公开(公告)号：US09206308B2

公开(公告)日：2015-12-08

申请号：US13637629

申请日：2011-03-22

Applicant: Tomoaki Iwami ,  Masaaki Matsumoto ,  Tomoyuki Abe ,  Tatsuo Yonemoto ,  Hiroaki Fujiwara

Inventor： Tomoaki Iwami ,  Masaaki Matsumoto ,  Tomoyuki Abe ,  Tatsuo Yonemoto ,  Hiroaki Fujiwara

IPC: H05K1/03 ,  B32B27/04 ,  B32B27/20 ,  B32B27/26 ,  B32B27/38 ,  C08K3/10 ,  C08K3/22 ,  C08L63/00 ,  C08G59/22 ,  C08G59/30 ,  C08G59/38 ,  C08G59/62 ,  C08G59/40 ,  C08J5/24 ,  C08K9/02 ,  C08K5/5313 ,  C08K5/5397

CPC classification number: C08L63/00 ,  C08G59/4021 ,  C08G59/621 ,  C08J5/24 ,  C08J2363/00 ,  C08K3/10 ,  C08K3/22 ,  C08K5/5313 ,  C08K5/5397 ,  C08K9/02 ,  H05K1/0326 ,  H05K1/0353 ,  H05K1/0366 ,  H05K1/0373 ,  H05K2201/012 ,  H05K2201/0209 ,  H05K2201/0227 ,  H05K2201/0263

Abstract: The problem to be solved by the invention is to provide an epoxy resin composition for a prepreg, which is used in the manufacture of a printed circuit board containing a multilayer printed circuit board, wherein the epoxy resin composition for a prepreg is characterized by containing as essential components, a phosphorus compound that has 1.8 or more and less than 3 on average of a phenolic hydroxyl group that is reactive to an epoxy resin in the molecule, and that has 0.8 or more on average of a phosphorus element; a bifunctional epoxy resin that has 1.8 or more and less than 2.6 on average of epoxy groups in the molecule; a multi-functional epoxy resin that contains 2.8 or more on average of epoxy groups in one molecule; a hardening agent; an inorganic filler; and a molybdenum compound, wherein the epoxy resin composition for a prepreg is obtained by blending a pre-reacted epoxy resin, which is obtained by reacting at least the phosphorus compound with the bifunctional epoxy resin and the multi-functional epoxy resin, or the bifunctional epoxy resin only in advance, the bifunctional epoxy resin or the multi-functional epoxy resin, the hardening agent, the inorganic filler, and the molybdenum compound, which is excellent in flame retardance, heat resistance, thermal stiffness, and excellent in hole position accuracy without the production of a harmful substance at the time of combustion, a prepreg using the epoxy resin composition for a prepreg, and a multilayer printed circuit board using the prepreg.

Abstract translation: 本发明要解决的问题是提供一种用于预浸料的环氧树脂组合物，其用于制造含有多层印刷电路板的印刷电路板，其中预浸料的环氧树脂组合物的特征在于含有 必要成分，平均分子中与环氧树脂反应的酚羟基平均为1.8以上且小于3的磷化合物，平均为磷成分为0.8以上的磷化合物; 分子中环氧基团平均为1.8以上且小于2.6的双官能环氧树脂; 在一个分子中含有2.8个或更多个平均环氧基的多官能环氧树脂; 硬化剂; 无机填料; 和钼化合物，其中预浸料用环氧树脂组合物通过将至少使磷化合物与双官能环氧树脂和多官能环氧树脂反应获得的预反应环氧树脂或双官能团 环氧树脂仅提前，双功能环氧树脂或多功能环氧树脂，硬化剂，无机填料和钼化合物，其阻燃性，耐热性，热刚度优异，孔位精度优异 在燃烧时不产生有害物质，使用该预浸料坯用环氧树脂组合物的预浸料坯和使用该预浸料坯的多层印刷电路板。

公开(公告)号：US20150307703A1

公开(公告)日：2015-10-29

申请号：US14652065

申请日：2013-02-07

Applicant: SHENGYI TECHNOLOGY CO., LTD.

