公开(公告)号：US20140154479A1

公开(公告)日：2014-06-05

申请号：US13845032

申请日：2013-03-17

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Geum Hee Yun ,  Jin Ho Hong ,  Sa Yong Lee ,  Jin Young Kim ,  Keun Yong Lee

IPC: H05K1/03 ,  H01B3/40

CPC classification number: H05K1/0373 ,  H01B3/40 ,  H05K2201/0141 ,  H05K2201/0162 ,  H05K2201/0209 ,  H05K2201/0239 ,  Y10T428/24802

Abstract: Disclosed herein is a resin composition for a printed circuit board, including: a liquid crystalline oligomer; an epoxy resin; and an inorganic filler which is a reaction product of silica, silane having a vinyl group and an alkoxy group, and vinyl or hydroxyl terminated silicone oil. The resin composition has a low thermal expansion coefficient, excellent heat resistance and a high glass transition temperature.

Abstract translation: 本发明公开了一种用于印刷电路板的树脂组合物，包括：液晶低聚物; 环氧树脂; 和作为二氧化硅，具有乙烯基和烷氧基的硅烷和乙烯基或羟基封端的硅油的反应产物的无机填料。 树脂组合物的热膨胀系数低，耐热性优异，玻璃化转变温度高。

公开(公告)号：US08735733B2

公开(公告)日：2014-05-27

申请号：US13352819

申请日：2012-01-18

Applicant: Masato Miyatake ,  Tomohiko Kotake ,  Shunsuke Nagai ,  Shintaro Hashimoto ,  Yasuo Inoue ,  Shin Takanezawa ,  Hikari Murai

Inventor： Masato Miyatake ,  Tomohiko Kotake ,  Shunsuke Nagai ,  Shintaro Hashimoto ,  Yasuo Inoue ,  Shin Takanezawa ,  Hikari Murai

IPC: E04B1/78 ,  B32B27/04 ,  B32B27/34 ,  H05K1/00

CPC classification number: H05K1/0353 ,  C08G77/14 ,  C08G77/26 ,  C08G77/28 ,  C08J5/24 ,  C08J2363/00 ,  C08K5/18 ,  C08K5/3415 ,  C08L83/06 ,  C08L83/08 ,  H05K1/0346 ,  H05K2201/0154 ,  H05K2201/0162 ,  H05K2201/068 ,  Y10T428/31681 ,  Y10T442/2721

Abstract: Disclosed are a resin composition containing (a) a maleimide compound having at least two N-substituted maleimide groups in a molecular structure and (b) a silicone compound having at least one reactive organic group in a molecular structure thereof; and a prepreg using the same, a laminate, and a printed wiring board.A resin composition having excellent heat resistance and low thermal expansion properties; and a prepreg, a laminate, and a printed wiring board using the same can be provided.

Abstract translation: 公开了一种树脂组合物，其含有（a）在分子结构中具有至少两个N-取代马来酰亚胺基团的马来酰亚胺化合物和（b）在其分子结构中具有至少一个反应性有机基团的硅氧烷化合物; 和使用其的预浸料，层压体和印刷线路板。 具有优异的耐热性和低热膨胀性的树脂组合物; 并且可以提供预浸料，层压板和使用其的印刷线路板。

公开(公告)号：US08697458B2

公开(公告)日：2014-04-15

申请号：US13104842

申请日：2011-05-10

Applicant: Robert J. Nolan ,  Jeffery D. Harman, Sr.

Inventor： Robert J. Nolan ,  Jeffery D. Harman, Sr.

IPC: H01L21/00

CPC classification number: H01L33/52 ,  H01L33/44 ,  H01L51/5253 ,  H01L2933/0025 ,  H05K3/284 ,  H05K2201/0162 ,  H05K2201/10106 ,  H05K2203/1366

Abstract: A silicone protective coating for an electronic light source and a method for applying the coating over an exposed or outer surface of the electronic light source assembled as part of or mounted to a circuit board or other substrate.

