公开(公告)号：US09423562B2

公开(公告)日：2016-08-23

申请号：US14032250

申请日：2013-09-20

Applicant: Eastman Kodak Company

Inventor： Ronald Steven Cok

IPC: H01B13/00 ,  G02B6/122 ,  G02B6/138 ,  H05K3/10 ,  G06F3/044 ,  H05K3/12 ,  H01L23/538 ,  H01L21/768 ,  G02B6/42 ,  G02B6/13 ,  H01L31/12 ,  H01L31/18 ,  H05K1/02 ,  H05K3/32 ,  G02B6/12

CPC classification number: G02B6/122 ,  G02B6/13 ,  G02B6/138 ,  G02B6/4214 ,  G02B6/4274 ,  G02B2006/121 ,  G02B2006/12104 ,  G02B2006/12126 ,  G02B2006/12147 ,  G06F3/044 ,  H01L21/76895 ,  H01L23/5386 ,  H01L31/12 ,  H01L31/18 ,  H01L2924/0002 ,  H05K1/0274 ,  H05K3/10 ,  H05K3/101 ,  H05K3/1258 ,  H05K3/32 ,  H05K2201/0108 ,  H05K2201/09036 ,  H05K2201/10356 ,  H05K2203/0108 ,  H01L2924/00

Abstract: A method of making a multi-level micro-wire structure includes imprinting first micro-channels in a curable first layer over a substrate, curing the first layer, and locating and curing a curable conductive ink in the first micro-channels to form first micro-wires. Multi-level second micro-channels are imprinted in a curable second layer in contact with the first layer with a multi-level stamp, the second layer is cured, and a curable conductive ink is located and cured in the multi-level second micro-channels to form multi-level second micro-wires. At least one of the multi-level second micro-channels contacts at least one first micro-wire. A multi-level second micro-wire in at least one of the multi-level second micro-channels is in electrical contact with at least one first micro-wire.

Abstract translation: 制造多级微线结构的方法包括在基板上的可固化的第一层中印刷第一微通道，固化第一层，以及定位和固化第一微通道中的可固化导电油墨以形成第一微通道 电线。 多级第二微通道印刷在与第一层接触的可固化第二层中，其具有多级印模，第二层被固化，并且可固化导电油墨在多级第二微孔中定位和固化， 通道形成多级第二微线。 多级第二微通道中的至少一个接触至少一个第一微线。 至少一个多级第二微通道中的多级第二微线与至少一个第一微线电接触。

公开(公告)号：US09417385B2

公开(公告)日：2016-08-16

申请号：US14032239

申请日：2013-09-20

Applicant: Eastman Kodak Company

Inventor： Ronald Steven Cok

IPC: H01B13/00 ,  G02B6/122 ,  G02B6/138 ,  H05K3/10 ,  H05K3/12 ,  H01L23/538 ,  H01L21/768 ,  G02B6/42 ,  G02B6/13 ,  H01L31/12 ,  H01L31/18 ,  H05K1/02 ,  G06F3/044 ,  H05K3/32 ,  G02B6/12

CPC classification number: G02B6/122 ,  G02B6/13 ,  G02B6/138 ,  G02B6/4214 ,  G02B6/4274 ,  G02B2006/121 ,  G02B2006/12104 ,  G02B2006/12126 ,  G02B2006/12147 ,  G06F3/044 ,  H01L21/76895 ,  H01L23/5386 ,  H01L31/12 ,  H01L31/18 ,  H01L2924/0002 ,  H05K1/0274 ,  H05K3/10 ,  H05K3/101 ,  H05K3/1258 ,  H05K3/32 ,  H05K2201/0108 ,  H05K2201/09036 ,  H05K2201/10356 ,  H05K2203/0108 ,  H01L2924/00

Abstract: A method of making a multi-level micro-wire structure includes imprinting first micro-channels in a curable first layer over a substrate with a first stamp, curing the first layer, and locating and curing a curable conductive ink in the first micro-channels to form first micro-wires. Second micro-channels are imprinted in a curable second layer in contact with the first layer with a second stamp, the second layer is cured, and a curable conductive ink is located and cured in the second micro-channels to form second micro-wires. At least one of the second micro-channels contacts at least one first micro-wire and a second micro-wire in at least one of the second micro-channels is in electrical contact with at least one first micro-wire.