Inventor： Yueshan HE ,  Shiguo SU

IPC: C08L63/00 ,  H05K1/03 ,  C08L71/00

CPC classification number: C08L63/00 ,  B32B15/092 ,  B32B15/16 ,  B32B27/20 ,  B32B2260/025 ,  B32B2260/046 ,  B32B2264/102 ,  B32B2264/104 ,  B32B2307/306 ,  B32B2457/08 ,  C08G59/50 ,  C08G59/621 ,  C08J5/24 ,  C08J2361/06 ,  C08J2363/00 ,  C08K5/357 ,  C08K5/5399 ,  C08L61/06 ,  C08L71/00 ,  H05K1/0353 ,  H05K1/0366 ,  H05K1/0373 ,  H05K3/022 ,  H05K2201/012 ,  H05K2201/0209 ,  C08L79/04 ,  C08L85/02

Abstract: The present invention relates to a halogen-free flame retardant resin composition, according to parts by weight, the resin composition comprises: (A) a mixture of phenoxyphosphazene compound (A1) and compound (A2) having a dihydrobenzoxazine ring, the mixture comprising 45-90 parts by weight, and the weight ratio of the phenoxyphosphazene compound (A1) and the compound (A2) having a dihydrobenzoxazine ring is between 1:25-1:2; (B) an epoxy resin with epoxy equivalent of 500-2000, the epoxy resin comprising 10-45 parts by weight; (C) a phenolic resin comprising 10-25 parts by weight; and (D) an amine curing agent comprising 0.5-10 parts by weight. The prepreg, laminate, and metal-clad laminate for the printed circuit prepared using the halogen-free flame retardant resin composition, have the advantages of high glass transition temperature (Tg), high thermal resistance, low dielectric dissipation factor, low water absorption as well as a low C.T.E.

Abstract translation: 本发明涉及无卤阻燃树脂组合物，根据重量份，树脂组合物包含：（A）具有二氢苯并恶嗪环的苯氧基磷腈化合物（A1）和化合物（A2）的混合物，该混合物包含45 -90重量份，苯氧基磷腈化合物（A1）和具有二氢苯并恶嗪环的化合物（A2）的重量比为1:25-1:2; （B）环氧当量为500-2000的环氧树脂，环氧树脂包含10-45重量份; （C）含有10-25重量份的酚醛树脂; 和（D）包含0.5-10重量份的胺固化剂。 使用无卤阻燃树脂组合物制备的印刷电路用预浸料，层压板和覆金属层压板具有玻璃化转变温度（Tg）高，耐热性高，介电损耗因数低，吸水率低等优点 以及低CTE

公开(公告)号：US20150189740A1

公开(公告)日：2015-07-02

申请号：US14414839

申请日：2013-07-18

Applicant: Kaneka Corporation

Inventor： Masayoshi Kido ,  Yoshihide Sekito

IPC: H05K1/02 ,  H05K1/03

CPC classification number: H05K1/0281 ,  C08K3/22 ,  C09D5/004 ,  C09D7/61 ,  H05K1/0274 ,  H05K1/0373 ,  H05K2201/012 ,  H05K2201/2054

Abstract: The present invention provides a stiffener-integrated flexible printed circuit board that has excellent electrical insulation reliability and that prevents the stiffener from being detached during a reflow process. The stiffener-integrated flexible printed circuit board including: (A) a stiffener, (B) a thermosetting adhesive, (C) an insulator film, and (D) a wiring-pattern-equipped film, (A) the stiffener, (B) the thermosetting adhesive, (C) the insulator film, and (D) the wiring-pattern-equipped film being laminated in this order, (C) the insulator film containing at least (a) a binder polymer and (b) a black coloring agent having a reflective range within the infrared range.

Abstract translation: 本发明提供一种具有优异的电绝缘可靠性并且防止在回流过程中加强件脱离的加强件集成柔性印刷电路板。 所述加强件集成柔性印刷电路板包括：（A）加强件，（B）热固性粘合剂，（C）绝缘膜，（D）配线图案膜，（A）所述加强件，（B ）热固性粘合剂，（C）绝缘体膜，和（D）依次层叠配线图案的膜，（C）至少含有（a）粘合剂聚合物的绝缘膜和（b）黑色 着色剂具有在红外范围内的反射范围。

公开(公告)号：US08993897B2

公开(公告)日：2015-03-31

申请号：US14113541

申请日：2012-04-24

Applicant: Yoshihide Sekito

Inventor： Yoshihide Sekito

IPC: H04K1/00 ,  C08F290/06 ,  C09D5/18 ,  G03F7/033 ,  G03F7/035 ,  G03F7/037 ,  G03F7/038 ,  H05K1/03 ,  H05K3/28

CPC classification number: G03F7/035 ,  C08F290/067 ,  C09D5/18 ,  G03F7/033 ,  G03F7/037 ,  G03F7/038 ,  G03F7/0388 ,  H05K1/0373 ,  H05K3/287 ,  H05K2201/012 ,  Y10T428/24355 ,  Y10T428/25 ,  Y10T428/259

