公开(公告)号：US20110183472A1

公开(公告)日：2011-07-28

申请号：US13079044

申请日：2011-04-04

Applicant: Charles W.C. Lin ,  Chia-Chung Wang

Inventor： Charles W.C. Lin ,  Chia-Chung Wang

IPC: H01L21/58

CPC classification number: H01L21/486 ,  H01L23/3677 ,  H01L24/16 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/83 ,  H01L24/85 ,  H01L33/483 ,  H01L33/642 ,  H01L2224/2919 ,  H01L2224/29339 ,  H01L2224/32188 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/83855 ,  H01L2224/85207 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01028 ,  H01L2924/01046 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/12041 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/19041 ,  H05K1/0204 ,  H05K3/0061 ,  H05K2201/09054 ,  H05K2201/10106 ,  H05K2203/0369 ,  H01L2924/00014 ,  H01L2924/0665 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A method of making a semiconductor chip assembly includes providing a post and a base, mounting an adhesive on the base including inserting the post into an opening in the adhesive, mounting a conductive layer on the adhesive including aligning the post with an aperture in the conductive layer, then flowing the adhesive upward between the post and the conductive layer, solidifying the adhesive, then providing a conductive trace that includes a pad, a terminal, a plated through-hole and a selected portion of the conductive layer, mounting a semiconductor device on the post, wherein a heat spreader includes the post and the base, electrically connecting the semiconductor device to the conductive trace and thermally connecting the semiconductor device to the heat spreader.

Abstract translation: 一种制造半导体芯片组件的方法包括提供柱和基座，在基底上安装粘合剂，包括将柱插入粘合剂中的开口中，将导电层安装在粘合剂上，包括使导柱与导电 然后使粘合剂在柱和导电层之间向上流动，固化粘合剂，然后提供包括衬垫，端子，电镀通孔和导电层的选定部分的导电迹线，安装半导体器件 在支柱上，其中散热器包括柱和基座，将半导体器件电连接到导电迹线并将半导体器件热连接到散热器。

公开(公告)号：US07983048B2

公开(公告)日：2011-07-19

申请号：US12525957

申请日：2007-11-30

Applicant: Junichi Sasaki ,  Tomoyuki Hino

Inventor： Junichi Sasaki ,  Tomoyuki Hino

IPC: H05K7/20

CPC classification number: H05K1/0204 ,  H01L23/3677 ,  H01L23/4093 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/32188 ,  H01L2924/00014 ,  H01L2924/01004 ,  H05K2201/09054 ,  H05K2201/10393 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: A mounting structure, in which semiconductor package 1 and heat sink 8 for dissipating heat generated from semiconductor package 1 are mounted on mounting board 3. The rear surface of semiconductor package 1 is bonded to the front surface of mounting board 3 facing the rear surface. Heat sink 8 is brought into contact with the rear surface of semiconductor package 1 via through-ole 5 formed on mounting board 3. Semiconductor package 1 and heat sink 8 are pressed to each other by the elastic force of clip 6.

Abstract translation: 其中将用于散发由半导体封装1产生的热量的半导体封装1和散热器8安装在安装板3上的安装结构。半导体封装1的后表面接合到安装板3的面向后表面的前表面。 散热器8通过形成在安装板3上的通孔5与半导体封装1的后表面接触。半导体封装1和散热器8通过夹子6的弹力彼此挤压。

公开(公告)号：US20110101410A1

公开(公告)日：2011-05-05

申请号：US12987166

申请日：2011-01-10

Applicant: Charles W.C. Lin ,  Chia-Chung Wang

Inventor： Charles W.C. Lin ,  Chia-Chung Wang

IPC: H01L33/64

CPC classification number: H01L21/486 ,  H01L23/3677 ,  H01L24/28 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L33/486 ,  H01L33/642 ,  H01L2224/2919 ,  H01L2224/29339 ,  H01L2224/32013 ,  H01L2224/32188 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48464 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/83855 ,  H01L2224/85205 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01046 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/12041 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/19041 ,  H05K1/0204 ,  H05K1/056 ,  H05K3/445 ,  H05K2201/09054 ,  H05K2201/10106 ,  H05K2203/0369 ,  H05K2203/063 ,  H01L2924/00014 ,  H01L2924/0665 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A semiconductor chip assembly includes a semiconductor device, a heat spreader, a conductive trace and first and second adhesives. The heat spreader includes a first post, a second post and a base. The conductive trace includes a pad and a terminal. The semiconductor device is electrically connected to the conductive trace and thermally connected to the heat spreader. The first post extends from the base in a first vertical direction into a first opening in the first adhesive, the second post extends from the base in a second vertical direction into a second opening in the second adhesive and the base is sandwiched between and extends laterally from the posts. The conductive trace provides signal routing between the pad and the terminal.

