公开(公告)号：US08153030B2

公开(公告)日：2012-04-10

申请号：US12207138

申请日：2008-09-09

Applicant: Min-Sok Jang ,  Kyung-Hwan Ko ,  Seung-Il Lee ,  Jin-Wook Moon ,  Jeong-Geun Han

Inventor： Min-Sok Jang ,  Kyung-Hwan Ko ,  Seung-Il Lee ,  Jin-Wook Moon ,  Jeong-Geun Han

IPC: H01B1/22

CPC classification number: H05K3/323 ,  B22F1/025 ,  H05K2201/0218 ,  H05K2201/0233 ,  Y10T428/2991

Abstract: In an anisotropic conductive adhesive containing a conductive particle, the conductive particle includes a resin particle that is provided with a cavity formed therein and a conductive layer surrounding a surface of the resin particle. The cavity is formed by mixing the resin particle with a reactant and partially removing the reactant from the resin particle. Thus, the conductive particle may readily absorb an external pressure, thereby providing an improved malleability to the conductive particle.

Abstract translation: 在含有导电性粒子的各向异性导电性粘合剂中，导电性粒子包括树脂粒子，该树脂粒子形成有腔，该导电性层包围树脂粒子的表面。 通过将树脂颗粒与反应物混合并从树脂颗粒中部分除去反应物而形成空腔。 因此，导电性粒子可以容易地吸收外部压力，从而为导电性粒子提供改善的延展性。

公开(公告)号：US07524559B2

公开(公告)日：2009-04-28

申请号：US11800831

申请日：2007-05-08

Applicant: Kazunobu Kamiya ,  Ryoji Kojima

Inventor： Kazunobu Kamiya ,  Ryoji Kojima

IPC: B32B5/66

CPC classification number: C08J3/128 ,  C01P2004/84 ,  C08J2333/06 ,  C09C3/10 ,  C09J9/02 ,  H01R4/04 ,  H01R4/58 ,  H05K3/323 ,  H05K2201/0221 ,  H05K2201/0233 ,  Y10T428/2982 ,  Y10T428/2991 ,  Y10T428/2993 ,  Y10T428/2995 ,  Y10T428/2996 ,  Y10T428/2998

Abstract: Resin particles comprised of an acrylic resin. Not only is the maximum compression deformation ratio thereof as great as 60% or more but also the load required for 60% compression deformation is as small as 60 mN or less. Wiring boards are therefore coupled in using an anisotropic conductive adhesive obtained by first manufacturing conductive particles having a conductive coating formed on a resin particle surface of the resin particles by adhering a conductive material to the surface of the above resin particles as a core. On dispersing the conductive particles in an adhesive material, the conductive particles sandwiched between metallic wires of the wiring boards are greatly deformed by a small load, so that the electrical devices having a high conduction reliability can be obtained.

Abstract translation: 由丙烯酸树脂构成的树脂颗粒。 其最大压缩变形率不仅高达60％以上，而且60％压缩变形所需的载荷也小至60mN以下。 因此，使用各向异性导电粘合剂，将导电性材料粘接到作为核心的上述树脂粒子的表面，使用各向异性导电粘合剂，将导电性粒子形成在树脂粒子表面上的导电性粒子。 在将导电粒子分散在粘合剂材料中时，夹在布线板的金属线之间的导电颗粒由于负载较小而大大地变形，从而可以获得具有高导电可靠性的电子器件。

公开(公告)号：US20080153207A1

公开(公告)日：2008-06-26

申请号：US12044239

申请日：2008-03-07

Applicant: Daoqiang Lu ,  Henning Braunisch

Inventor： Daoqiang Lu ,  Henning Braunisch

IPC: H01L21/00

CPC classification number: H01L23/49827 ,  H01L21/485 ,  H01L23/5382 ,  H01L24/28 ,  H01L24/83 ,  H01L2224/2919 ,  H01L2224/838 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/14 ,  H05K3/323 ,  H05K3/365 ,  H05K2201/0221 ,  H05K2201/0233 ,  H05K2201/0314 ,  H01L2924/00

Abstract: Methods of forming a microelectronic structure are described. Embodiments of those methods include placing an anisotropic conductive layer comprising at least one compliant conductive sphere on at least one interconnect structure disposed on a first substrate, applying pressure to contact the compliant conductive spheres to the at least one interconnect structure, removing a portion of the anisotropic conductive layer to expose at least one of the compliant conductive spheres; and then attaching a second substrate to the anisotropic conductive layer.

