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公开(公告)号：US20230354515A1
公开(公告)日：2023-11-02
申请号：US18341796
申请日：2023-06-27
Applicant: Ticona LLC
Inventor： Young Shin Kim
CPC classification number: H05K1/0373 , H05K3/0032 , H05K3/182 , H01Q1/38 , H01Q1/243 , H01Q21/065 , H05K2203/072 , H05K2201/0141 , H05K2201/0145 , H05K2201/0154 , H05K2201/0209 , H05K2201/0263 , H05K2201/10098 , H05K2201/0129
Abstract: A circuit structure that comprises a substrate and one or more conductive elements disposed on the substrate is provided. The substrate comprises a polymer composition that comprises an electrically conductive filler distributed within a polymer matrix. The polymer matrix contains at least one thermoplastic high performance polymer having a deflection under load of about 40° C. or more as determined in accordance with ISO 75-2:2013 at a load of 1.8 MPa, and the polymer composition exhibits a dielectric constant of about 4 or more and a dissipation factor of about 0.3 or less, as determined at a frequency of 2 GHz.
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公开(公告)号：US20230180385A1
公开(公告)日：2023-06-08
申请号：US18062049
申请日：2022-12-06
Applicant: IBIDEN CO., LTD.
Inventor： Shogo FUKUI , Kosuke IKEDA , Kosei ICHIKAWA , Ryo ANDO
CPC classification number: H05K1/0373 , H05K3/4661 , H05K1/112 , H05K2201/0209 , H05K2201/0263
Abstract: A wiring substrate includes an insulating layer including inorganic filler particles and resin, and a conductor layer including a metal film formed on a surface of the insulating layer and having a conductor pattern. The inorganic filler particles include first inorganic filler particles such that each of the first inorganic filler particles has a portion exposed on the surface of the insulating layer and is at least partially separated from the resin, the conductor layer is formed such that a part of the metal film is between the first inorganic filler particles and the resin from the surface of the insulating layer and that a distance between the surface of the insulating layer and the surface of the insulating layer at a deepest part of the part of the metal film is in the range of 0.1 μm to 0.5 μm.
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公开(公告)号：US20160100480A1
公开(公告)日：2016-04-07
申请号：US14752576
申请日：2015-06-26
Applicant: IMEC vzw
Inventor： Bjorn Van Keymeulen , Frederick Bossuyt , Thomas Vervust
CPC classification number: H05K1/038 , A41D1/002 , H05K1/0283 , H05K1/189 , H05K3/0026 , H05K3/321 , H05K3/46 , H05K2201/0263 , H05K2201/0969 , H05K2201/10977 , H05K2203/107
Abstract: The present disclosure relates to a method of integrating a interposer device with a textile layer, wherein the interposer device is a stretchable interposer device comprising a stretchable electrically conductive structure with at least one contact pad for establishing at least one electrically conductive path towards the textile layer. The interposer device is arranged to be mechanically attached to a textile layer comprising a plurality of yarns, at least one of which is an electrically conductive yarn. An electrical connection is established between the at least one conductive yarn of the textile layer and the at least one contact pad, which electrical connection is established after the interposer device has been mechanically attached to the textile layer.
Abstract translation: 本公开涉及一种将插入器装置与织物层整合的方法，其中所述插入器装置是可拉伸插入器装置，其包括具有至少一个接触垫的可拉伸导电结构，用于建立至少一个朝向织物层的导电路径 。 插入器装置被布置成机械地附接到包括多根纱线的织物层，其中至少一个是导电纱线。 在织物层的至少一个导电纱线和至少一个接触垫片之间建立电连接，在插入器装置机械地附接到织物层之后，建立电连接。
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公开(公告)号：US20240155760A1
公开(公告)日：2024-05-09
申请号：US18488140
申请日：2023-10-17
Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.
Inventor： Yuji YUKIIRI
CPC classification number: H05K1/0271 , H05K1/113 , H05K3/0035 , H05K3/0055 , H05K3/381 , H05K3/429 , H05K2201/0129 , H05K2201/0263 , H05K2203/095
Abstract: A method of making an interconnect substrate includes forming a first insulating layer containing a filler and covering a first interconnect layer, forming a via hole in the first insulating layer by laser processing, the via hole exposing the first interconnect layer, performing a heat treatment, plasma processing, and a desmear process in this order with respect to the first insulating layer, and forming, after the desmear process, a second interconnect layer including both an interconnect pattern formed on an upper surface of the first insulating layer and a via interconnect formed in the via hole.
