NEGATIVE DIFFERENTIAL RESISTANCE DEVICE

    公开(公告)号:US20130307662A1

    公开(公告)日:2013-11-21

    申请号:US13982672

    申请日:2011-02-01

    CPC classification number: H01C7/10 H01C7/041 H01C7/043 H01L27/26 H01L47/00

    Abstract: Apparatus and methods related to negative differential resistance (NDR) are provided. An NDR device includes a spaced pair of electrodes and at least two different materials disposed there between. One of the two materials is characterized by negative thermal expansion, while the other material is characterized by positive thermal expansion. The two materials are further characterized by distinct electrical resistivities. The NDR device is characterized by a non-linear electrical resistance curve that includes a negative differential resistance range. The NDR device operates along the curve in accordance with an applied voltage across the pair of electrodes.

    SEMICONDUCTOR CERAMIC AND RESISTIVE ELEMENT
    33.
    发明申请
    SEMICONDUCTOR CERAMIC AND RESISTIVE ELEMENT 有权
    半导体陶瓷和电阻元件

    公开(公告)号:US20130221475A1

    公开(公告)日:2013-08-29

    申请号:US13856456

    申请日:2013-04-04

    Inventor: Sakyo Hirose

    CPC classification number: H01L29/66 H01C7/04 H01C7/043

    Abstract: Provided is a resistive element which has excellent inrush current resistance, and can suppress heat generation in a steady state. The resistive element has an element main body of a semiconductor ceramic in which the main constituent has a structure of R11-xR2xBaMn2O6 in which 0.05≦x≦1.0 when R1 is Nd and R2 is at least one of Sm, Eu and Gd; 0.05≦x≦0.8 when R1 is Nd and R2 is at least one of Tb, Dy, Ho, Er, and Y; 0≦x≦0.4 when R1 is at least one of Sm, Eu, and Gd and R2 is at least one of Tb, Dy, Ho, and Y; and 0≦x≦1.0 when R1 is at least one of Sm, Eu, and Gd and R2 is at least one of Sm, Eu, and Gd, but the Sm, Eu, and/or Gd in R1 is different from that in R2.

    Abstract translation: 提供了具有优异的涌流电流阻力的电阻元件,并且可以抑制稳定状态下的发热。 电阻元件具有半导体陶瓷的元件主体,其中主要成分具有R11-xR2xBaMn2O6的结构,其中当R1是Nd时为0.05 @ x @ 1.0,R2为Sm,Eu和Gd中的至少一种; 0.05≤x≤0.8,当R 1是Nd时,R 2是Tb,Dy,Ho,Er和Y中的至少一种; 当R1是Sm,Eu和Gd中的至少一种时,0≤x≤0.4,R2是Tb,Dy,Ho和Y中的至少一种; 当R1是Sm,Eu和Gd中的至少一种时,0 @ x @ 1.0,R2是Sm,Eu和Gd中的至少一种,但是R1中的Sm,Eu和/或Gd不同于 R2。

    CHIP THERMISTOR AND METHOD OF MANUFACTURING SAME
    34.
    发明申请
    CHIP THERMISTOR AND METHOD OF MANUFACTURING SAME 有权
    芯片热敏电阻及其制造方法

    公开(公告)号:US20130088319A1

    公开(公告)日:2013-04-11

    申请号:US13805043

    申请日:2011-06-21

    Abstract: A chip thermistor has a thermistor portion including a ceramic material containing respective metal oxides of Mn, Ni, and Co as major ingredients; a pair of composite portions including a composite material of Ag—Pd, and respective metal oxides of Mn, Ni, and Co and arranged on both sides of the thermistor portion so as to sandwich in the thermistor portion between the composite portions; and external electrodes connected to the pair of composite portions, respectively. In this manner, the pair of composite portions are used as bulk electrodes and, for this reason, the resistance of the chip thermistor can be adjusted mainly with consideration to the resistance in the thermistor portion without need for much consideration to the distance between the external electrodes and other factors.

