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公开(公告)号：US08896410B2
公开(公告)日：2014-11-25
申请号：US13805043
申请日：2011-06-21
Applicant: Yo Saito , Kouki Yamada , Daisuke Tsuchida
Inventor： Yo Saito , Kouki Yamada , Daisuke Tsuchida
CPC classification number: H01C7/008 , H01C1/1413 , H01C7/023 , H01C7/04 , H01C7/043 , H01C17/00 , H01C17/006 , Y10T29/49085
Abstract: A chip thermistor has a thermistor portion including a ceramic material containing respective metal oxides of Mn, Ni, and Co as major ingredients; a pair of composite portions including a composite material of Ag—Pd, and respective metal oxides of Mn, Ni, and Co and arranged on both sides of the thermistor portion so as to sandwich in the thermistor portion between the composite portions; and external electrodes connected to the pair of composite portions, respectively. In this manner, the pair of composite portions are used as bulk electrodes and, for this reason, the resistance of the chip thermistor can be adjusted mainly with consideration to the resistance in the thermistor portion without need for much consideration to the distance between the external electrodes and other factors.
Abstract translation: 片式热敏电阻具有热敏电阻部分，该热敏电阻部分包括以Mn，Ni和Co为主要成分的各自的金属氧化物的陶瓷材料; 一对复合部分，包括Ag-Pd的复合材料和Mn，Ni和Co的各自的金属氧化物，并且布置在热敏电阻部分的两侧，以夹在复合部分之间的热敏电阻部分; 以及分别连接到该对复合部分的外部电极。 以这种方式，一对复合部分被用作体电极，因此，可以主要考虑到热敏电阻部分中的电阻来调节芯片热敏电阻的电阻，而不需要考虑外部的距离 电极等因素。
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公开(公告)号：US20130088319A1
公开(公告)日：2013-04-11
申请号：US13805043
申请日：2011-06-21
Applicant: Yo Saito , Kouki Yamada , Daisuke Tsuchida
Inventor： Yo Saito , Kouki Yamada , Daisuke Tsuchida
CPC classification number: H01C7/008 , H01C1/1413 , H01C7/023 , H01C7/04 , H01C7/043 , H01C17/00 , H01C17/006 , Y10T29/49085
Abstract: A chip thermistor has a thermistor portion including a ceramic material containing respective metal oxides of Mn, Ni, and Co as major ingredients; a pair of composite portions including a composite material of Ag—Pd, and respective metal oxides of Mn, Ni, and Co and arranged on both sides of the thermistor portion so as to sandwich in the thermistor portion between the composite portions; and external electrodes connected to the pair of composite portions, respectively. In this manner, the pair of composite portions are used as bulk electrodes and, for this reason, the resistance of the chip thermistor can be adjusted mainly with consideration to the resistance in the thermistor portion without need for much consideration to the distance between the external electrodes and other factors.
Abstract translation: 片式热敏电阻具有热敏电阻部分，该热敏电阻部分包括以Mn，Ni和Co为主要成分的各自的金属氧化物的陶瓷材料; 一对复合部分，包括Ag-Pd的复合材料和Mn，Ni和Co的各自的金属氧化物，并且布置在热敏电阻部分的两侧，以夹在复合部分之间的热敏电阻部分; 以及分别连接到该对复合部分的外部电极。 以这种方式，一对复合部分被用作体电极，因此，可以主要考虑到热敏电阻部分中的电阻来调节芯片热敏电阻的电阻，而不需要考虑外部的距离 电极等因素。
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