公开(公告)号：US07902649B2

公开(公告)日：2011-03-08

申请号：US11934287

申请日：2007-11-02

Applicant: Chun Ying Lin ,  Geng Shin Shen ,  Yu Tang Pan ,  Shih Wen Chou

Inventor： Chun Ying Lin ,  Geng Shin Shen ,  Yu Tang Pan ,  Shih Wen Chou

IPC: H01L23/495

CPC classification number: H01L21/4842 ,  H01L21/561 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/49548 ,  H01L24/48 ,  H01L24/49 ,  H01L24/97 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/85001 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/30107 ,  H05K3/3426 ,  H05K2201/09745 ,  H05K2201/10689 ,  H05K2201/10787 ,  Y02P70/613 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A leadframe employed by a leadless package comprises a plurality of package units and an adhesive tape. Each of the package units has a die pad with a plurality of openings and a plurality of pins disposed in the plurality of openings. The adhesive tape is adhered to the surfaces of the plurality of package units and fixes the die pad and the plurality of pins.

Abstract translation: 由无引线封装采用的引线框架包括多个封装单元和胶带。 每个封装单元具有带有多个开口的管芯焊盘和设置在多个开口中的多个销。 粘合带粘附到多个封装单元的表面并固定芯片焊盘和多个引脚。

公开(公告)号：US07733664B2

公开(公告)日：2010-06-08

申请号：US12155947

申请日：2008-06-12

Applicant: Atsushi Ito ,  Takayoshi Honda ,  Hidehiro Mikura ,  Tadashi Tsuruzawa ,  Takuya Sakuta

Inventor： Atsushi Ito ,  Takayoshi Honda ,  Hidehiro Mikura ,  Tadashi Tsuruzawa ,  Takuya Sakuta

IPC: H05K1/11

CPC classification number: H05K3/3421 ,  H05K1/111 ,  H05K3/3426 ,  H05K2201/09036 ,  H05K2201/09472 ,  H05K2201/09509 ,  H05K2201/09709 ,  H05K2201/10189 ,  H05K2201/10787 ,  Y02P70/611 ,  Y02P70/613

Abstract: An electronic component mounting structure includes a board and an electronic component mounted on a surface of the board. The board includes lands. The electronic component includes a body and terminals extending from the body. Each terminal is electrically connected to a corresponding one of the lands of the board. The terminal has a first terminal portion extending along the surface of the board and a second terminal portion extending toward the surface of the board. Each land includes a land portion electrically soldered to the first terminal portion and a blind hole for receiving the second terminal portion. The first terminal portion is soldered to the land portion in a reflow process under the condition that the second terminal portion is inserted in the blind hole.

Abstract translation: 电子部件安装结构包括安装在板的表面上的板和电子部件。 董事会包括土地。 电子部件包括主体和从主体延伸的端子。 每个端子电连接到板的对应的一个焊盘。 端子具有沿着板的表面延伸的第一端子部分和朝向板的表面延伸的第二端子部分。 每个焊盘包括电焊接到第一端子部分的焊盘部分和用于接收第二端子部分的盲孔。 在第二端子部分插入盲孔的条件下，第一端子部分在回流工艺中焊接到焊盘部分。

公开(公告)号：US07661996B2

公开(公告)日：2010-02-16

申请号：US12118125

申请日：2008-05-09

Applicant: Shinji Takahashi ,  Yoshiaki Kato ,  Harehide Sasaki ,  Hiroshi Kobayashi

Inventor： Shinji Takahashi ,  Yoshiaki Kato ,  Harehide Sasaki ,  Hiroshi Kobayashi

IPC: H01R13/428

CPC classification number: H05K3/308 ,  H05K2201/10015 ,  H05K2201/10651 ,  H05K2201/10787 ,  H05K2201/10878

Abstract: An electrical connection terminal for a connection hole includes: a base-side end portion (310) having a predetermined width; a retaining portion (313) having an increasing width wider than the predetermined width of the base-side end portion (310), the retaining portion (313) being formed integrally with the base-side end portion (310); and an insertion taper portion (315) having a taper width narrower than the increasing width of the retaining portion (313) to reach a leading end portion, the insertion taper portion (315) being formed integrally with the retaining portion (313); in which the insertion taper portion (315) is composed of a plurality of taper portions taper angles of which change so as to increase along an insertion direction.

