公开(公告)号：US08541689B2

公开(公告)日：2013-09-24

申请号：US12449611

申请日：2008-01-30

Applicant: Gerald Weidinger ,  Markus Leitgeb ,  Johannes Stahr ,  Günther Weichslberger ,  Andreas Zluc

Inventor： Gerald Weidinger ,  Markus Leitgeb ,  Johannes Stahr ,  Günther Weichslberger ,  Andreas Zluc

IPC: H05K1/00 ,  H05K3/02

CPC classification number: H05K1/00 ,  H05K1/183 ,  H05K3/4652 ,  H05K3/4691 ,  H05K2201/09127 ,  Y10T29/49155

Abstract: The invention relates to a method for removing a part of a substantially planar material layer (2) which is connected to at least one further, substantially planar material layer (9) in a connecting step. According to the invention, a zone where the material layers (2, 9) are not directly interconnected is provided in the zone where the part (11) is later on removed, said first zone being provided by applying a material (8) that prevents the material layers to be interconnected from sticking to each other. The invention also relates to a multilayer structure and to the use of the method and to a multilayer structure especially for producing a multilayer printed circuit board.

Abstract translation: 本发明涉及一种用于去除在连接步骤中连接到至少一个其它基本平坦的材料层（9）的基本平坦的材料层（2）的一部分的方法。 根据本发明，在部分（11）稍后被移除的区域中提供材料层（2,9）不直接互连的区域，所述第一区域通过施加材料（8）来提供，所述材料防止 待彼此相互连接的材料层。 本发明还涉及一种多层结构，以及该方法和多层结构的使用，特别是用于制造多层印刷电路板。

公开(公告)号：US08536457B2

公开(公告)日：2013-09-17

申请号：US12453627

申请日：2009-05-18

Applicant: Michimasa Takahashi

Inventor： Michimasa Takahashi

IPC: H05K1/00 ,  H05K1/11 ,  H05K3/36 ,  H05K3/20

CPC classification number: H05K3/4691 ,  H05K1/0218 ,  H05K1/142 ,  H05K3/36 ,  H05K3/4602 ,  H05K2201/0187 ,  H05K2201/0715 ,  H05K2201/0909 ,  H05K2201/09127 ,  H05K2201/096

Abstract: A wiring board including a main substrate having a base material and a conductive pattern formed on the base material, and a flex-rigid printed wiring board provided to the main substrate and having a rigid substrate and a flexible substrate connected to each other. The flex-rigid printed wiring board has a conductive pattern formed on the rigid substrate and/or the flexible substrate. The conductive pattern of the main substrate is electrically connected to the conductive pattern of the flex-rigid printed wiring board.

公开(公告)号：US08523391B2

公开(公告)日：2013-09-03

申请号：US11346388

申请日：2006-02-03

Applicant: Masahiro Ishizuka ,  Katsuyuki Okimura ,  Yoshinori Ueji ,  Ryuichiro Morinaka ,  Naoki Tatsumi ,  Tomoyuki Fukuda

Inventor： Masahiro Ishizuka ,  Katsuyuki Okimura ,  Yoshinori Ueji ,  Ryuichiro Morinaka ,  Naoki Tatsumi ,  Tomoyuki Fukuda

IPC: H05K1/14

CPC classification number: H05K3/0052 ,  F21K9/00 ,  H05K1/0286 ,  H05K2201/09127 ,  H05K2201/09972 ,  H05K2201/10106 ,  H05K2203/175

Abstract: A flat light source apparatus has a light source board which comprises unit boards, each unit board having a printed circuit board and a light source formed on the printed circuit board, wherein the unit boards are arranged adjacent to each other at least in one direction, and any pair of the unit boards adjacent to each other is integrated by a connecting portion provided therebetween. The apparatus also has a main wire which extends along a plane of the light source board, wherein the main wire extends between adjacent unit boards via the connecting portion such that all of the unit boards are electrically connected to each other by the main wire. The apparatus further has a branch wire for supplying electric power to the light source, the branch wire being provided in each unit board and branching from the main wire in each unit board.