Abstract translation: 一种用于电子光源的硅氧烷保护涂层，以及将该涂层涂覆在电子光源的暴露或外表面上，作为电路板或其他基板的一部分或安装在电路板或其他基板上的方法。

公开(公告)号：US20130303873A1

公开(公告)日：2013-11-14

申请号：US13704420

申请日：2011-06-14

Applicant: Janos Vörös ,  Alexandre Larmagnac ,  Gregoire Courtine ,  Pavel Musienko

Inventor： Janos Vörös ,  Alexandre Larmagnac ,  Gregoire Courtine ,  Pavel Musienko

IPC: A61B5/04 ,  A61N1/05 ,  A61N1/30 ,  B05D7/00

CPC classification number: A61B5/04001 ,  A61B5/407 ,  A61B2562/0215 ,  A61B2562/046 ,  A61B2562/125 ,  A61B2562/164 ,  A61B2562/166 ,  A61N1/0551 ,  A61N1/303 ,  B05D7/00 ,  H05K1/0272 ,  H05K1/0283 ,  H05K1/095 ,  H05K3/1233 ,  H05K3/246 ,  H05K3/4664 ,  H05K3/4682 ,  H05K2201/0162 ,  H05K2201/0329 ,  H05K2203/016

Abstract: A hopper having a passage through which a medicine can be passed downward is provided. A part of a lower portion of the hopper is a deformable portion having flexibility, and the deformable portion is deformable so as to open and close the passage. According to this configuration, the deformable portion that is a part of the hopper is deformed to open and close the passage. Thus, there is no portion such as an opening and closing plate on which the medicine remains, thereby preventing a gap in which the medicine remains from being formed in the hopper, and preventing the medicine from easily remaining in the hopper.

Abstract translation: 提供具有通过药物可以向下通过的通道的料斗。 料斗的下部的一部分是具有柔性的可变形部分，并且可变形部分是可变形的，以便打开和关闭通道。 根据该结构，作为料斗的一部分的变形部变形，开闭通路。 因此，不存在药物残留的开闭板等部分，从而防止药剂残留在料斗中的间隙，防止药物容易残留在料斗中。

公开(公告)号：US20130113013A1

公开(公告)日：2013-05-09

申请号：US13810112

申请日：2011-07-26

Applicant: Jun Matsui ,  Tomohiko Terai ,  Syuuji Suzuki

Inventor： Jun Matsui ,  Tomohiko Terai ,  Syuuji Suzuki

IPC: B32B15/08 ,  B32B5/00 ,  H01L33/60

CPC classification number: B32B15/08 ,  B32B5/00 ,  G02B5/0808 ,  G02B5/085 ,  H01L33/60 ,  H01L33/62 ,  H01L33/64 ,  H01L2224/48227 ,  H01L2924/12044 ,  H05K1/0373 ,  H05K3/0061 ,  H05K3/022 ,  H05K3/389 ,  H05K2201/0162 ,  H05K2201/0209 ,  Y10T428/266 ,  Y10T428/31663 ,  Y10T428/31678 ,  H01L2924/00

Abstract: Provided is a metal foil laminate that: has heat resistance; has high reflectance in the visible light range; has little decrease in reflectance in environments with a high-temperature thermal load; is compatible with large surface areas; and can be used for printed circuit boards for mounting LEDs that have excellent adhesion with metals. The metal foil laminate is characterized in that: a laminate has metal foil on at least one side of a resin layer (A) containing a polyorganosiloxane and an inorganic filler; the 90° peel strength between said resin layer (A) and said metal foil is at least 0.95 kN/m, and the mean reflectance at wavelengths of 400 to 800 nm on the surface that is exposed when the resin layer (A) is exposed by peeling and removing said metal foil is at least 80%; and the decrease in the reflectance at a wavelength of 470 nm after being treated with heat for 10 minutes at 260° C. is not more than 5%.

Abstract translation: 提供：具有耐热性的金属箔层压体; 在可见光范围内具有高反射率; 在具有高温热负荷的环境中的反射率几乎没有降低; 兼容大面积面积; 并且可以用于印刷电路板，用于安装与金属具有优异粘附性的LED。 金属箔层压体的特征在于：层压体在至少一面包含聚有机硅氧烷和无机填料的树脂层（A）的一侧上具有金属箔; 所述树脂层（A）和所述金属箔之间的90°剥离强度为至少0.95kN / m，在树脂层（A）暴露时所暴露的表面上的波长为400〜800nm的平均反射率 通过剥离和去除所述金属箔是至少80％; 并且在260℃下加热处理10分钟后在470nm波长处的反射率的降低不大于5％。