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公开(公告)号：US11763959B2
公开(公告)日：2023-09-19
申请号：US17289023
申请日：2019-10-23
Applicant: TSE CO., LTD.
Inventor： Chang Su Oh , Bo Hyun Kim , Sung Ho Yoon
CPC classification number: H01B5/00 , H05K1/115 , H05K3/10 , H05K1/092 , H05K3/0014 , H05K2201/0242 , H05K2201/0263 , H05K2203/104
Abstract: The purpose of the present disclosure is to provide electro-conductive particles and a signal-transmitting connector having same, wherein the electro-conductive particles are improved to prevent the phenomenon of irregular scrub between the electro-conductive particles and to have improved signal delivery characteristics. Electro-conductive particles according to the present disclosure are provided on a signal-transmitting connector having multiple electroconductive portions supported by an insulating portion made of an elastic insulating material to be spaced apart from each other such that the signal-transmitting connector can be connected to an electronic component and can transmit electric signals.
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Patent Agency Ranking
公开(公告)号：US11729908B2
公开(公告)日：2023-08-15
申请号：US17178312
申请日：2021-02-18
Applicant: Ticona LLC
Inventor： Young Shin Kim
CPC classification number: H05K1/0373 , H01Q1/243 , H01Q1/38 , H01Q21/065 , H05K3/0032 , H05K3/182 , H05K2201/0129 , H05K2201/0141 , H05K2201/0145 , H05K2201/0154 , H05K2201/0209 , H05K2201/0263 , H05K2201/10098 , H05K2203/072
Abstract: A circuit structure that comprises a substrate and one or more conductive elements disposed on the substrate is provided. The substrate comprises a polymer composition that comprises an electrically conductive filler distributed within a polymer matrix. The polymer matrix contains at least one thermoplastic high performance polymer having a deflection temperature under load of about 40° C. or more as determined in accordance with ISO 75-2:2013 at a load of 1.8 MPa, and the polymer composition exhibits a dielectric constant of about 4 or more and a dissipation factor of about 0.3 or less, as determined at a frequency of 2 GHz.
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7.发明申请EPOXY RESIN COMPOSITION FOR PREPREG, PREPREG, AND MULTILAYER PRINTED CIRCUIT BOARD 有权PREPREG，PREPREG和多层印刷电路板的环氧树脂组合物公开(公告)号：US20130096233A1
公开(公告)日：2013-04-18
申请号：US13637629
申请日：2011-03-22
Applicant: Tomoaki Iwami , Masaaki Matsumoto , Tomoyuki Abe , Tatsuo Yonemoto , Hiroaki Fujiwara
Inventor： Tomoaki Iwami , Masaaki Matsumoto , Tomoyuki Abe , Tatsuo Yonemoto , Hiroaki Fujiwara
CPC classification number: C08L63/00 , C08G59/4021 , C08G59/621 , C08J5/24 , C08J2363/00 , C08K3/10 , C08K3/22 , C08K5/5313 , C08K5/5397 , C08K9/02 , H05K1/0326 , H05K1/0353 , H05K1/0366 , H05K1/0373 , H05K2201/012 , H05K2201/0209 , H05K2201/0227 , H05K2201/0263
Abstract: The problem to be solved by the invention is to provide an epoxy resin composition for a prepreg, which is used in the manufacture of a printed circuit board containing a multilayer printed circuit board, wherein the epoxy resin composition for a prepreg is characterized by containing as essential components, a phosphorus compound that has 1.8 or more and less than 3 on average of a phenolic hydroxyl group that is reactive to an epoxy resin in the molecule, and that has 0.8 or more on average of a phosphorus element; a bifunctional epoxy resin that has 1.8 or more and less than 2.6 on average of epoxy groups in the molecule; a multi-functional epoxy resin that contains 2.8 or more on average of epoxy groups in one molecule; a hardening agent; an inorganic filler; and a molybdenum compound, wherein the epoxy resin composition for a prepreg is obtained by blending a pre-reacted epoxy resin, which is obtained by reacting at least the phosphorus compound with the bifunctional epoxy resin and the multi-functional epoxy resin, or the bifunctional epoxy resin only in advance, the bifunctional epoxy resin or the multi-functional epoxy resin, the hardening agent, the inorganic filler, and the molybdenum compound, which is excellent in flame retardance, heat resistance, thermal stiffness, and excellent in hole position accuracy without the production of a harmful substance at the time of combustion, a prepreg using the epoxy resin composition for a prepreg, and a multilayer printed circuit board using the prepreg.
