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    Radio frequency (RF) power coupling system utilizing multiple RF power coupling elements for control of plasma properties
    39.
    发明授权
    Radio frequency (RF) power coupling system utilizing multiple RF power coupling elements for control of plasma properties 有权
    射频（RF）功率耦合系统利用多个RF功率耦合元件来控制等离子体性质

    公开(公告)号：US09396900B2

    公开(公告)日：2016-07-19

    申请号：US13676265

    申请日：2012-11-14

    Applicant: Tokyo Electron Limited

    Inventor： Barton Lane ,  Lee Chen ,  Peter L. G. Ventzek ,  Merritt Funk ,  Jianping Zhao ,  Radha Sundararajan

    IPC: H01J7/24 ,  H05B31/26 ,  H01J1/00 ,  H01J37/32 ,  H05H1/46

    CPC classification number: H01J1/00 ,  H01J37/32082 ,  H01J37/32091 ,  H01J37/321 ,  H01J37/32174 ,  H05H1/46 ,  H05H2001/4652 ,  H05H2001/4675

    Abstract: A radio frequency (RF) power coupling system is provided. The system has an RF electrode configured to couple RF power to plasma in a plasma processing system, multiple power coupling elements configured to electrically couple RF power at multiple power coupling locations on the RF electrode, and an RF power system coupled to the multiple power coupling elements, and configured to couple an RF power signal to each of the multiple power coupling elements. The multiple power coupling elements include a center element located at the center of the RF electrode and peripheral elements located off-center from the center of the RF electrode. A first peripheral RF power signal differs from a second peripheral RF power signal in phase.

    Abstract translation: 提供射频（RF）功率耦合系统。 该系统具有被配置为在等离子体处理系统中将RF功率耦合到等离子体的RF电极，多个功率耦合元件被配置为在RF电极上的多个功率耦合位置处电耦合RF功率，以及耦合到多功率耦合的RF功率系统 元件，并且被配置为将RF功率信号耦合到多个功率耦合元件中的每一个。 多个功率耦合元件包括位于RF电极中心的中心元件和位于RF电极中心偏离中心的外围元件。 第一外围RF功率信号与第二外围RF功率信号同相不同。

    Systems and methods for distributing power to integrated circuit dies
    40.
    发明授权
    Systems and methods for distributing power to integrated circuit dies 有权
    向集成电路管芯供电的系统和方法

    公开(公告)号：US09208982B2

    公开(公告)日：2015-12-08

    申请号：US13716013

    申请日：2012-12-14

    Applicant: BROADCOM CORPORATION

    Inventor： Ahmadreza Rofougaran

    IPC: H01J1/00 ,  H01L23/58 ,  H01F27/42 ,  H01F38/14 ,  H02J5/00 ,  H05K1/02

    CPC classification number: H01J1/00 ,  H01F38/14 ,  H01L23/48 ,  H01L23/5227 ,  H01L23/5286 ,  H01L23/5382 ,  H01L23/58 ,  H01L23/645 ,  H01L25/0655 ,  H01L2924/0002 ,  H02J1/00 ,  H02J5/00 ,  H02J5/005 ,  H05K1/0262 ,  H01L2924/0001 ,  H01L2924/00

    Abstract: Systems and methods for distributing power to a plurality of integrated circuit dies are provided. In some aspects, a system includes a substrate and a plurality of integrated circuit dies disposed on the substrate. Each of the plurality of integrated circuit dies includes a circuit and a target inductive element coupled to the circuit. The system also includes a power supply module configured to generate a source power signal. The system also includes at least one source inductive element configured to electromagnetically couple the source power signal to one or more of the plurality of the target inductive elements to generate one or more target power signals that supply power to one or more corresponding circuits.

    Abstract translation: 提供了将功率分配给多个集成电路管芯的系统和方法。 在一些方面，系统包括衬底和设置在衬底上的多个集成电路管芯。 多个集成电路管芯中的每一个包括耦合到电路的电路和目标感应元件。 该系统还包括被配置为产生源功率信号的电源模块。 该系统还包括至少一个源电感元件，其被配置为将源功率信号电磁耦合到多个目标感应元件中的一个或多个，以产生向一个或多个相应电路供电的一个或多个目标功率信号。

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