Abstract translation: 描述形成微电子结构的方法。 这些方法的实施例包括将包括至少一个顺应性导电球的各向异性导电层放置在设置在第一衬底上的至少一个互连结构上，施加压力以使柔性导电球接触至少一个互连结构， 各向异性导电层以暴露柔性导电球体中的至少一个; 然后将第二基板附着到各向异性导电层。

公开(公告)号：US20080102277A1

公开(公告)日：2008-05-01

申请号：US11966040

申请日：2007-12-28

Applicant: Tae BAE ,  Jin PARK ,  Jung JUN ,  Jae LEE ,  Jung PARK ,  Sang LEE

Inventor： Tae BAE ,  Jin PARK ,  Jung JUN ,  Jae LEE ,  Jung PARK ,  Sang LEE

IPC: B32B5/16 ,  B05D3/04

CPC classification number: H05K3/323 ,  H05K2201/0221 ,  H05K2201/0233 ,  Y10T428/25 ,  Y10T428/2991 ,  Y10T428/2998

Abstract: Disclosed herein are anisotropic conductive particles having superior electrical reliability which are useful as materials for electrical connection structures. Further disclosed is a method for preparing conductive particles comprising polymer resin base particles and a conductive complex metal plating layer formed on the surface of the base particles wherein the conductive complex metal plating layer has a substantially continuous density gradient and can include nickel (Ni) and gold (Au).

Abstract translation: 本文公开了具有优异的电可靠性的各向异性导电颗粒，其可用作电连接结构的材料。 进一步公开了一种制备导电颗粒的方法，该导电颗粒包括聚合物树脂基础颗粒和形成在基础颗粒表面上的导电复合金属镀层，其中导电复合金属镀层具有基本上连续的密度梯度，并且可以包括镍（Ni）和 金（Au）。

公开(公告)号：US20080078977A1

公开(公告)日：2008-04-03

申请号：US11863379

申请日：2007-09-28

Applicant: Toshifumi HASHIBA ,  Kazutoshi HAYAKAWA ,  Satomi KUDO ,  Kohei MORIYAMA ,  Tsuyoshi FUJII

Inventor： Toshifumi HASHIBA ,  Kazutoshi HAYAKAWA ,  Satomi KUDO ,  Kohei MORIYAMA ,  Tsuyoshi FUJII

IPC: H01B1/00 ,  B05D5/12 ,  B32B5/16

CPC classification number: H01B1/20 ,  C08J3/12 ,  C08J3/126 ,  C08J2333/20 ,  H01B1/128 ,  H05K3/321 ,  H05K3/323 ,  H05K2201/0221 ,  H05K2201/0233 ,  Y10T428/2998

Abstract: Conductive particles each includes a polymer base particle and a conductive layer coating the polymer base particle. Let the compressive elastic deformation characteristic KX of one conductive particle when the displacement of particle diameter of the conductive particles is X % be defined by the following formula: KX=(3/√2)·(SX−3/2)·(R−1/2)·FX. FX is the load (N) necessary for X % displacement of the conductive particles. SX is the compressive deformation amount (mm) upon X % displacement of the conductive particles. R is the particle radius (mm) of the conductive particles. The compressive elastic deformation characteristic K50 when the displacement of particle diameter of the conductive particles is 50% is 100 to 50000 N/mm2 at 20° C., and the recovery factor of particle diameter of the conductive particles when the displacement of particle diameter of the conductive particles is 50% is not less than 30% at 20° C.

Abstract translation: 导电粒子各自包含聚合物基体颗粒和涂覆聚合物基础颗粒的导电层。 使导电粒子的粒径的位移为X％时的一个导电性粒子的压缩弹性变形特性K 由下式定义：K X = 3 /√2）。（S×S-3/2）。（R 1 -2/2）。F X / SUB>。 F X是导电颗粒的X％位移所需的载荷（N）。 S 是导电粒子的X％位移时的压缩变形量（mm）。 R是导电粒子的粒子半径（mm）。 导电粒子的粒径为50％时的压缩弹性变形特性K 50为20℃时为100〜50000N / mm 2，在 当导电颗粒的粒径为50％时，导电颗粒的粒径的恢复系数在20℃时不小于30％