Abstract translation: 半导体芯片组件包括半导体器件，散热器，导电迹线以及第一和第二粘合剂。 散热器包括第一柱，第二柱和基部。 导电迹线包括焊盘和端子。 半导体器件电连接到导电迹线并热连接到散热器。 第一柱从第一垂直方向的基部延伸到第一粘合剂中的第一开口中，第二柱从第二垂直方向的基部延伸到第二粘合剂中的第二开口中，并且基部夹在两侧之间并且横向延伸 从帖子。 导电迹线提供焊盘和端子之间的信号路由。

公开(公告)号：US07934856B2

公开(公告)日：2011-05-03

申请号：US12751261

申请日：2010-03-31

Applicant: Tomohiro Sanpei ,  Yumiko Hayashida ,  Masahiro Izumi ,  Kiyoshi Otani ,  Yutaka Honda ,  Shinji Nogi

Inventor： Tomohiro Sanpei ,  Yumiko Hayashida ,  Masahiro Izumi ,  Kiyoshi Otani ,  Yutaka Honda ,  Shinji Nogi

IPC: F21V29/00

CPC classification number: H05K1/0203 ,  H01L33/60 ,  H01L33/62 ,  H01L33/642 ,  H01L2224/32188 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/3025 ,  H05K3/0061 ,  H05K2201/09054 ,  H05K2201/10106 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An illumination device includes a base board, an insulator, a conductor, a plurality of semiconductor light-emitting elements and a light-transmissive sealing member. The base board includes a surface and projection portions. The projection portion is formed to become gradually thicker from its end toward the surface of the base board. The insulator is formed on the surface. The conductor is formed on the insulator. The semiconductor light-emitting elements are mounted on the projection portions. The semiconductor light-emitting elements are electrically connected to the conductor via connection members. The sealing member covers the insulator, the projection portions, the semiconductor light-emitting elements and the connection members.

Abstract translation: 照明装置包括基板，绝缘体，导体，多个半导体发光元件和透光密封构件。 基板包括表面和突出部分。 突起部形成为从其端部朝向基板的表面逐渐变厚。 绝缘体形成在表面上。 导体形成在绝缘体上。 半导体发光元件安装在突出部分上。 半导体发光元件通过连接构件电连接到导体。 密封构件覆盖绝缘体，突出部分，半导体发光元件和连接构件。

公开(公告)号：US07929312B2

公开(公告)日：2011-04-19

申请号：US12263853

申请日：2008-11-03

Applicant: Masahiro Tamura

Inventor： Masahiro Tamura

IPC: H05K7/00

CPC classification number: H05K1/0204 ,  H01L2924/0002 ,  H05K1/021 ,  H05K1/182 ,  H05K3/0061 ,  H05K2201/0382 ,  H05K2201/09054 ,  H05K2201/09745 ,  H05K2201/10166 ,  H05K2201/10409 ,  H01L2924/00

Abstract: The present invention provides a device mounting structure and a device mounting method in which the short circuit can be prevented between a device lead part and a device ground part when the reflow process is executed. Thus, in the device mounting structure of the present invention, the device is contained in an aperture part provided in a wired board on a heat-radiating plate, a device main part of the device being fixed on the device ground part, a device lead part extending from opposing sides of the device main part is connected to a wiring part on the wired board, and an internal wall of the aperture part positioned just under the device lead part and the device ground part positioned on the heat-radiating plate are separated by a predetermined distance.