Abstract translation: 一种制造多级微线结构的方法包括：在第一印模上固化第一层，并在第一微通道中固化和固化可固化的导电油墨，将可固化的第一层中的第一微通道压印在衬底上; 以形成第一微线。 将第二微通道印刷在与第一层接触的可固化第二层中，第二印模固化，并且可固化导电油墨在第二微通道中定位和固化以形成第二微细线。 第二微通道中的至少一个与至少一个第二微通道中的至少一个第一微线和第二微线接触，与至少一个第一微线电接触。

公开(公告)号：US20160079710A1

公开(公告)日：2016-03-17

申请号：US14949958

申请日：2015-11-24

Applicant: CommScope, Inc. of North Carolina

Inventor： Richard A. Schumacher

IPC: H01R13/6473 ,  H01R13/6461 ,  H01R24/62

CPC classification number: H01R13/6473 ,  H01R13/6466 ,  H01R24/64 ,  H05K1/0219 ,  H05K1/0228 ,  H05K1/024 ,  H05K1/0245 ,  H05K1/025 ,  H05K1/117 ,  H05K1/165 ,  H05K2201/0187 ,  H05K2201/0191 ,  H05K2201/09672 ,  H05K2201/09727 ,  H05K2201/09781 ,  H05K2201/1034 ,  H05K2201/10356

Abstract: Communications plugs are provided that include a housing that receives the conductors of the communication cable. A printed circuit board is mounted at least partially within the housing. A plurality of plug contacts are on the printed circuit board, and the printed circuit board includes a plurality of conductive paths that electrically connect respective ones of the conductors to respective ones of the plug contacts. First and second of the conductive paths are arranged as a first differential pair of conductive paths that comprise a portion of a first differential transmission line through the communications plug, where the first differential transmission line includes a first transition region where the impedance of the first differential transmission line changes by at least 20% and a second transition region impedance of the first differential transmission line changes by at least 20%.

Abstract translation: 提供通信插头，其包括容纳通信电缆的导体的壳体。 印刷电路板至少部分地安装在壳体内。 多个插头触点位于印刷电路板上，并且印刷电路板包括多个导电路径，其将相应的导体电连接到相应的插头触点。 第一和第二导电路径被布置为包括通过通信插头的第一差分传输线的一部分的导电路径的第一差分对，其中第一差分传输线包括第一过渡区，其中第一差分 传输线改变至少20％，第一差分传输线的第二过渡区阻抗改变至少20％。

公开(公告)号：US09288916B2

公开(公告)日：2016-03-15

申请号：US13669862

申请日：2012-11-06

Applicant: OLYMPUS CORPORATION

Inventor： Mikio Nakamura

IPC: H05K1/16 ,  H05K1/09 ,  H05K1/00 ,  H05K1/18 ,  H05K3/40 ,  H05K3/32

CPC classification number: H05K3/403 ,  H05K3/32 ,  H05K2201/10356 ,  Y10T29/49117

Abstract: A structure includes a substrate on a surface of which a functional element and a first electrode are disposed, wherein the functional element provides a predetermined function by an operation based on an electrical signal and the first electrode is coupled to the functional element; an insulating member in a thin film that covers the surface of the substrate and extends from an end of the substrate; and a second electrode disposed on a substrate-side surface of the extending portion, which is extending from the end of the substrate, of the insulating member, wherein the second electrode is coupled to the first electrode. The second electrode is electrically coupled to a coaxial cable.

Abstract translation: 一种结构包括其表面上设置有功能元件和第一电极的基板，其中所述功能元件通过基于电信号的操作提供预定功能，并且所述第一电极耦合到所述功能元件; 覆盖基板的表面并从基板的端部延伸的薄膜中的绝缘构件; 以及设置在所述延伸部的从所述基板的端部延伸的所述基板侧表面上的所述绝缘构件的第二电极，其中所述第二电极耦合到所述第一电极。 第二电极电耦合到同轴电缆。

公开(公告)号：US09223087B2

公开(公告)日：2015-12-29

申请号：US14097772

申请日：2013-12-05

Applicant: Ronald Steven Cok ,  Todd Mathew Spath

Inventor： Ronald Steven Cok ,  Todd Mathew Spath

IPC: G02B6/12 ,  G02B6/122 ,  G02B6/138 ,  H05K3/12 ,  H01L23/538 ,  H01L21/768 ,  G02B6/42 ,  G02B6/13 ,  H01L31/12 ,  H01L31/18 ,  H05K1/02 ,  G06F3/044 ,  H05K3/32