Abstract: The photosensitive resin composition contains a (A) binder polymer, (B) cross-linked polymer particles, (C) thermosetting resin, (D) photo-polymerization initiator, and a (E) phosphoric flame retardant, in which a content of the (B) cross-linked polymer particles is 30 parts by weight to 100 parts by weight with respect to the 100 parts by weight of the (A) binder polymer, and an average particle diameter of the (B) cross-linked polymer particles is 1 μm to 10 μm. Therefore, the photosensitive resin composition (i) obtains an excellent tack-free property after being applied and dried, (ii) can be subjected to fine processing, (iii) is formed into a cured film having excellent flexibility, flame retardancy, and electrical insulation reliability, and (iv) causes a substrate to have a small warpage after being cured.

Abstract translation: 感光性树脂组合物含有（A）粘合剂聚合物，（B）交联聚合物颗粒，（C）热固性树脂，（D）光聚合引发剂和（E）磷酸阻燃剂，其中 （B）交联聚合物颗粒相对于100重量份（A）粘合剂聚合物为30重量份至100重量份，（B）交联聚合物颗粒的平均粒径为 1μm〜10μm。 因此，感光性树脂组合物（i）在施加和干燥后获得优异的无粘性，（ii）可以进行精细加工，（iii）形成为具有优异的柔性，阻燃性和电气性的固化膜 绝缘可靠性，（iv）使基材在固化后具有小的翘曲。

公开(公告)号：US20150044451A1

公开(公告)日：2015-02-12

申请号：US14363058

申请日：2012-11-20

Applicant: Kaneka Corporation

Inventor： Masayoshi Kido ,  Yoshihide Sekito

IPC: C08L33/10 ,  H05K1/03 ,  C08L75/14

CPC classification number: C08L33/10 ,  C08L75/14 ,  C08L2201/02 ,  C08L2203/206 ,  C08L2205/025 ,  C08L2205/03 ,  G03F7/027 ,  G03F7/105 ,  H05K1/0373 ,  H05K1/0393 ,  H05K3/287 ,  H05K2201/012 ,  H05K2201/05 ,  H05K2203/161 ,  Y10T428/254

Abstract: Provided is a black photosensitive resin composition being microfabricatable due to its photosensitivity, allowing a cured film obtainable therefrom to be excellent in flexibility, being small in post-curing warpage of a substrate, being excellent in flame retardancy and electric insulation reliability, allowing a reduction in process contamination due to less outgassing during a reflow process, and avoiding a reduction in film thickness. The black photosensitive resin composition contains at least (A) a binder polymer, (B) a thermosetting resin, (C) a flame retardant substantially insoluble in an organic solvent, (D) a photopolymerization initiator, (E) a black colorant reflecting light having a wavelength falling within an infrared range, and (F) an organic solvent, or contains at least (A) a binder polymer, (B) a thermosetting resin, (G) spherical organic beads, (D) a photopolymerization initiator, (E) a black colorant reflecting light having a wavelength falling within an infrared range, and (F) an organic solvent.

Abstract translation: 本发明提供一种黑色感光性树脂组合物，其光敏性可微细化，使得其可得到的固化膜柔软性优异，基板的后固化翘曲小，阻燃性和电绝缘性可靠性优异， 在回流过程中由于较少的除气而处理污染，并且避免了膜厚度的降低。 黑色感光性树脂组合物至少含有（A）粘合剂聚合物，（B）热固性树脂，（C）基本上不溶于有机溶剂的阻燃剂，（D）光聚合引发剂，（E）黑色着色剂反射光 （F）有机溶剂，或至少包含（A）粘合剂聚合物，（B）热固性树脂，（G）球形有机珠粒，（D）光聚合引发剂，（ E）反射波长在红外范围内的光的黑色着色剂，（F）有机溶剂。

公开(公告)号：US08840967B2

公开(公告)日：2014-09-23

申请号：US13235060

申请日：2011-09-16

Applicant: Jae-Choon Cho ,  Myeong-Ho Hong ,  Hwa-Young Lee ,  Hee-Sun Chun ,  Choon-Keun Lee

Inventor： Jae-Choon Cho ,  Myeong-Ho Hong ,  Hwa-Young Lee ,  Hee-Sun Chun ,  Choon-Keun Lee

IPC: B05D5/12 ,  B05D3/10 ,  C09K21/14 ,  H05K1/03

CPC classification number: C09K21/14 ,  C08G59/182 ,  C08K3/00 ,  C08K3/36 ,  C08L63/00 ,  H05K1/0326 ,  H05K1/036 ,  H05K1/0373 ,  H05K1/0393 ,  H05K2201/012 ,  H05K2201/0145 ,  H05K2201/0209

Abstract: The present invention relates to a method for manufacturing a printed circuit board including a flame retardant insulation layer. The printed circuit board of the present invention exhibits excellent thermal stability and excellent mechanical strength, is suitable for imprinting lithography process, provides improved reliability by reducing coefficient of thermal expansion, and has excellent adhesion between circuit patterns and an insulation layer.