公开(公告)号：US08349460B2

公开(公告)日：2013-01-08

申请号：US12575861

申请日：2009-10-08

Applicant: Sankar K. Paul

Inventor： Sankar K. Paul

IPC: B32B27/00 ,  C08L83/00 ,  C08K3/18 ,  C08K3/20 ,  C08K3/22 ,  C08K3/34 ,  C08K3/38

CPC classification number: C09J151/04 ,  B32B5/022 ,  B32B5/024 ,  B32B7/12 ,  B32B15/08 ,  B32B15/14 ,  B32B15/20 ,  B32B27/18 ,  B32B27/20 ,  B32B27/26 ,  B32B27/28 ,  B32B27/283 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2262/101 ,  B32B2270/00 ,  B32B2307/202 ,  B32B2307/204 ,  B32B2307/3065 ,  B32B2457/00 ,  B32B2457/08 ,  C08G77/12 ,  C08K3/013 ,  C08K5/0025 ,  C08K5/14 ,  C08K9/06 ,  C08L83/04 ,  C08L2666/02 ,  C08L2666/14 ,  C09J151/08 ,  C09J153/00 ,  C09J153/025 ,  H05K1/0373 ,  H05K2201/0162 ,  H05K2201/0209 ,  H05K2201/0239 ,  Y10T428/24917 ,  Y10T428/31663

Abstract: Organosilicon composites are described, comprising 30 to 90 vol. % of a cured organosilicon copolymer derived by curing an organosilicon polymer having, in the same copolymer, silicon-containing repeating units comprising a silicon hydride and silicon-containing repeating units comprising a C1-10 ethylenically unsaturated group; and 10 to 70 vol. % of a dielectric filler. The composites are used in the manufacture of circuit subassemblies.

Abstract translation: 描述了有机硅复合材料，其包含30至90体积％ 通过固化在同一共聚物中含有包含硅氢化物的含硅重复单元和包含C1-10烯键式不饱和基团的含硅重复单元的有机硅聚合物衍生的固化的有机硅共聚物的％ 和10至70体积份。 介电填料的％。 复合材料用于制造电路组件。

公开(公告)号：US08332053B1

公开(公告)日：2012-12-11

申请号：US12431042

申请日：2009-04-28

Applicant: Pamela R. Patterson ,  Kevin S. Holabird ,  Christopher P. Henry

Inventor： Pamela R. Patterson ,  Kevin S. Holabird ,  Christopher P. Henry

IPC: A61N1/00

CPC classification number: H05K3/0014 ,  A61B2562/0247 ,  A61B2562/0271 ,  A61B2562/028 ,  A61B2562/164 ,  A61N1/0484 ,  H01L23/5387 ,  H01L2924/0002 ,  H05K1/0283 ,  H05K2201/0133 ,  H05K2201/0162 ,  H05K2201/09681 ,  H01L2924/00

Abstract: In one implementation, a method of fabrication of stretchable electronic skin is provided. The method may include receiving an elastic material net. An elastic conductor mesh is formed on the elastic material net. A device is electrically bonded to the elastic conductor mesh. The implementation may further include forming a mold comprising a net pattern on a substrate and creating the elastic material net by coating the mold with an elastic material precursor, and then removing the elastic net from the substrate with the elastic conductor thereon. In one embodiment, a stretchable electronic skin including a net structure having a non-conducting elastic material with an elastic conductor mesh formed on the non-conducting elastic material, and a device electrically connected to the elastic conductor mesh.

Abstract translation: 在一个实施方案中，提供了一种制造可拉伸电子皮肤的方法。 该方法可以包括接收弹性材料网。 在弹性材料网上形成弹性导体网。 器件电连接到弹性导体网。 该实施方案还可以包括在基材上形成包括网状图案的模具，并通过用弹性材料前体涂覆模具来形成弹性材料网，然后用其上的弹性导体从基材上去除弹性网。 在一个实施例中，包括具有非导电弹性材料的网状结构的可拉伸电子表皮，其具有形成在非导电弹性材料上的弹性导体网，以及电连接到弹性导体网的装置。

公开(公告)号：US20120305963A1

公开(公告)日：2012-12-06

申请号：US13414458

申请日：2012-03-07

Applicant: Kozo UEMURA ,  Soichi Shibusawa ,  Yumiko Hayashida ,  Kiyoshi Nishimura ,  Seiko Kawashima ,  Tsuyoshi Oyaizu ,  Masahiro Ogata ,  Shuhei Matsuda ,  Hiroki Tamai

