公开(公告)号：US20160034062A1

公开(公告)日：2016-02-04

申请号：US14806557

申请日：2015-07-22

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Jiuzhi Xue

IPC: G06F3/041 ,  H05K1/09 ,  H05K1/02

CPC classification number: G06F3/044 ,  G06F2203/04102 ,  G06F2203/04103 ,  G06F2203/04112 ,  H05K1/0296 ,  H05K3/1241 ,  H05K3/125 ,  H05K2201/0108 ,  H05K2201/09681 ,  H05K2203/0126 ,  H05K2203/1131 ,  H05K2203/1476

Abstract: A flexible conductive coating including: a first plurality of conductive traces extending in a first direction and a second plurality of conductive traces, each of the conductive traces including metal nanoparticles and ones of the second plurality of conductive traces being electrically coupled to ones of the first plurality of conductive traces, wherein each of the first plurality of conductive traces includes two substantially parallel long sides and two rounded short sides connecting the two long sides, and wherein more of the metal nanoparticles are at an outer edge of each of the conductive traces than are at an inner region bounded by the sides of each of the conductive traces.

Abstract translation: 柔性导电涂层，包括：沿第一方向延伸的第一多个导电迹线和第二多个导电迹线，每个导电迹线包括金属纳米颗粒，并且第二多个导电迹线中的一个导电迹线电耦合到第一 多个导电迹线，其中第一多个导电迹线中的每一个包括两个基本上平行的长边和连接两个长边的两个圆形短边，并且其中更多的金属纳米颗粒位于每个导电迹线的外边缘， 在由每个导电迹线的边界限定的内部区域。

公开(公告)号：US20160020500A1

公开(公告)日：2016-01-21

申请号：US14870687

申请日：2015-09-30

Applicant: NIPPON MEKTRON, LTD.

Inventor： Fumihiko MATSUDA

IPC: H01P3/08 ,  H05K1/02 ,  H05K3/00 ,  H05K3/42 ,  H01P11/00 ,  H05K1/11

CPC classification number: H05K3/42 ,  H01P3/085 ,  H05K1/0225 ,  H05K1/028 ,  H05K2201/0129 ,  H05K2201/09681

Abstract: A flexible printed circuit board having at least a set of strip line transmission path by being provided with a signal line, and a pair of ground layers and, includes a pleated part PL having a plurality of curved portions which are curved so as to be opened or closed, in which in the ground layers, mesh ground layers in which conductive portions are provided in a mesh shape, and solid ground layers in which the conductive portions are provided in a planar state, are provided, in which the mesh ground layers are arranged on an outer peripheral side of the curved portions PL2, and the solid ground layers are arranged on an inner peripheral side of the curved portions.

Abstract translation: 柔性印刷电路板，具有通过设置信号线的至少一组带状线传输路径和一对接地层，并且包括具有多个弯曲部分的打褶部分PL，该弯曲部分弯曲以便打开 或闭合，其中在接地层中设置有网状的导电部分的网状接地层和其中导电部分设置为平面状态的固体接地层，其中网状接地层为 设置在弯曲部PL2的外周侧，固体接地层配置在弯曲部的内周侧。

公开(公告)号：US09235309B2

公开(公告)日：2016-01-12

申请号：US14707659

申请日：2015-05-08

Applicant: SYNAPTICS INCORPORATED

Inventor： James Dunphy ,  Bob Lee Mackey ,  Joseph Kurth Reynolds

IPC: G06F3/044 ,  G06F3/041 ,  H05K1/02

CPC classification number: G06F3/044 ,  G06F3/0412 ,  G06F2203/04112 ,  H05K1/0296 ,  H05K2201/09681 ,  Y10T29/49105

Abstract: An input device having a plurality of low-visibility sensor electrodes and method for fabricating the same are provided. In one example, an input device includes a display device having an array of pixels and a plurality of sensor electrodes disposed on a viewing side of the display device. At least a first sensor electrode of the plurality of sensor electrodes includes a plurality of spaced apart conductive traces forming a conductive mesh, wherein mesh having a first periodicity defined by intersections of the conductive traces forming the mesh. A terminal portion of one of the conductive traces terminates at an edge of the first sensor electrode and has an attached light occluding element. The attached light occluding element is disposed over a subpixel having the same color as a subpixel which an intersecting trace would lay over when the intersection occurs in an interior region of the sensor electrode.