Abstract translation: 平面光源装置具有包括单元板的光源板，每个单元板具有印刷电路板和形成在印刷电路板上的光源，其中，单元板至少在一个方向上彼此相邻布置， 并且彼此相邻的任何一对单元板通过设置在它们之间的连接部分而被集成。 该设备还具有沿着光源板的平面延伸的主线，其中主线经由连接部分在相邻单元板之间延伸，使得所有单元板通过主线彼此电连接。 该装置还具有用于向光源提供电力的分支线，分支线设置在每个单元板中并且在每个单元板中从主线分支。

公开(公告)号：US08450616B2

公开(公告)日：2013-05-28

申请号：US12752376

申请日：2010-04-01

Applicant: Chen-Chuan Chang

Inventor： Chen-Chuan Chang

IPC: H05K1/03 ,  H05K1/16

CPC classification number: H05K3/007 ,  H05K1/183 ,  H05K3/0035 ,  H05K3/06 ,  H05K3/062 ,  H05K3/108 ,  H05K3/428 ,  H05K3/4697 ,  H05K2201/09036 ,  H05K2201/09127 ,  H05K2201/09781 ,  H05K2203/0554 ,  Y10T29/49155 ,  Y10T29/49156

Abstract: A circuit board having a removing area is provided. The circuit board includes a first dielectric layer, a first laser resistant structure disposed on the first dielectric layer and located at the periphery of the removing area, a second dielectric layer disposed on the first dielectric layer, a circuit layer disposed on the second dielectric layer, a second laser resistant structure disposed on the second dielectric layer and located at the periphery of the removing area, and a third dielectric layer disposed on the second dielectric layer. The second laser resistant structure is insulated from the circuit layer. There is a gap between the second laser resistant structure and the circuit layer, and the vertical projection of the gap on a first surface overlaps the first laser resistant structure. The third dielectric layer exposes the portion of the circuit layer within the removing area.

Abstract translation: 提供具有去除区域的电路板。 所述电路板包括第一介电层，设置在所述第一介电层上并位于所述去除区的外围的第一耐光结构，设置在所述第一介电层上的第二介电层，设置在所述第二介电层上的电路层 设置在所述第二电介质层上并位于所述去除区域周边的第二激光阻挡结构，以及设置在所述第二电介质层上的第三电介质层。 第二个耐光结构与电路层绝缘。 在第二激光电阻结构和电路层之间存在间隙，并且第一表面上的间隙的垂直投影与第一激光结构重叠。 第三电介质层暴露出去除区域内的电路层的部分。

公开(公告)号：US08405999B2

公开(公告)日：2013-03-26

申请号：US12401141

申请日：2009-03-10

Applicant: Michimasa Takahashi

Inventor： Michimasa Takahashi

IPC: H05K1/00

CPC classification number: H05K3/4691 ,  H05K1/0218 ,  H05K3/4602 ,  H05K3/4652 ,  H05K2201/0187 ,  H05K2201/0715 ,  H05K2201/09127 ,  H05K2201/09509 ,  H05K2201/09563 ,  Y10T29/49124 ,  Y10T29/49155

Abstract: A flexible wiring board includes a first flexible base material with a conductor pattern formed thereon, a second flexible base material disposed adjacent to the first flexible base material and an insulating layer covering the first flexible base material and the second flexible base material. The insulating layer exposes at least one portion of the first flexible base material. A conductor pattern is formed on the insulating layer, and a plating layer is provided connecting the conductor pattern of the first flexible base material and the conductor pattern on the insulating layer.

Abstract translation: 柔性布线板包括：形成有导体图案的第一柔性基底材料，邻近第一柔性基底材料设置的第二柔性基底材料和覆盖第一柔性基底材料和第二柔性基底材料的绝缘层。 绝缘层暴露第一柔性基材的至少一部分。 在绝缘层上形成导体图案，并且在绝缘层上连接第一柔性基底材料的导体图形和导体图案的镀层。

公开(公告)号：US08404978B2

公开(公告)日：2013-03-26

申请号：US12873944

申请日：2010-09-01

Applicant: Nobuyuki Naganuma ,  Michimasa Takahashi ,  Masakazu Aoyama

Inventor： Nobuyuki Naganuma ,  Michimasa Takahashi ,  Masakazu Aoyama

IPC: H05K1/03

CPC classification number: H05K3/4691 ,  H05K2201/0391 ,  H05K2201/09127 ,  H05K2201/09854 ,  H05K2203/308 ,  Y10T29/49124

Abstract: A flex-rigid wiring board including an insulative substrate having a wiring layer which is formed on the insulative substrate and includes a conductor, a flexible wiring board positioned beside the insulative substrate and having a wiring layer, the wiring layer of the flexible wiring board including a conductor and being contained inside the flexible wiring board, and a first insulation layer positioned on the insulative substrate and the flexible wiring board such that a portion of the flexible wiring board is left exposed from the first insulation layer. The first insulation layer has a wiring layer which is formed on the first insulation layer and includes a conductor. The wiring layer of the first insulation layer has a thickness which is formed thicker than a thickness of the wiring layer of the flexible wiring board and a thickness of the wiring layer of the insulative substrate.