Abstract translation: 本发明涉及包含阻燃绝缘层的印刷电路板的制造方法。 本发明的印刷电路板显示出优异的热稳定性和优异的机械强度，适用于压印光刻工艺，通过降低热膨胀系数提供改进的可靠性，并且在电路图案和绝缘层之间具有优异的粘附性。

公开(公告)号：US20140227924A1

公开(公告)日：2014-08-14

申请号：US14119342

申请日：2012-05-23

Applicant: Takeshi Nobukuni ,  Yoshihiro Kato ,  Meguru Ito ,  Tomoki Hamajima

Inventor： Takeshi Nobukuni ,  Yoshihiro Kato ,  Meguru Ito ,  Tomoki Hamajima

IPC: C09D163/00 ,  H05K1/03

CPC classification number: C09D163/00 ,  C08G59/245 ,  C08G59/38 ,  C08G59/4014 ,  C08J5/24 ,  C08J2363/00 ,  C08J2479/04 ,  C08J2483/04 ,  C08L63/00 ,  H05K1/0353 ,  H05K1/0373 ,  H05K2201/012 ,  H05K2201/0209 ,  H05K2201/0212 ,  Y10T428/31529 ,  Y10T442/2008 ,  Y10T442/2951 ,  C08L79/04 ,  C08L83/04

Abstract: A resin composition contains a cyanate ester compound, a maleimide compound, an epoxy resin, a silicone rubber powder, and an inorganic filler. The cyanate ester compound contains a compound represented by the following formula. The silicone rubber powder is contained in an amount of 40 to 150 parts by mass based on 100 parts by mass in total of the cyanate ester compound, the maleimide compound, and the epoxy resin. The inorganic filler is contained in an amount of 100 to 340 parts by mass based on 100 parts by mass in total of the cyanate ester compound, the maleimide compound, and the epoxy resin. A total content of the silicone rubber powder and the inorganic filler is 140 to 380 parts by mass based on 100 parts by mass in total of the cyanate ester compound, the maleimide compound, and the epoxy resin.

Abstract translation: 树脂组合物含有氰酸酯化合物，马来酰亚胺化合物，环氧树脂，硅橡胶粉末和无机填料。 氰酸酯化合物含有下式表示的化合物。 相对于氰酸酯化合物，马来酰亚胺化合物和环氧树脂的总计100质量份，硅橡胶粉末的含量为40〜150质量份。 相对于氰酸酯化合物，马来酰亚胺化合物和环氧树脂的总计100质量份，无机填料的含量为100〜340质量份。 相对于氰酸酯化合物，马来酰亚胺化合物和环氧树脂的总计100质量份，硅橡胶粉末和无机填料的总含量为140〜380质量份。

公开(公告)号：US20140174802A1

公开(公告)日：2014-06-26

申请号：US13777477

申请日：2013-02-26

Applicant: ELITE ELECTRONIC MATERIAL (KUNSHAN) CO., LTD

Inventor： RONG-TAO WANG ,  TSE-AN LEE ,  YI-JEN CHEN ,  WENJUN TIAN ,  ZIQIAN MA ,  WENFENG LU

IPC: H05K1/03 ,  B32B27/06

CPC classification number: H05K1/0353 ,  B32B15/14 ,  B32B15/20 ,  B32B2305/076 ,  B32B2457/08 ,  C08G14/06 ,  C08G59/621 ,  C08L25/08 ,  C08L61/14 ,  C08L61/34 ,  C08L63/00 ,  C08L79/085 ,  H05K2201/012 ,  H05K2201/0209 ,  Y10T428/31529 ,  C08L61/06

Abstract: A halogen-free resin composition includes (A) 100 parts by weight of naphthalene epoxy resin; (B) 10 to 100 parts by weight of styrene maleic anhydride copolymer; and (C) 30 to 70 parts by weight of DOPO-containing bisphenol F novolac resin. The halogen-free resin composition includes specific ingredients, and is characterized by specific proportions thereof, to thereby attain a low dielectric constant, a low dielectric dissipation factor, high heat resistance, and high flame retardation, and thus is suitable for producing a prepreg or a resin film to thereby be applicable to copper clad laminates and printed circuit boards.