Abstract translation: 本发明提供了一种装置安装结构和装置安装方法，其中当执行回流处理时，可以防止在器件引线部分和器件接地部分之间的短路。 因此，在本发明的装置安装结构中，该装置被容纳在设置在散热板上的布线板的开口部中，该装置的装置主要部分固定在装置接地部上，装置引线 与设备主体的相对侧延伸的部分连接到布线板上的布线部分，位于设备引线部分正下方的开口部分的内壁和位于散热板上的设备接地部分分离 预定距离。

公开(公告)号：US07901993B2

公开(公告)日：2011-03-08

申请号：US12722526

申请日：2010-03-12

Applicant: Charles W. C. Lin ,  Chia-Chung Wang

Inventor： Charles W. C. Lin ,  Chia-Chung Wang

IPC: H01L21/44 ,  H01L21/48

CPC classification number: H05K1/0204 ,  F21K9/00 ,  H01L21/486 ,  H01L23/3677 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L33/483 ,  H01L33/642 ,  H01L2224/32188 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/19041 ,  H05K3/0061 ,  H05K3/386 ,  H05K2201/09054 ,  H05K2201/10106 ,  H05K2203/0369 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012

Abstract: A method of making a semiconductor chip assembly includes providing a post and a base, mounting an adhesive on the base including inserting the post into an opening in the adhesive, mounting a copper layer on the adhesive including aligning the post with an aperture in the copper layer, then flowing the adhesive into and upward in a gap located in the aperture between the post and the copper layer, solidifying the adhesive, then providing a conductive trace that includes a pad, a terminal, a silver coating and a copper core that is a selected portion of the copper layer, mounting a semiconductor device on the post, wherein an aluminum heat spreader includes the post and the base, electrically connecting the semiconductor device to the conductive trace and thermally connecting the semiconductor device to the heat spreader.

Abstract translation: 制造半导体芯片组件的方法包括提供柱和基座，将粘合剂安装在基座上，包括将柱插入粘合剂中的开口中，将铜层安装在粘合剂上，包括使柱与孔中的铜对准 然后使粘合剂在位于柱和铜层之间的孔中的间隙中和向上流动，固化粘合剂，然后提供导电迹线，其包括衬垫，端子，银涂层和铜芯，其是 铜层的选定部分，将半导体器件安装在柱上，其中铝散热器包括柱和基座，将半导体器件电连接到导电迹线并将半导体器件热连接到散热器。

公开(公告)号：US20100103622A1

公开(公告)日：2010-04-29

申请号：US12604126

申请日：2009-10-22

Applicant: Hiroshi KATO ,  Kyohei TAKEUCHI

Inventor： Hiroshi KATO ,  Kyohei TAKEUCHI

IPC: H05K7/20

CPC classification number: H05K7/08 ,  H05K1/0204 ,  H05K1/0206 ,  H05K3/0061 ,  H05K3/308 ,  H05K7/2049 ,  H05K7/205 ,  H05K2201/09054 ,  H05K2201/10416 ,  H05K2201/1059 ,  H05K2201/10689

Abstract: The electronic control device includes: a printed circuit board; a heat-generating member having a plurality of legs which are mounted on the printed circuit board by connections between the legs and the printed circuit board; and a casing which radiates heat that is transferred from the heat-generating member, wherein: the legs are connected via press-fit connections with the printed circuit board.

Abstract translation: 电子控制装置包括：印刷电路板; 具有多个腿部的发热部件，其通过腿部和印刷电路板之间的连接安装在印刷电路板上; 以及辐射从发热部件传递的热量的壳体，其中：腿部通过压配合连接到印刷电路板。

公开(公告)号：US20100087020A1

公开(公告)日：2010-04-08

申请号：US12626941

申请日：2009-11-30

Applicant: Charles W.C. Lin ,  Chia-Chung Wang

Inventor： Charles W.C. Lin ,  Chia-Chung Wang

IPC: H01L33/00 ,  H01L21/50

CPC classification number: H05K1/0204 ,  H01L21/486 ,  H01L23/3677 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L33/483 ,  H01L33/642 ,  H01L2224/32188 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/19041 ,  H05K3/0061 ,  H05K2201/09054 ,  H05K2201/10106 ,  H05K2203/0369 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A method of making a semiconductor chip assembly includes providing a post and a base that include a copper surface layer and an aluminum core, mounting an adhesive on the base including inserting the post into an opening in the adhesive, mounting a conductive layer on the adhesive including aligning the post with an aperture in the conductive layer, then flowing the adhesive into and upward in a gap located in the aperture between the post and the conductive layer, solidifying the adhesive, then providing a conductive trace that includes a pad, a terminal and a selected portion of the conductive layer, mounting a semiconductor device on a heat spreader that includes the post and the base, electrically connecting the semiconductor device to the conductive trace and thermally connecting the semiconductor device to the heat spreader.