公开(公告)号：US20070299159A1

公开(公告)日：2007-12-27

申请号：US11800831

申请日：2007-05-08

Applicant: Kazunobu Kamiya ,  Ryoji Kojima

Inventor： Kazunobu Kamiya ,  Ryoji Kojima

IPC: C08G64/38

CPC classification number: C08J3/128 ,  C01P2004/84 ,  C08J2333/06 ,  C09C3/10 ,  C09J9/02 ,  H01R4/04 ,  H01R4/58 ,  H05K3/323 ,  H05K2201/0221 ,  H05K2201/0233 ,  Y10T428/2982 ,  Y10T428/2991 ,  Y10T428/2993 ,  Y10T428/2995 ,  Y10T428/2996 ,  Y10T428/2998

Abstract: Resin particles comprised of an acrylic resin. Not only is the maximum compression deformation ratio thereof as great as 60% or more but also the load required for 60% compression deformation is as small as 60 mN or less. Wiring boards are therefore coupled in using an anisotropic conductive adhesive obtained by first manufacturing conductive particles having a conductive coating formed on a resin particle surface of the resin particles by adhering a conductive material to the surface of the above resin particles as a core. On dispersing the conductive particles in an adhesive material, the conductive particles sandwiched between metallic wires of the wiring boards are greatly deformed by a small load, so that the electrical devices having a high conduction reliability can be obtained.

Abstract translation: 由丙烯酸树脂构成的树脂颗粒。 其最大压缩变形率不仅高达60％以上，而且60％压缩变形所需的载荷也小至60mN以下。 因此，使用各向异性导电粘合剂，将导电性材料粘接到作为核心的上述树脂粒子的表面，使用各向异性导电粘合剂，将导电性粒子形成在树脂粒子表面上的导电性粒子。 在将导电粒子分散在粘合剂材料中时，夹在布线板的金属线之间的导电颗粒由于负载较小而大大地变形，从而可以获得具有高导电可靠性的电子器件。

公开(公告)号：US20070145585A1

公开(公告)日：2007-06-28

申请号：US11500018

申请日：2006-08-07

Applicant: Jung Bae Jun ,  Jin Gyu Park ,  Heung Se Lee

Inventor： Jung Bae Jun ,  Jin Gyu Park ,  Heung Se Lee

IPC: H01L23/48

CPC classification number: H05K3/323 ,  C08K9/02 ,  C09J9/02 ,  C09J11/04 ,  H01B1/22 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/2939 ,  H01L2224/294 ,  H01L2224/29444 ,  H01L2224/2989 ,  H01L2224/83851 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01056 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/0132 ,  H01L2924/0665 ,  H01L2924/07811 ,  H01L2924/14 ,  H01L2924/15788 ,  H01L2924/19042 ,  H05K2201/0218 ,  H05K2201/0233 ,  H01L2924/01028 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Embodiments of the present invention include a conductive particle that includes a conductive nickel/gold (Ni/Au) complex metal layer having a phosphorous content of less than about 1.5 weight percent formed on the surface of a polymer resin particle. Methods of forming the same are also included. A conductive particle with a Ni/Au complex metal layer having less than about 1.5 weight percent of phosphorous may have relatively high conductivity while providing relatively good adhesion of the Ni/Au metal layer to the polymer resin particle.Further embodiments of the present invention provide an anisotropic adhesive composition comprising a conductive particle according to an embodiment of the invention.

Abstract translation: 本发明的实施方案包括导电颗粒，其包含在聚合物树脂颗粒的表面上形成的具有小于约1.5重量％的磷含量的导电镍/金（Ni / Au）复合金属层。 也包括其形成方法。 具有小于约1.5重量％的磷的Ni / Au复合金属层的导电颗粒可以具有相对高的导电性，同时提供Ni / Au金属层对聚合物树脂颗粒的相对良好的粘附。 本发明的其它实施方案提供了包含根据本发明实施方案的导电颗粒的各向异性粘合剂组合物。

公开(公告)号：US06956635B2

公开(公告)日：2005-10-18

申请号：US09988408

申请日：2001-11-19

Applicant: Akira Mase

Inventor： Akira Mase

IPC: G02F1/13 ,  H01R4/04 ,  H05K3/32 ,  H05K3/36 ,  G02F1/1345

CPC classification number: G02F1/13452 ,  G02F2203/69 ,  H01R4/04 ,  H05K1/0306 ,  H05K1/148 ,  H05K3/323 ,  H05K3/361 ,  H05K3/368 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0221 ,  H05K2201/0233 ,  H05K2201/0272 ,  H05K2201/0326 ,  H05K2201/2036

Abstract: A liquid crystal device and a manufacturing method thereof are described. The device comprises a liquid crystal panel and an auxiliary panel formed with an IC circuit for supplying driving signals to the liquid crystal device. The auxiliary substrate is separately provided with the circuit and the function thereof is tested in advance of the assembling with the liquid crystal panel. By this procedure, the yield is substantially improved.