Abstract translation: 无卤树脂组合物包含（A）100重量份的萘环氧树脂; （B）10〜100重量份苯乙烯马来酸酐共聚物; 和（C）30〜70重量份含DOPO的双酚F酚醛清漆树脂。 无卤素树脂组合物包括特定成分，其特征在于其特定比例，从而获得低介电常数，低介电损耗因数，高耐热性和高阻燃性，因此适用于制备预浸料或 树脂膜，从而可应用于覆铜层压板和印刷电路板。

公开(公告)号：US08658719B2

公开(公告)日：2014-02-25

申请号：US12483166

申请日：2009-06-11

Applicant: Daniel Chang ,  Sam Najjar

Inventor： Daniel Chang ,  Sam Najjar

IPC: C08K5/521

CPC classification number: H01B3/40 ,  C08J5/24 ,  C08J2379/04 ,  C08K3/36 ,  C08K5/523 ,  C08L79/04 ,  H05K1/0298 ,  H05K1/03 ,  H05K1/0353 ,  H05K1/0373 ,  H05K2201/012 ,  Y10T428/249955 ,  Y10T428/31511 ,  Y10T428/31525 ,  Y10T428/31529 ,  Y10T428/31721 ,  Y10T428/31725 ,  Y10T428/31786 ,  Y10T428/31931 ,  Y10T442/20 ,  Y10T442/2475

Abstract: In accordance with the present invention compositions are described which are useful, for example, for the preparation of metal-clad laminate structures, methods for the preparation thereof, and various uses therefor. Invention metal-clad laminate structures are useful, for example, multi-layer board (MLB) industry, in the preparation of burn-in test boards and high reliability boards, applications where low coefficient of thermal expansion (CTE) is beneficial, in the preparation of boards used in down-hole drilling, and the like.

Abstract translation: 根据本发明，描述了组合物，其可用于例如制备覆金属层压板结构体，其制备方法及其各种用途。 本发明的金属包覆层压结构在例如多层板（MLB）工业中可用于制备老化测试板和高可靠性板，其中低热膨胀系数（CTE）有利的应用在 在井下钻孔中使用的板的制备等。

公开(公告)号：US20130273796A1

公开(公告)日：2013-10-17

申请号：US13997519

申请日：2011-09-03

Applicant: Guangdong Shengyi Sci. Tech Co., Ltd.

Inventor： Shiguo Su ,  Yueshan He

IPC: C08L79/04

CPC classification number: C08L79/04 ,  B32B5/022 ,  B32B5/26 ,  B32B15/14 ,  B32B15/20 ,  B32B2260/023 ,  B32B2260/04 ,  B32B2260/046 ,  B32B2307/204 ,  B32B2307/3065 ,  C08G73/0655 ,  C08J5/24 ,  C08J2379/04 ,  C08J2379/08 ,  C08K5/353 ,  C08K5/521 ,  C08K5/5399 ,  C08L63/00 ,  C08L79/085 ,  H05K1/0353 ,  H05K2201/012 ,  Y10T428/31511 ,  Y10T442/20

Abstract: The present invention relate to a halogen-free high-Tg resin composition and a prepreg and a laminate fabricated by using the same. The composition comprises, based on parts by weight of organic solids: (A) 10-50 parts by weight of a cyanate ester resin; (B) at least one compound having a dihydrobenzoxazine ring; (C) 10-50 parts by weight of at least one bismaleimide resin; (D) 10-50 parts by weight of at least one polyepoxy compound; and (E) 5-30 parts by weight of at least one phosphorus-containing flame retardant. The halogen-free high-Tg resin composition has the performance of low water absorption, low CTE, high Tg, and good dielectric properties, and a prepreg and a laminate fabricated by using the same has the characteristics of a high glass transition temperature, a low CTE, a low dielectric constant, a low water absorption, and a high heat resistance, and thus being applicable to a multi-layer circuit board

Abstract translation: 本发明涉及一种无卤高Tg树脂组合物和一种预浸料和使用该预浸料制成的层压板。 该组合物基于有机固体的重量份：（A）10-50重量份的氰酸酯树脂; （B）至少一种具有二氢苯并恶嗪环的化合物; （C）10-50重量份的至少一种双马来酰亚胺树脂; （D）10-50重量份的至少一种聚环氧化合物; 和（E）5-30重量份的至少一种含磷阻燃剂。 无卤高Tg树脂组合物具有低吸水性，低CTE，高Tg和良好的介电性能的性能，并且使用该预浸料和制造的层压板具有玻璃化转变温度高， 低CTE，低介电常数，低吸水性和高耐热性，因此适用于多层电路板