimated light beam into the photo-monomer to form the at least one polymer waveguide through a portion of a volume of the photo-monomer.
Abstract:
A method for forming an arbitrary pattern of sub-micron contact holes in a substrate using a combination of interferometric photolithography and optical photolithography with a non-critical mask. The substrate is covered with a photosensitive material and is exposed by a standing wave interference pattern produced by the superposition of two coherent laser beams. Then the substrate is rotated through 90° and exposed by the same pattern. The double exposure produces a regular array of sub-micron unexposed regions which are all potentially holes if developed. The photosensitive material is then covered by a non-critical photomask and a standard light source is used to exposed those areas of the photosensitive material containing unwanted holes. Upon final development, the desired pattern is obtained.