Abstract translation: 用于连接孔的电连接端子包括：具有预定宽度的底侧端部（310）; 保持部（313）与基底侧端部（310）一体形成，该保持部（313）具有比基部侧端部（310）的规定宽度大的宽度的宽度。 以及插入锥形部（315），其具有比所述保持部（313）的增加宽度窄的锥形宽度，以到达前端部，所述插入锥形部（315）与所述保持部（313）一体形成。 其中所述插入锥形部分（315）由多个锥形部分组成，所述多个锥形部分锥形角度沿着插入方向变化。

公开(公告)号：US07531895B2

公开(公告)日：2009-05-12

申请号：US11552803

申请日：2006-10-25

Applicant: Bernhard Lange ,  William David Boyd

Inventor： Bernhard Lange ,  William David Boyd

IPC: H01L23/49 ,  H01L23/495

CPC classification number: H05K3/308 ,  H01L23/49555 ,  H01L24/49 ,  H01L2224/49175 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01079 ,  H01L2924/14 ,  H05K2201/10689 ,  H05K2201/10787 ,  H05K2201/10871 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: An integrated circuit (IC) package that comprises a lead frame. The lead frame has a downset portion and leads. The downset portion has an exterior surface that is configured to face away from a mounting board, and an interior surface that is configured to face towards the mounting board. The leads are bent away from the exterior surface, and each of the leads have a first end coupled to an IC and a second end configured to pass through one of a plurality of mounting holes extending through the mounting board. The IC is coupled to the interior surface.

Abstract translation: 一种包括引线框架的集成电路（IC）封装。 引线框架具有欠压部分和引线。 凹陷部分具有被配置为远离安装板的外表面和被配置为面向安装板的内表面。 引线从外表面弯曲，并且每个引线具有联接到IC的第一端和被配置为穿过延伸穿过安装板的多个安装孔中的一个的第二端。 IC耦合到内表面。

公开(公告)号：US20080258279A1

公开(公告)日：2008-10-23

申请号：US11934287

申请日：2007-11-02

Applicant: Chun Ying Lin ,  Geng Shin Shen ,  Yu Tang Pan ,  Shih Wen Chou

Inventor： Chun Ying Lin ,  Geng Shin Shen ,  Yu Tang Pan ,  Shih Wen Chou

IPC: H01L23/495 ,  H01L21/56

CPC classification number: H01L21/4842 ,  H01L21/561 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/49548 ,  H01L24/48 ,  H01L24/49 ,  H01L24/97 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/85001 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/30107 ,  H05K3/3426 ,  H05K2201/09745 ,  H05K2201/10689 ,  H05K2201/10787 ,  Y02P70/613 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A leadframe employed by a leadless package comprises a plurality of package units and an adhesive tape. Each of the package units has a die pad with a plurality of openings and a plurality of pins disposed in the plurality of openings. The adhesive tape is adhered to the surfaces of the plurality of package units and fixes the die pad and the plurality of pins.

Abstract translation: 由无引线封装采用的引线框架包括多个封装单元和胶带。 每个封装单元具有带有多个开口的管芯焊盘和设置在多个开口中的多个销。 粘合带粘附到多个封装单元的表面并固定芯片焊盘和多个引脚。

公开(公告)号：US07438593B2

公开(公告)日：2008-10-21

申请号：US10564470

申请日：2004-07-07

Applicant: Willem Blakborn

Inventor： Willem Blakborn

IPC: H01R13/73

CPC classification number: H01R12/707 ,  H05K3/3447 ,  H05K3/3484 ,  H05K2201/10189 ,  H05K2201/10598 ,  H05K2201/10787

Abstract: A printed circuit board component includes a housing carrying a peg that engages a printed circuit board hole. This peg has a radially projecting detent lug extending beyond the plug outer periphery. The lug is located and formed on the peg so the peg outer periphery is smaller in the area of the lug than the diameter of the hole. The outer periphery of the section of the peg projecting into the hole is such that, between the outer periphery of this section and the hole inner wall, a space having a capillarity for solder is formed over a portion of the outer periphery. During soldering, solder on the printed circuit board surface enters and fills the space by capillary action.

Abstract translation: 印刷电路板部件包括承载与印刷电路板孔接合的钉的壳体。 该钉具有延伸超过塞子外周边的径向突出的止动爪。 凸耳定位并形成在钉上，使得销的外周边在凸耳的区域中小于孔的直径。 突出到孔中的钉的部分的外周使得在该部分的外周和孔内壁之间，在外周的一部分上形成具有焊料毛细管的空间。 在焊接期间，印刷电路板表面上的焊料通过毛细管作用进入和填充空间。

公开(公告)号：US20080019120A1

公开(公告)日：2008-01-24

申请号：US11903005

申请日：2007-09-19

Applicant: Carmen Rapisarda

Inventor： Carmen Rapisarda

IPC: F21V21/08

CPC classification number: A41D27/085 ,  A43B1/0036 ,  H05K3/325 ,  H05K2201/10393 ,  H05K2201/10787 ,  H05K2203/0173

Abstract: A lighting system for wearing apparel and the like includes a sealed housing of flexible light transmitting material with at least two hollow regions interconnected by a section having an opening therein communicating between the hollow regions, a battery in one of the hollow regions, at least one light source in each hollow region for light emission through the surface of the housing, a motion responsive switch or a user-activated switch or both contained within one of the hollow regions, light controls contained within one of the hollow regions connected to the battery, the switch and the light sources for controlling the activation of the light sources responsive to operation of the switch, the weight and volume of the battery, light control means and switch being distributed among the hollow regions.