Abstract translation: 提供具有多个低能见度传感器电极的输入装置及其制造方法。 在一个示例中，输入装置包括具有像素阵列的显示装置和设置在显示装置的观看侧上的多个传感器电极。 多个传感器电极的至少第一传感器电极包括形成导电网的多个间隔开的导电迹线，其中网状物具有由形成网状物的导电迹线的交叉点限定的第一周期性。 导电迹线之一的端子部分终止于第一传感器电极的边缘并且具有附接的遮光元件。 附着的遮光元件设置在具有与子像素相同的颜色的子像素上，当相交轨迹在传感器电极的内部区域中发生时，相交轨迹将覆盖。

公开(公告)号：US09182858B2

公开(公告)日：2015-11-10

申请号：US13533127

申请日：2012-06-26

Applicant: Taik Min Lee ,  In Young Kim ,  Jeong Dai Jo ,  Dong-Soo Kim

Inventor： Taik Min Lee ,  In Young Kim ,  Jeong Dai Jo ,  Dong-Soo Kim

IPC: H05K3/10 ,  G06F3/044 ,  G06F3/045 ,  H01L31/0224 ,  H01R43/04 ,  H05K3/12 ,  G02F1/1343

CPC classification number: G06F3/044 ,  G02F1/13439 ,  G06F3/045 ,  H01L31/022466 ,  H01R43/04 ,  H05K3/1275 ,  H05K2201/09681 ,  H05K2203/0113 ,  H05K2203/0534 ,  Y10T29/49217

Abstract: The present invention relates to a method for burying a conductive mesh in a transparent electrode, and more particularly, to a method which prevents a conductive mesh from protruding from a transparent electrode by burying the conductive mesh in the transparent electrode.

Abstract translation: 本发明涉及一种在透明电极中埋入导电网的方法，更具体地说，涉及一种通过将导电网掩埋在透明电极中来防止导电网从透明电极突出的方法。

公开(公告)号：US20150303154A1

公开(公告)日：2015-10-22

申请号：US14789885

申请日：2015-07-01

Applicant: Lockheed Martin Corporation

Inventor： Stephen Gonya ,  Jesse Iannon

IPC: H01L23/00 ,  H05K9/00

CPC classification number: G21F3/00 ,  H01L23/552 ,  H01L23/573 ,  H01L2924/0002 ,  H05K1/02 ,  H05K1/0209 ,  H05K1/0275 ,  H05K2201/0715 ,  H05K2201/09681 ,  H01L2924/00

Abstract: An X-ray obscuration (XRO) film comprising one or more metallic wire mesh layers and an adjacent layer of indium foil having portions which extend into openings of the wire mesh and in contact with metallic portions thereof. The XRO film can be capable of absorbing at least a portion of X-ray energy thereby creating an interference pattern when the XRO film is coupled with an electronic circuit and placed between an X-ray source and an X-ray detector and subjected to radiographic inspection. The interference pattern can create sufficient visual static to effectively obscure circuit lines in the electronic circuit when subjected to radiographic inspection techniques. The XRO film can be substantially thinner than existing solutions for preventing X-ray inspection with an exemplary embodiment being no more than 5 mils thick. The metallic XRO film can also provide electromagnetic shielding and/or heat dissipation for electronic circuits.

Abstract translation: 包括一个或多个金属丝网层和相邻的铟箔层的X射线遮蔽（XRO）膜，其具有延伸到金属丝网的开口中并与其金属部分接触的部分。 XRO膜能够吸收X射线能量的至少一部分，从而当XRO膜与电子电路耦合并且放置在X射线源和X射线检测器之间并经受射线照相时产生干涉图案 检查。 干涉图案可以产生足够的视觉静电，以在经受射线照相检查技术时有效地遮蔽电子电路中的电路线。 XRO膜可以比用于防止X射线检查的现有解决方案薄得多，示例性实施例不超过5密耳厚。 金属XRO膜还可以为电子电路提供电磁屏蔽和/或散热。

公开(公告)号：US20150237713A1

公开(公告)日：2015-08-20

申请号：US14184575

申请日：2014-02-19

Applicant: Adel A. Elsherbini ,  Ravindranath Mahajan ,  John S. Guzek ,  Nitin A. Deshpande