Abstract translation: 一种制造半导体芯片组件的方法包括提供包括铜表面层和铝芯的柱和基座，在基底上安装粘合剂，包括将柱插入粘合剂中的开口中，将导电层安装在粘合剂上 包括使该柱与导电层中的孔对准，然后将粘合剂流入并位于位于柱和导电层之间的孔中的间隙中，固化粘合剂，然后提供导电迹线，其包括垫，端子 以及导电层的选定部分，将半导体器件安装在包括柱和基座的散热器上，将半导体器件电连接到导电迹线并将半导体器件热连接到散热器。

公开(公告)号：US07690817B2

公开(公告)日：2010-04-06

申请号：US11947075

申请日：2007-11-29

Applicant: Tomohiro Sanpei ,  Yumiko Hayashida ,  Masahiro Izumi ,  Kiyoshi Otani ,  Yutaka Honda ,  Shinji Nogi

Inventor： Tomohiro Sanpei ,  Yumiko Hayashida ,  Masahiro Izumi ,  Kiyoshi Otani ,  Yutaka Honda ,  Shinji Nogi

IPC: F21V29/00

CPC classification number: H05K1/0203 ,  H01L33/60 ,  H01L33/62 ,  H01L33/642 ,  H01L2224/32188 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/3025 ,  H05K3/0061 ,  H05K2201/09054 ,  H05K2201/10106 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An illumination device includes a base board, an insulator, a conductor, a plurality of semiconductor light-emitting elements and a light-transmissive sealing member. The base board includes a surface and projection portions. The projection portion is formed to become gradually thicker from its end toward the surface of the base board. The insulator is formed on the surface. The conductor is formed on the insulator. The semiconductor light-emitting elements are mounted on the projection portions. The semiconductor light-emitting elements are electrically connected to the conductor via connection members. The sealing member covers the insulator, the projection portions, the semiconductor light-emitting elements and the connection members.

Abstract translation: 照明装置包括基板，绝缘体，导体，多个半导体发光元件和透光密封构件。 基板包括表面和突出部分。 突起部形成为从其端部朝向基板的表面逐渐变厚。 绝缘体形成在表面上。 导体形成在绝缘体上。 半导体发光元件安装在突出部分上。 半导体发光元件通过连接构件电连接到导体。 密封构件覆盖绝缘体，突出部分，半导体发光元件和连接构件。

公开(公告)号：US20100072511A1

公开(公告)日：2010-03-25

申请号：US12626884

申请日：2009-11-28

Applicant: Charles W.C. Lin ,  Chia-Chung Wang

Inventor： Charles W.C. Lin ,  Chia-Chung Wang

IPC: H01L33/00

CPC classification number: H05K1/0204 ,  H01L21/486 ,  H01L23/3677 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L33/483 ,  H01L33/642 ,  H01L2224/32188 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/19041 ,  H05K3/0061 ,  H05K2201/09054 ,  H05K2201/10106 ,  H05K2203/0369 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A semiconductor chip assembly includes a semiconductor device, a heat spreader, a conductive trace and an adhesive. The semiconductor device is electrically connected to the conductive trace and thermally connected to the heat spreader. The heat spreader includes a post and a base that include a copper surface layer and an aluminum core. The post extends upwardly from the base into an opening in the adhesive, and the base extends laterally from the post. The adhesive extends between the post and the conductive trace and between the base and the conductive trace. The conductive trace provides signal routing between a pad and a terminal.

Abstract translation: 半导体芯片组件包括半导体器件，散热器，导电迹线和粘合剂。 半导体器件电连接到导电迹线并热连接到散热器。 散热器包括柱和包括铜表面层和铝芯的基座。 柱从基部向上延伸到粘合剂中的开口中，并且基部从柱横向延伸。 粘合剂在柱和导电迹线之间以及基部和导电迹线之间延伸。 导电迹线提供焊盘和端子之间的信号路由。