Abstract translation: 一种柔性刚性布线板，包括具有布线层的绝缘基板，所述布线层形成在所述绝缘基板上并且包括导体，柔性布线板位于所述绝缘基板的旁边并具有布线层，所述柔性布线板的布线层包括 导体，并且被容纳在柔性布线板内部;以及第一绝缘层，其位于绝缘基板和柔性布线板上，使得柔性布线板的一部分从第一绝缘层露出。 第一绝缘层具有形成在第一绝缘层上并包括导体的布线层。 第一绝缘层的布线层的厚度比柔性布线基板的布线层的厚度和绝缘基板的布线层的厚度厚。

公开(公告)号：US20120097326A1

公开(公告)日：2012-04-26

申请号：US13207438

申请日：2011-08-11

Applicant: MING-DE WANG ,  LI HUANG

Inventor： MING-DE WANG ,  LI HUANG

IPC: H05K3/00 ,  B32B38/10 ,  B32B37/14 ,  B32B38/04 ,  B32B37/02 ,  B32B37/12

CPC classification number: H05K3/4691 ,  H05K3/4652 ,  H05K2201/09127 ,  H05K2203/1461

Abstract: A method for manufacturing a rigid-flexible printed circuit board includes certain steps. A flexible substrate including an exposed portion and an attaching portion is provided. An adhesive sheet defining an opening, and a rigid copper clad laminate are provided. The rigid copper clad laminate includes an insulating layer and a copper layer. A blind first slit is defined in the insulating layer. The flexible substrate, the adhesive sheet and the copper clad laminate are laminated. An outer circuit is formed in the copper layer. A second slit is defined in the copper clad laminate, and the second slit is in communication with the first slit. A portion of the copper clad laminate is removed to expose the flexible portion of the flexible substrate.

Abstract translation: 用于制造刚挠柔性印刷电路板的方法包括一些步骤。 提供了包括暴露部分和附接部分的柔性基板。 提供限定开口的粘合片和刚性覆铜层压板。 刚性覆铜层压板包括绝缘层和铜层。 在绝缘层中限定盲目的第一狭缝。 层压柔性基板，粘合片和覆铜层压板。 在铜层中形成外部电路。 在覆铜层压板中限定第二狭缝，并且第二狭缝与第一狭缝连通。 去除覆铜层压板的一部分以暴露柔性基板的柔性部分。

公开(公告)号：US08165680B2

公开(公告)日：2012-04-24

申请号：US12899451

申请日：2010-10-06

Applicant: Robert J. Greenberg ,  Jerry Ok

Inventor： Robert J. Greenberg ,  Jerry Ok

IPC: A61N1/00

CPC classification number: A61N1/0543 ,  A61N1/36046 ,  A61N1/3752 ,  H01L23/057 ,  H01L23/10 ,  H01L23/4985 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/73204 ,  H01L2224/92125 ,  H01L2924/01079 ,  H01L2924/1461 ,  H05K1/0306 ,  H05K3/321 ,  H05K3/328 ,  H05K3/361 ,  H05K3/4015 ,  H05K3/423 ,  H05K3/4652 ,  H05K3/4691 ,  H05K2201/09127 ,  H05K2201/10287 ,  H05K2201/10295 ,  H05K2201/10977 ,  H05K2203/0733 ,  H05K2203/1446 ,  H01L2924/00

Abstract: The invention is directed to a method of bonding a hermetically sealed electronics package to an electrode or a flexible circuit and the resulting electronics package that is suitable for implantation in living tissue, such as for a retinal or cortical electrode array to enable restoration of sight to certain non-sighted individuals. The hermetically sealed electronics package is directly bonded to the flex circuit or electrode by electroplating a biocompatible material, such as platinum or gold, effectively forming a plated rivet-shaped connection, which bonds the flex circuit to the electronics package. The resulting electronic device is biocompatible and is suitable for long-term implantation in living tissue.