Abstract translation: 用于服装等的照明系统包括柔性透光材料的密封壳体，其具有至少两个中空区域，所述至少两个中空区域通过具有在中空区域之间连通的开口的部分互连，在一个中空区域中的电池，至少一个 每个中空区域中的光源用于通过壳体的表面发光，运动响应开关或用户激活的开关或两者容纳在一个中空区域内，包含在连接到电池的中空区域之一内的光控制器， 开关和光源，用于响应于开关的操作来控制光源的激活，电池的重量和体积，光控制装置和开关分布在中空区域之间。

公开(公告)号：US20070193774A1

公开(公告)日：2007-08-23

申请号：US11707958

申请日：2007-02-20

Applicant: Atsushi Ito ,  Takayoshi Honda ,  Hidehiro Mikura ,  Tadashi Tsuruzawa ,  Takuya Sakuta

Inventor： Atsushi Ito ,  Takayoshi Honda ,  Hidehiro Mikura ,  Tadashi Tsuruzawa ,  Takuya Sakuta

IPC: H05K1/16 ,  H05K7/00

CPC classification number: H05K3/3421 ,  H05K1/111 ,  H05K3/3426 ,  H05K2201/09036 ,  H05K2201/09472 ,  H05K2201/09509 ,  H05K2201/09709 ,  H05K2201/10189 ,  H05K2201/10787 ,  Y02P70/611 ,  Y02P70/613

Abstract: An electronic component mounting structure includes a board and an electronic component mounted on a surface of the board. The board includes lands. The electronic component includes a body and terminals extending from the body. Each terminal is electrically connected to a corresponding one of the lands of the board. The terminal has a first terminal portion extending along the surface of the board and a second terminal portion extending toward the surface of the board. Each land includes a land portion electrically soldered to the first terminal portion and a blind hole for receiving the second terminal portion. The first terminal portion is soldered to the land portion in a reflow process under the condition that the second terminal portion is inserted in the blind hole.

Abstract translation: 电子部件安装结构包括安装在板的表面上的板和电子部件。 董事会包括土地。 电子部件包括主体和从主体延伸的端子。 每个端子电连接到板的对应的一个焊盘。 端子具有沿着板的表面延伸的第一端子部分和朝向板的表面延伸的第二端子部分。 每个焊盘包括电焊接到第一端子部分的焊盘部分和用于接收第二端子部分的盲孔。 在第二端子部分插入盲孔的条件下，第一端子部分在回流工艺中焊接到焊盘部分。

公开(公告)号：US5424896A

公开(公告)日：1995-06-13

申请号：US105833

申请日：1993-08-12

Applicant: Nicholas F. Pasch ,  William Gascoyne

Inventor： Nicholas F. Pasch ,  William Gascoyne

IPC: H01L23/60 ,  H01T4/08 ,  H05K1/02 ,  H05K3/30 ,  H02H3/22

CPC classification number: H01L23/60 ,  H01T4/08 ,  H05K1/026 ,  H01L2924/0002 ,  H05K2201/10689 ,  H05K2201/10787 ,  H05K3/308

Abstract: A semiconductor circuit package includes features forming an electrostatic charge distribution network having nodes which are defined by the electrical contact leads of the package for the semiconductor circuit, and which are effectively connected with one another by spark-gaps. In one embodiment electrical leads of the package are provided with pointed protrusions lying in the plane of the electrical leads. Accordingly, an inadvertent electrostatic discharge is distributed throughout the semiconductor circuit at safe voltage levels determined by the characteristics of the spark gaps of the charge distribution network.

Abstract translation: 半导体电路封装包括形成静电电荷分布网络的特征，该静电电荷分布网络具有由用于半导体电路的封装的电接触引线限定的节点，并且通过火花间隙有效地彼此连接。 在一个实施例中，封装的电引线设置有位于电引线的平面中的尖突起。 因此，在由电荷分配网络的火花隙的特性确定的安全电压水平下，无意的静电放电分布在整个半导体电路中。

公开(公告)号：US5398165A

公开(公告)日：1995-03-14

申请号：US56658

申请日：1993-05-03

Applicant: Koichi Niinou

Inventor： Koichi Niinou

IPC: H01G4/228 ,  H01L23/48 ,  H01L23/50 ,  H05K1/02 ,  H05K1/18 ,  H05K3/30 ,  H01R9/00

CPC classification number: H05K3/308 ,  H01L2924/0002 ,  H05K1/0271 ,  H05K2201/10689 ,  H05K2201/10787 ,  H05K2201/10871

Abstract: To prevent the lead terminals of an electronic circuit component from being bent due to the vibration of the component after being mounted on a circuit board, each lead terminal has a tapered portion formed between an inserted tip portion and a cut dumb bar portion and having a width which decreases from the dumb bar portion toward the tip portion to prevent stresses from concentrating in the terminal.

Abstract translation: 为了防止电子电路部件的引线端子在安装在电路板上之后由于部件的振动而弯曲，每个引线端子具有形成在插入的尖端部分和切割的哑棒部分之间的锥形部分，并且具有 宽度从哑棒部分朝向尖端部分减小，以防止应力集中在端子中。