Abstract translation: 对液晶装置及其制造方法进行说明。 该装置包括液晶面板和形成有用于向液晶装置提供驱动信号的IC电路的辅助面板。 辅助基板分别设置有电路，其功能在与液晶面板的组装之前进行测试。 通过该程序，产率大大提高。

公开(公告)号：US06358627B2

公开(公告)日：2002-03-19

申请号：US09768112

申请日：2001-01-23

Applicant: Joseph A. Benenati ,  Claude L. Bertin ,  William T. Chen ,  Thomas E. Dinan ,  Wayne F. Ellis ,  Wayne J. Howell ,  John U. Knickerbocker ,  Mark V. Pierson ,  William R. Tonti ,  Jerzy M. Zalesinski

Inventor： Joseph A. Benenati ,  Claude L. Bertin ,  William T. Chen ,  Thomas E. Dinan ,  Wayne F. Ellis ,  Wayne J. Howell ,  John U. Knickerbocker ,  Mark V. Pierson ,  William R. Tonti ,  Jerzy M. Zalesinski

IPC: H01L2144

CPC classification number: H01L24/16 ,  G01R1/0483 ,  H01L24/11 ,  H01L24/12 ,  H01L24/17 ,  H01L24/83 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/11003 ,  H01L2224/11334 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/1319 ,  H01L2224/17051 ,  H01L2224/2919 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/3025 ,  H01L2924/351 ,  H05K1/111 ,  H05K3/321 ,  H05K2201/0133 ,  H05K2201/0212 ,  H05K2201/0221 ,  H05K2201/0233 ,  H05K2201/10234 ,  H05K2201/10734 ,  H05K2201/10992 ,  H05K2203/0307 ,  Y10T428/12472 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00014

Abstract: An integrated circuit assembly has pads of a chip electrically connected to pads of a substrate with rolling metal balls. A pliable material bonds the balls in movable contact with pads of the chip and substrate. Because the balls are relatively free to move, thermal expansion differences that would ordinarily cause enormous stresses in the attached joints of the prior art, simply cause rolling of the balls of the present invention, avoiding thermal stress altogether. Reliability of the connections is substantially improved as compared with C4 solder bumps, and chips can be safely directly mounted to such substrates as PC boards, despite substantial thermal mismatch.

Abstract translation: 集成电路组件具有与滚动金属球电连接到衬底的焊盘的芯片焊盘。 柔韧的材料将球与芯片和衬底的焊盘可动地接触。 由于球相对自由移动，因此在现有技术的连接接头中通常会引起巨大应力的热膨胀差异简单地导致本发明的滚珠滚动，从而完全避免热应力。 与C4焊料凸块相比，连接的可靠性大大提高，尽管存在大量的热失配，芯片可以安全地直接安装到诸如PC板的基板上。

公开(公告)号：US06332786B1

公开(公告)日：2001-12-25

申请号：US09480259

申请日：2000-01-11

Applicant: Yasuhiro Suga ,  Noriyuki Honda

Inventor： Yasuhiro Suga ,  Noriyuki Honda

IPC: H01R458

CPC classification number: H01L24/31 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/29017 ,  H01L2224/29082 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29399 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/14 ,  H01R4/04 ,  H05K3/323 ,  H05K2201/0221 ,  H05K2201/0233 ,  H05K2201/10674 ,  H05K2203/1189 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An anisotropic electrically conductive film which reduces a connection resistance value in electrical connection to assure reliable electric connection, and an electrical connecting device employing this anisotropic electrically conductive film. To this end, metal coated particles having a resin (40) as a core material are dispersed in an insulating adhesive (8) to give an anisotropic electrically eonductive film. The resin (40) of the metal coated particles is coated with a metal layer having a thickness of 1000 to 3000 Å.

Abstract translation: 各向异性导电膜，其降低电连接中的连接电阻值以确保可靠的电连接;以及使用该各向异性导电膜的电连接装置。 为此，将具有树脂（40）作为芯材的金属涂覆的颗粒分散在绝缘粘合剂（8）中，得到各向异性的电导膜。 金属涂覆颗粒的树脂（40）涂覆有厚度为1000至3000的金属层。