Inventor： Adel A. Elsherbini ,  Ravindranath Mahajan ,  John S. Guzek ,  Nitin A. Deshpande

IPC: H05K1/02 ,  H01L23/13 ,  H01L25/00 ,  H05K3/36 ,  H01L25/065 ,  H05K1/14 ,  H05K1/11 ,  H01L23/552 ,  H01L23/538

CPC classification number: H05K1/147 ,  H01L23/13 ,  H01L23/49833 ,  H01L23/552 ,  H01L25/0655 ,  H01L25/50 ,  H01L2224/13025 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73253 ,  H01L2924/15192 ,  H01L2924/3025 ,  H05K1/0218 ,  H05K3/361 ,  H05K2201/09245 ,  H05K2201/09681 ,  Y10T29/49126

Abstract: Embodiments of the present disclosure are directed towards electro-magnetic interference (EMI) shielding techniques and configurations. In one embodiment, an apparatus includes a first substrate, a die having interconnect structures coupled with the first substrate to route input/output (I/O) signals between the die and the first substrate and a second substrate coupled with the first substrate, wherein the die is disposed between the first substrate and the second substrate and at least one of the first substrate and the second substrate include traces configured to provide electro-magnetic interference (EMI) shielding for the die. Other embodiments may be described and/or claimed.

Abstract translation: 本公开的实施例涉及电磁干扰（EMI）屏蔽技术和配置。 在一个实施例中，一种装置包括第一衬底，具有与第一衬底耦合的互连结构的管芯以在管芯和第一衬底之间路由输入/输出（I / O）信号和与第一衬底耦合的第二衬底， 芯片设置在第一基板和第二基板之间，并且第一基板和第二基板中的至少一个包括被配置为为管芯提供电磁干扰（EMI）屏蔽的迹线。 可以描述和/或要求保护其他实施例。

公开(公告)号：US20150179973A1

公开(公告)日：2015-06-25

申请号：US14624001

申请日：2015-02-17

Applicant: Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO ,  Koninklijke Philips N.V.

Inventor： Edward Willem Albert YOUNG ,  Dorothee Christine HERMES ,  Leonardus Maria TOONEN ,  Herbert LIFKA

IPC: H01L51/52 ,  H01L51/00 ,  H01L51/56

CPC classification number: H01L51/5212 ,  B32B15/04 ,  B32B2307/202 ,  B32B2457/00 ,  B32B2457/12 ,  H01L51/0024 ,  H01L51/003 ,  H01L51/5203 ,  H01L51/5253 ,  H01L51/5256 ,  H01L51/56 ,  H01L2251/5338 ,  H01L2251/5361 ,  H05K1/0265 ,  H05K1/0274 ,  H05K1/0287 ,  H05K1/0393 ,  H05K1/16 ,  H05K3/20 ,  H05K2201/0195 ,  H05K2201/09681

Abstract: A foil comprises a substrate carrying an electrically conductive structure. The electrically conductive structure is embedded in a barrier layer structure having a first inorganic layer, a second inorganic layer and an organic layer between said inorganic layers, and the organic layer is partitioned by the electrically conductive structure into organic layer portions. The electrically conductive structure comprises an enclosing mesh and a plurality of mutually insulated electrically conductive elements. The enclosing mesh encloses mutually separate zones wherein respective ones of the mutually insulated electrically conductive elements are arranged.

Abstract translation: 箔包括承载导电结构的基底。 导电结构被嵌入到具有第一无机层，第二无机层和有机层之间的阻挡层结构中，并且有机层被导电结构分隔成有机层部分。 导电结构包括封闭网和多个相互绝缘的导电元件。 封闭的网状物包围彼此分离的区域，其中布置相互绝缘的导电元件中的相应的区域。

公开(公告)号：US20150170996A1

公开(公告)日：2015-06-18

申请号：US14132287

申请日：2013-12-18

Applicant: International Business Machines Corporation

Inventor： Dulce M. Altabella Lazzi ,  Wiren D. Becker ,  Jinwoo Choi ,  Rohan U. Mandrekar