CPC classification number: G02B6/122 ,  G02B6/13 ,  G02B6/138 ,  G02B6/4214 ,  G02B6/4274 ,  G02B2006/121 ,  G02B2006/12104 ,  G02B2006/12126 ,  G02B2006/12147 ,  G06F3/044 ,  H01L21/76895 ,  H01L23/5386 ,  H01L31/12 ,  H01L31/18 ,  H01L2924/0002 ,  H05K1/0274 ,  H05K3/10 ,  H05K3/101 ,  H05K3/1258 ,  H05K3/32 ,  H05K2201/0108 ,  H05K2201/09036 ,  H05K2201/10356 ,  H05K2203/0108 ,  H01L2924/00

Abstract: An imprinted optical micro-channel structure for transmitting light to an optical receiver or receiving light from an optical transmitter includes a substrate and a cured optical layer formed in relation to the substrate. The cured optical layer includes one or more optical micro-channels imprinted in the cured optical layer. Each optical micro-channel includes a cured light-transparent material forming a light-pipe that transmits light in the optical micro-channel. The optical transmitter is located in alignment with a light-pipe for transmitting light through the light-pipe or the optical receiver is located in alignment with a light-pipe for receiving light from the light-pipe.

Abstract translation: 用于将光传输到光接收器或从光发射器接收光的印刷光学微通道结构包括基板和相对于基板形成的固化光学层。 固化的光学层包括印刷在固化的光学层中的一个或多个光学微通道。 每个光学微通道包括形成在光学微通道中透射光的光管的固化透光材料。 光发射器与光管对准，用于通过光管传输光，或者光接收器与用于接收来自光管的光的光管对准。

公开(公告)号：US20150359420A1

公开(公告)日：2015-12-17

申请号：US14728857

申请日：2015-06-02

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Yuichi Hatase ,  Haruhiko Kohno ,  Ken Shimonosono

IPC: A61B1/05 ,  H05K3/32 ,  A61B1/00

CPC classification number: A61B1/051 ,  A61B1/0011 ,  A61B1/00114 ,  A61B1/00183 ,  A61B1/0052 ,  A61B1/0055 ,  A61B1/0057 ,  G02B23/2484 ,  H05K1/0216 ,  H05K3/32 ,  H05K2201/10356 ,  Y10T29/49131

Abstract: An imaging unit at a tip end portion of an insertion section has a board on which the image pickup device is installed, a cable through which a signal is input to and output from the board, and a ground bar which is provided so as to protrude from the surface of the board and is connected to a ground of the board. In a distal portion of the cable on the imaging unit side, a shield part is connected to the ground of the board through the ground bar and a core line is directly assembled on the board. The ground bar supports the cable on the board such that the height of the cable in the vicinity of a board-mounting portion of the cable becomes greater than or equal to a predetermined value.

Abstract translation: 插入部的前端部的成像单元具有安装有摄像装置的基板，信号从板输入并从板输出的电缆以及设置成突出的接地棒 从板的表面，并连接到板的地面。 在成像单元侧的电缆的远端部分中，屏蔽部分通过接地棒连接到电路板的地面，芯线直接组装在电路板上。 接地棒支撑板上的电缆，使得电缆的板安装部分附近的电缆的高度变得大于或等于预定值。

公开(公告)号：US08946566B2

公开(公告)日：2015-02-03

申请号：US13646610

申请日：2012-10-05

Applicant: Apple Inc.

Inventor： John J. Baker

IPC: H01L23/28

CPC classification number: H05K3/284 ,  H05K3/28 ,  H05K2201/09972 ,  H05K2201/10189 ,  H05K2201/10356 ,  H05K2201/10446 ,  H05K2203/1327 ,  H05K2203/1476 ,  Y10T29/49146

Abstract: An improved method for producing a PCB assembly requiring at least two different encapsulants is disclosed. The PCB assembly may have two or more separate regions in which electronic devices are attached. In each region, a unique encapsulant with different mechanical, electrical, physical and or chemical properties is used according to the particular requirements of the electronic devices in that region.

Abstract translation: 公开了一种用于生产需要至少两种不同密封剂的PCB组件的改进方法。 PCB组件可以具有两个或更多个独立的区域，其中电子设备被附接。 在每个区域中，根据该区域的电子设备的特殊要求，使用具有不同机械，电学，物理和/或化学性质的独特的密封剂。

公开(公告)号：US08931684B2

公开(公告)日：2015-01-13

申请号：US14200745

申请日：2014-03-07

Applicant: Apple Inc.