Abstract translation: 本发明要解决的问题是提供一种用于预浸料的环氧树脂组合物，其用于制造含有多层印刷电路板的印刷电路板，其中预浸料的环氧树脂组合物的特征在于含有 必要成分，平均分子中与环氧树脂反应的酚羟基平均为1.8以上且小于3的磷化合物，平均为磷成分为0.8以上的磷化合物; 分子中环氧基团平均为1.8以上且小于2.6的双官能环氧树脂; 在一个分子中含有2.8个或更多个平均环氧基的多官能环氧树脂; 硬化剂; 无机填料; 和钼化合物，其中预浸料用环氧树脂组合物通过将至少使磷化合物与双官能环氧树脂和多官能环氧树脂反应获得的预反应环氧树脂或双官能团 环氧树脂仅提前，双功能环氧树脂或多功能环氧树脂，硬化剂，无机填料和钼化合物，其阻燃性，耐热性，热刚度优异，孔位精度优异 在燃烧时不产生有害物质，使用该预浸料坯用环氧树脂组合物的预浸料坯和使用该预浸料坯的多层印刷电路板。
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公开(公告)号：US20240306312A1
公开(公告)日：2024-09-12
申请号：US18597975
申请日：2024-03-07
Applicant: IBIDEN CO., LTD.
Inventor： Jun SAKAI , Kyohei YOSHIKAWA , Shunya HATANAKA
CPC classification number: H05K3/4076 , H05K1/0373 , H05K1/116 , H05K3/16 , H05K3/429 , H05K3/423 , H05K2201/0209 , H05K2201/0263 , H05K2201/2072
Abstract: A printed wiring board includes a first conductor layer, a resin insulating layer formed on the first conductor layer, a second conductor layer formed on a surface of the resin insulating layer, and a via conductor formed in the resin insulating layer such that the via conductor is connecting the first and second conductor layers and has a land portion extending on a boundary part of the resin insulating layer. The via conductor is formed in a via hole formed in the resin insulating layer. The resin insulating layer is formed such that the boundary part has a surface roughness that is larger than a surface roughness of the surface on which the second conductor layer formed and that an inner wall surface in the via hole in the resin insulating layer is equal to or larger than the surface roughness of the boundary part of the resin insulating layer.
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公开(公告)号：US12035467B2
公开(公告)日：2024-07-09
申请号：US18341796
申请日：2023-06-27
Applicant: Ticona LLC
Inventor： Young Shin Kim
CPC classification number: H05K1/0373 , H01Q1/243 , H01Q1/38 , H01Q21/065 , H05K3/0032 , H05K3/182 , H05K2201/0129 , H05K2201/0141 , H05K2201/0145 , H05K2201/0154 , H05K2201/0209 , H05K2201/0263 , H05K2201/10098 , H05K2203/072
Abstract: A circuit structure that comprises a substrate and one or more conductive elements disposed on the substrate is provided. The substrate comprises a polymer composition that comprises an electrically conductive filler distributed within a polymer matrix. The polymer matrix contains at least one thermoplastic high performance polymer having a deflection under load of about 40° C. or more as determined in accordance with ISO 75-2:2013 at a load of 1.8 MPa, and the polymer composition exhibits a dielectric constant of about 4 or more and a dissipation factor of about 0.3 or less, as determined at a frequency of 2 GHz.
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10.发明公开公开(公告)号：US20240059863A1
公开(公告)日：2024-02-22
申请号：US18265393
申请日：2021-12-03
Applicant: LG INNOTEK CO., LTD.
Inventor： Yong Suk KIM , Jeong Han KIM
CPC classification number: C08K3/36 , C08K3/22 , C08J5/24 , H05K1/0373 , C08K2201/003 , C08K2003/2227 , C08K2003/2244 , C08K2003/2241 , C08J2361/06 , C08J2363/00 , C08J2327/18 , H05K2201/0263
Abstract: A resin composition for a semiconductor package according to an embodiment includes a resin composition that is a composite of a resin and a filler disposed in the resin, wherein the filler has a content in a range of 68 wt % to 76 wt % in the resin composition, wherein the filler includes a first filler group composed of fillers having a first diameter; a second filler group composed of fillers having a second diameter smaller than the first diameter; and a third filler group composed of fillers having a third diameter smaller than the second diameter, and contents of each of the first filler group, the second filler group, and the third filler group in the filler are different from each other.
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