IPC: H01L23/48 ,  H01L21/768

CPC classification number: H01L23/50 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L2224/16225 ,  H01L2924/0002 ,  H01L2924/15174 ,  H01L2924/15311 ,  H05K1/0222 ,  H05K1/0225 ,  H05K1/116 ,  H05K2201/09309 ,  H05K2201/09681 ,  H01L2924/00

Abstract: In some embodiments, a multi-layered package includes a plurality of mesh planes. The multi-layered package includes at least one through-mesh-plane via positioned to traverse the plurality of mesh planes, wherein the at least one through-mesh-plane via is to intersect the plurality of mesh planes. The multi-layered package includes at least one signal via positioned to traverse the plurality of mesh planes, wherein the at least one signal via is positioned within an opening of the plurality of mesh planes and is positioned adjacent to the at least one through through-mesh-plane via.

Abstract translation: 在一些实施例中，多层包装包括多个网格平面。 所述多层封装包括至少一个贯穿所述多个网格平面的通孔平面通路，其中所述至少一个通孔平面通孔与所述多个网格平面相交。 所述多层封装包括至少一个经过定位以穿过所述多个网格平面的信号，其中所述至少一个信号通孔定位在所述多个网格平面的开口内，并且被定位成与所述至少一个通孔相邻， 网格平面通孔。

公开(公告)号：US08941012B2

公开(公告)日：2015-01-27

申请号：US13792243

申请日：2013-03-11

Applicant: Novatek Microelectronics Corp.

Inventor： Yu-Chang Pai

IPC: H05K1/09 ,  H05K1/02

CPC classification number: H05K1/0228 ,  H05K1/0224 ,  H05K1/0245 ,  H05K1/0253 ,  H05K1/0393 ,  H05K1/09 ,  H05K2201/09272 ,  H05K2201/09681

Abstract: A ground line structure adapted to a flexible circuit board is provided. The ground line structure includes a plurality of ground line structure units located on the flexible circuit board to form a meshed pattern. The ground line structure units include a plurality of ground line edge segments, a ground line middle segment and a plurality of ground line connecting segments. The ground line edge segments define an edge shape of each ground line structure unit. The edge shape of each ground line structure unit is a hexagon. The ground line connecting segments are configured to connect the ground line middle segment and the ground line edge segments. The ground line edge segments, the ground line middle segment and the ground line connecting segments form a plurality of pentagonal electrode structures within the hexagonal ground line structure unit. A flexible circuit board including the ground line structure is also provided.

Abstract translation: 提供了适用于柔性电路板的接地线结构。 地线结构包括位于柔性电路板上的多个接地线结构单元，以形成网格图案。 接地线结构单元包括多个接地线边缘段，地线中间段和多个接地线连接段。 地线边缘段限定每个接地线结构单元的边缘形状。 每个地线结构单元的边缘形状是六边形。 接地线连接段配置为连接接地线中间段和接地线边缘段。 接地线边缘段，地线中间段和接地线连接段在六边形接地线结构单元内形成多个五边形电极结构。 还提供了包括接地线结构的柔性电路板。

公开(公告)号：US20140331482A1

公开(公告)日：2014-11-13

申请号：US14341834

申请日：2014-07-27

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： JINWOO CHOI ,  SUNGJUN CHUN ,  JASON L. FRANKEL ,  PAUL R. WALLING ,  ROGER D. WEEKLY

IPC: H05K1/02 ,  H05K3/46

CPC classification number: H05K1/0224 ,  G06F17/5081 ,  H05K1/116 ,  H05K2201/09681 ,  H05K2201/09718 ,  H05K2201/09727 ,  Y10T29/49004 ,  Y10T29/49155 ,  Y10T29/53022

Abstract: A computer system receives an initial multilayered ceramic package design. The computer system maintains a first selection of mesh line segments of the mesh line segments at a first width and adjusts a second selection of mesh line segments of the plurality of mesh line segments to a second width. The computer system controls fabrication of the multilayered ceramic package based on the modified multilayered ceramic package design.

Abstract translation: 计算机系统接收初始多层陶瓷封装设计。 计算机系统以第一宽度维持网格线段的网格线段的第一选择，并且将多个网格线段的网格线段的第二选择调整到第二宽度。 计算机系统基于改进的多层陶瓷封装设计来控制多层陶瓷封装的制造。