Inventor： Michael Nikkhoo ,  Amir Salehi

IPC: B23K31/02 ,  B23K1/002 ,  H01R43/02 ,  H05K13/00 ,  B23K3/00 ,  H05K3/34 ,  H01R12/53

CPC classification number: H01R43/0242 ,  B23K1/0016 ,  B23K3/00 ,  B23K3/0475 ,  H01R12/53 ,  H01R43/0207 ,  H01R43/0249 ,  H05K3/3405 ,  H05K3/3494 ,  H05K13/0015 ,  H05K2201/094 ,  H05K2201/10287 ,  H05K2201/10356 ,  H05K2203/101 ,  Y10T29/49179

Abstract: The described embodiment relates generally to the field of inductive bonding. More specifically an inductive heater designed for use in assembling electronics is disclosed. A number of methods for shaping a magnetic field are disclosed for the purpose of completing an inductive bonding process without causing harm to unshielded adjacent electrical components.

Abstract translation: 所描述的实施例一般涉及感性接合领域。 更具体地，公开了一种设计用于组装电子设备的感应加热器。 公开了用于成形磁场的多种方法，用于完成感应接合工艺而不对非屏蔽的相邻电气部件造成伤害。

公开(公告)号：US20140349496A1

公开(公告)日：2014-11-27

申请号：US14287573

申请日：2014-05-27

Applicant: HON HAI PRECISION INDUSTRY CO., LTD.

Inventor： JIAN-JUN ZHU ,  JERRY WU

IPC: H01R13/646

CPC classification number: H01R13/6471 ,  H01R9/034 ,  H01R13/6585 ,  H05K1/0219 ,  H05K1/0245 ,  H05K1/117 ,  H05K2201/09336 ,  H05K2201/09409 ,  H05K2201/10356

Abstract: A plug connector (100) includes a shell (10) and a printed circuit board (20) received in the shell. The printed circuit board includes a grounding layer (22), a conductive layer (21) disposed at a first side of the grounding layer, and an insulative layer (23) disposed therebetween. The conductive layer includes a pair of grounding traces (210), and a signal channel disposed between and isolated with the grounding traces. The signal channel includes a signal mating portion (221) disposed at a front portion. Each of the grounding traces includes a grounding mating portion (211) disposed at a front portion. Each of the grounding mating portions has a front end extending beyond the signal mating portion. The printed circuit board includes a pair of connecting traces (214). Each of the front ends of the grounding mating portions directly connects with the grounding layer by corresponding one of the connecting traces.

Abstract translation: 插头连接器（100）包括壳体（10）和容纳在外壳中的印刷电路板（20）。 印刷电路板包括接地层（22），设置在接地层的第一侧的导电层（21）和设置在其间的绝缘层（23）。 导电层包括一对接地迹线（210），以及设置在接地迹线之间并与接地迹线隔离的信号通道。 信号通道包括设置在前部的信号配合部分（221）。 每个接地迹线包括设置在前部的接地配合部分（211）。 每个接地配合部分具有延伸超过信号配合部分的前端。 印刷电路板包括一对连接迹线（214）。 接地配合部分的每个前端通过相应的一个连接迹线与接地层直接连接。

公开(公告)号：US08895429B2

公开(公告)日：2014-11-25

申请号：US13784869

申请日：2013-03-05

Applicant: Ronald Steven Cok

Inventor： Ronald Steven Cok

IPC: H01L21/44 ,  H05K1/02

CPC classification number: G02B6/122 ,  G02B6/13 ,  G02B6/138 ,  G02B6/4214 ,  G02B6/4274 ,  G02B2006/121 ,  G02B2006/12104 ,  G02B2006/12126 ,  G02B2006/12147 ,  G06F3/044 ,  H01L21/76895 ,  H01L23/5386 ,  H01L31/12 ,  H01L31/18 ,  H01L2924/0002 ,  H05K1/0274 ,  H05K3/10 ,  H05K3/101 ,  H05K3/1258 ,  H05K3/32 ,  H05K2201/0108 ,  H05K2201/09036 ,  H05K2201/10356 ,  H05K2203/0108 ,  H01L2924/00

Abstract: A micro-channel structure having variable depths includes a substrate and a cured layer formed on the substrate. At least first and second micro-channels are embossed in the cured layer. The first micro-channel has a bottom surface defining a first depth and the second micro-channel has a bottom surface defining a second depth different from the first depth. A cured electrical conductor is making a micro-wire is formed in each of the first and second micro-channels over their respective bottom surfaces.

Abstract translation: 具有可变深度的微通道结构包括基板和形成在基板上的固化层。 至少第一和第二微通道在固化层中压花。 第一微通道具有限定第一深度的底表面，并且第二微通道具有限定不同于第一深度的第二深度的底表面。 固化的电导体正在使第一和第二微通道中的每一个在它们各自的底表面上形成微线。