    Abstract translation: 片式热敏电阻具有热敏电阻部分,该热敏电阻部分包括以Mn,Ni和Co为主要成分的各自的金属氧化物的陶瓷材料; 一对复合部分,包括Ag-Pd的复合材料和Mn,Ni和Co的各自的金属氧化物,并且布置在热敏电阻部分的两侧,以夹在复合部分之间的热敏电阻部分; 以及分别连接到该对复合部分的外部电极。 以这种方式,一对复合部分被用作体电极,因此,可以主要考虑到热敏电阻部分中的电阻来调节芯片热敏电阻的电阻,而不需要考虑外部的距离 电极等因素。

    SEMI-CONDUCTIVE CERAMIC MATERIAL AND NTC THERMISTOR USING THE SAME
    37.
    发明申请
    SEMI-CONDUCTIVE CERAMIC MATERIAL AND NTC THERMISTOR USING THE SAME 有权
    半导体陶瓷材料和使用相同的NTC热敏电阻

    公开(公告)号:US20100134237A1

    公开(公告)日:2010-06-03

    申请号:US12707049

    申请日:2010-02-17

    Applicant: Tadamasa MIURA

    Inventor: Tadamasa MIURA

    Abstract: A NTC thermistor which has superior linearity of resistance-temperature characteristic is provided without depending on a combination of two or more kinds of material but with a single semi-conductive ceramic material. As the semi-conductive ceramic material of negative resistance-temperature characteristic is a ceramic body constituting a NTC thermistor being an oxide expressed by the formula AMnyOz in which y is 0.8 to 1.6, A is a combination of rare earth element and barium and the content of barium in A is 60 to 75 mol % when y=0.8 to 1.5, and 50 to 63 mol % y=1.7 to 2.3, and z is a value which maintains the electric neutrality of the oxide. A preferable oxide is of the formula (La1-αBaα)MnyOz in which when y=0.8 to 1.5, 0.60≦α≦0.75, and when y=1.7 to 2.3, 0.50≦α≦0.63.

    Abstract translation: 提供具有优异的电阻温度特性线性的NTC热敏电阻,而不依赖于两种或更多种材料的组合,而是与单个半导体陶瓷材料组合。 由于负电阻温度特性的半导体陶瓷材料是构成NTC热敏电阻的陶瓷体,其是由式为AmnyOz(其中y为0.8至1.6)表示的氧化物,A是稀土元素和钡的组合,并且含量 当y = 0.8〜1.5,50〜63摩尔%y = 1.7〜2.3时,A中的钡为60〜75摩尔%,z为维持氧化物电中性的值。 优选的氧化物具有式(La1-αBaα)MnyOz,其中当y = 0.8至1.5,0.60< lE;α≦̸ 0.75时,当y = 1.7至2.3,0.50< lE;α≦̸ 0.63时。

    Method for the manufacture of electrical component
    38.
    发明授权
    Method for the manufacture of electrical component 有权
    电气元件制造方法

    公开(公告)号:US07524337B2

    公开(公告)日:2009-04-28

    申请号:US11697844

    申请日:2007-04-09

    Inventor: Friedrich Rosc

    Abstract: An electrical component having a base body includes a layer stack of mutually overlapping, electrically conductive electrode layers that are separated from one another by electrically conductive ceramic layers. The electrically conductive ceramic layers are composed of a ceramic whose specific electrical resistance exhibits a negative temperature coefficient. The electrically conductive ceramic layers are produced of ceramic green films that are sintered in common with the electrode layers, and outside electrodes that are electrically conductively connected to the electrode layers are arranged at two opposite outside surfaces of the base body. A method for the manufacture of the component and to the employment of the component is also provided.

    Abstract translation: 具有基体的电气部件包括通过导电陶瓷层彼此分离的相互重叠的导电电极层的层叠体。 导电陶瓷层由比电阻呈现负温度系数的陶瓷构成。 导电陶瓷层由与电极层共同烧结的陶瓷绿色膜制成,与电极层导电连接的外部电极配置在基体的两个相对的外表面。 还提供了用于制造部件和使用部件的方法。

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