Inventor： Kozo UEMURA ,  Soichi Shibusawa ,  Yumiko Hayashida ,  Kiyoshi Nishimura ,  Seiko Kawashima ,  Tsuyoshi Oyaizu ,  Masahiro Ogata ,  Shuhei Matsuda ,  Hiroki Tamai

IPC: H01L33/60

CPC classification number: H05K3/284 ,  F21S8/04 ,  F21V19/0055 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L33/56 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2224/73265 ,  H05K1/0209 ,  H05K3/244 ,  H05K2201/0162 ,  H05K2201/099 ,  H05K2201/10106 ,  H05K2201/2054 ,  H01L2924/00014 ,  H01L2924/00

Abstract: According to one embodiment, a light-emitting device includes a substrate, a reflecting layer formed on the substrate, a light-emitting element placed on the reflecting layer, and a sealing resin layer that covers the reflecting layer and the light-emitting element. The oxygen permeability of the sealing resin layer is equal to or lower than 1200 cm3/(m2·day·atm), and the ratio of the area of the reflecting layer covered by the sealing resin layer to the entire area on the resin substrate covered by the sealing resin layer is between 30% and 75% inclusive.

Abstract translation: 根据一个实施例，发光装置包括基板，形成在基板上的反射层，放置在反射层上的发光元件和覆盖反射层和发光元件的密封树脂层。 密封树脂层的透氧度等于或低于1200cm3 /（m2·day·atm），并且覆盖在树脂基板上的密封树脂层覆盖的反射层的面积与覆盖的整个面积的比率 通过密封树脂层在30％和75％之间。

公开(公告)号：US08318244B2

公开(公告)日：2012-11-27

申请号：US12811772

申请日：2008-12-18

Applicant: Michael Brasseur ,  Karen Hueston ,  James Tonge

Inventor： Michael Brasseur ,  Karen Hueston ,  James Tonge

IPC: B05D1/38

CPC classification number: H05K3/207 ,  C09D183/04 ,  H05K2201/0162 ,  H05K2201/0209 ,  C08L2666/54

Abstract: A method for fabricating electronic devices includes the steps of 1) printing a multi-layer electronic device on a silicone-based hard coating on a substrate, and 2) removing the device from the substrate. The silicone-based hard coating is an abrasion resistant coating with hardness ranging from 1 to 10 gigaPascals.

Abstract translation: 一种制造电子器件的方法包括以下步骤：1）在基底上的硅基硬涂层上印刷多层电子器件，以及2）从衬底上去除器件。 硅基硬涂层是硬度为1至10千兆帕的耐磨涂层。

公开(公告)号：US20120247820A1

公开(公告)日：2012-10-04

申请号：US13352819

申请日：2012-01-18

Applicant: Masato MIYATAKE ,  Tomohiko Kotake ,  Shunsuke Nagai ,  Shintaro Hashimoto ,  Yasuo Inoue ,  Shin Takanezawa ,  Hikari Murai

Inventor： Masato MIYATAKE ,  Tomohiko Kotake ,  Shunsuke Nagai ,  Shintaro Hashimoto ,  Yasuo Inoue ,  Shin Takanezawa ,  Hikari Murai

IPC: E04B1/78 ,  B32B27/04 ,  B32B27/34 ,  H05K1/00

CPC classification number: H05K1/0353 ,  C08G77/14 ,  C08G77/26 ,  C08G77/28 ,  C08J5/24 ,  C08J2363/00 ,  C08K5/18 ,  C08K5/3415 ,  C08L83/06 ,  C08L83/08 ,  H05K1/0346 ,  H05K2201/0154 ,  H05K2201/0162 ,  H05K2201/068 ,  Y10T428/31681 ,  Y10T442/2721

Abstract: Disclosed are a resin composition containing (a) a maleimide compound having at least two N-substituted maleimide groups in a molecular structure and (b) a silicone compound having at least one reactive organic group in a molecular structure thereof; and a prepreg using the same, a laminate, and a printed wiring board.A resin composition having excellent heat resistance and low thermal expansion properties; and a prepreg, a laminate, and a printed wiring board using the same can be provided.

Abstract translation: 公开了一种树脂组合物，其含有（a）在分子结构中具有至少两个N-取代马来酰亚胺基团的马来酰亚胺化合物和（b）在其分子结构中具有至少一个反应性有机基团的硅氧烷化合物; 和使用其的预浸料，层压体和印刷线路板。 具有优异的耐热性和低热膨胀性的树脂组合物; 并且可以提供预浸料，层压板和使用其的印刷线路板。