Abstract translation: 本发明涉及一种将气密密封的电子封装结合到电极或柔性电路的方法，以及所得的电子封装，其适于植入生物组织，例如用于视网膜或皮层电极阵列，以使视力恢复到 某些非目标人士。 密封电子封装通过电镀生物相容性材料（例如铂或金）直接结合到柔性电路或电极上，有效地形成电镀铆钉形连接，其将柔性电路连接到电子封装。 所得到的电子装置是生物相容的并且适合长期植入生物体组织。

公开(公告)号：US20120047727A1

公开(公告)日：2012-03-01

申请号：US13291134

申请日：2011-11-08

Applicant: Michimasa TAKAHASHI

Inventor： Michimasa TAKAHASHI

IPC: H05K3/36

CPC classification number: H05K3/4691 ,  H05K1/028 ,  H05K1/142 ,  H05K3/0032 ,  H05K3/4602 ,  H05K3/4652 ,  H05K2201/055 ,  H05K2201/0715 ,  H05K2201/0909 ,  H05K2201/09127 ,  H05K2201/09263 ,  H05K2201/09509 ,  H05K2201/096

Abstract: A method for manufacturing a flex-rigid wiring board, including preparing a flexible wiring board having a flexible base material and having a conductive layer over the flexible base material, making a cut in the flexible wiring board to form a cut portion, and folding at least one portion of the flexible wiring board using the cut portion to form one or more folding portions such that the flexible wiring board is extended in length, and connecting the flexible wiring board to a rigid wiring board including a rigid base material and having a conductive layer over the rigid base material.

Abstract translation: 一种柔性刚性布线板的制造方法，其特征在于，在柔性基材上形成具有柔性基材的柔性布线基板，并且在柔性基材上形成导电层，在柔性布线基板上切断，形成切断部， 使用所述切割部分的所述柔性布线板的至少一部分形成一个或多个折叠部分，使得所述柔性布线板的长度延伸，并且将所述柔性布线板连接到包括刚性基底材料并具有导电性的刚性布线板 层叠在刚性基材上。

公开(公告)号：US08121697B2

公开(公告)日：2012-02-21

申请号：US12861729

申请日：2010-08-23

Applicant: Robert J. Greenberg ,  Alfred E. Mann ,  Neil Talbot ,  Jerry Ok ,  Gaillard R. Nolan ,  Dau Min Zhou

Inventor： Robert J. Greenberg ,  Alfred E. Mann ,  Neil Talbot ,  Jerry Ok ,  Gaillard R. Nolan ,  Dau Min Zhou

IPC: A61N1/00

CPC classification number: A61N1/375 ,  A61N1/0543 ,  A61N1/36046 ,  A61N1/3758 ,  H05K1/0306 ,  H05K3/321 ,  H05K3/328 ,  H05K3/361 ,  H05K3/4015 ,  H05K3/423 ,  H05K3/4652 ,  H05K3/4691 ,  H05K2201/09127 ,  H05K2201/1028 ,  H05K2201/10287 ,  H05K2201/10295 ,  H05K2201/10977 ,  H05K2203/0733 ,  H05K2203/1446 ,  Y10T29/49155

Abstract: The invention is directed to a method of bonding a hermetically sealed electronics package to an electrode or a flexible circuit and the resulting electronics package that is suitable for implantation in living tissue, for a retinal or cortical electrode array to enable restoration of sight to certain non-sighted individuals. The hermetically sealed electronics package is directly bonded to the flex circuit or electrode by electroplating a biocompatible material, such as platinum or gold, effectively forming a plated rivet-shaped connection, which bonds the flex circuit to the electronics package. The resulting electronic device is biocompatible and is suitable for long-term implantation in living tissue.

Abstract translation: 本发明涉及一种将气密密封的电子封装结合到电极或柔性电路的方法，以及所得到的电子封装，其适于植入生物组织中，用于视网膜或皮质电极阵列，以使视力恢复到某些非 - 有个人 密封电子封装通过电镀生物相容性材料（例如铂或金）直接结合到柔性电路或电极上，有效地形成电镀铆钉形连接，其将柔性电路连接到电子封装。 所得到的电子装置是生物相容的并且适合长期植入生物体组织。