公开(公告)号：US20240244750A1

公开(公告)日：2024-07-18

申请号：US18429848

申请日：2024-02-01

Applicant: ROHM CO., LTD.

Inventor： Masashi HAYASHIGUCHI

IPC: H05K1/14 ,  H01L23/00 ,  H01L23/40 ,  H01L23/498 ,  H01L25/11 ,  H01R12/71 ,  H05K1/18

CPC classification number: H05K1/144 ,  H01L23/49811 ,  H01L25/115 ,  H05K1/18 ,  H01L23/40 ,  H01L24/37 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/37011 ,  H01L2224/37147 ,  H01L2224/40137 ,  H01L2224/40225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48225 ,  H01R12/718 ,  H05K2201/10166 ,  H05K2201/10871

Abstract: A semiconductor module includes: a plurality of semiconductor devices that each include a signal terminal extending in a first direction, and that is electrically connected to a semiconductor element; a heat sink; a plurality of first wiring boards that are electrically connected to the plurality of signal terminals of the respective semiconductor devices; and a second wiring board electrically connected to the plurality of first wiring boards. The signal terminal of one of the plurality of semiconductor devices is press-fitted into one of the plurality of first wiring boards in the first direction. The semiconductor module further includes a plurality of communication wirings electrically connecting the plurality of first wiring boards and the second wiring board. The plurality of communication wirings are displaceable in a direction perpendicular to the first direction.

公开(公告)号：US09515652B2

公开(公告)日：2016-12-06

申请号：US14606447

申请日：2015-01-27

Applicant: Anden Co., Ltd.

Inventor： Hideyuki Ohtani ,  Naoyuki Yasuda

IPC: H03K17/693 ,  H03K17/687 ,  H05K3/34

CPC classification number: H03K17/693 ,  H03K17/6874 ,  H03K17/6877 ,  H05K3/3426 ,  H05K2201/10053 ,  H05K2201/10295 ,  H05K2201/10803 ,  H05K2201/1081 ,  H05K2201/10833 ,  H05K2201/10871 ,  Y02P70/613

Abstract: In a relay module device, a signal converting section transmits driving signals of switching elements when receiving input signals from an external device and sets a relationship between the input signals and the driving signals. The relationship includes a first mode in which the signal converting section transmits the driving signals to separately control one of the switching elements with respect to one of the input signals, and a second mode in which the signal converting section transmits the driving signals to concurrently control two or more of the switching elements with respect to one of the input signals.

Abstract translation: 在继电器模块装置中，当从外部装置接收输入信号时，信号转换部分传输开关元件的驱动信号，并设定输入信号与驱动信号之间的关系。 该关系包括第一模式，其中信号转换部分发送驱动信号以相对于输入信号之一单独控制开关元件之一;以及第二模式，其中信号转换部分将驱动信号传输到同时控制 相对于输入信号之一的两个或多个开关元件。

公开(公告)号：US09437946B2

公开(公告)日：2016-09-06

申请号：US14573195

申请日：2014-12-17

Applicant: Lear Corporation

Inventor： Bert W. Eakins ,  George E. Fox ,  Steven F. Gawron

IPC: H01R12/58 ,  H05K1/14 ,  H01R43/20 ,  H01R13/428 ,  H05K1/18

CPC classification number: H01R12/585 ,  H01R13/112 ,  H01R13/428 ,  H01R43/205 ,  H05K1/14 ,  H05K1/18 ,  H05K3/308 ,  H05K2201/10295 ,  H05K2201/10787 ,  H05K2201/10871 ,  H05K2201/10878 ,  H05K2203/0195

Abstract: A printed circuit board includes a surface and having first and second adjacent apertures. First and second electrical terminals include respective ends disposed in the first and second apertures of the printed circuit board, respective shoulders adjacent to the ends of the first and second electrical terminals and engaged with the surface of the printed circuit board, and respective insertion tabs adjacent to the shoulders of the first and second electrical terminals and located respective first and second distances away from the surface of the printed circuit board. The first and second distances are different such that the first and second insertion tabs do not touch one another.

Abstract translation: 印刷电路板包括表面并具有第一和第二相邻的孔。 第一和第二电端子包括设置在印刷电路板的第一和第二孔中的相应端，相邻于第一和第二电端子的端部并与印刷电路板的表面接合的相应的肩部以及相邻的相应的插入片 连接到第一和第二电端子的肩部，并且位于相对于印刷电路板表面的第一和第二距离。 第一和第二距离是不同的，使得第一和第二插入片不相互接触。

公开(公告)号：US09253936B2

公开(公告)日：2016-02-02

申请号：US14000365

申请日：2011-02-25

Applicant: Igor Perez-Uria ,  Ola Arvidsson

Inventor： Igor Perez-Uria ,  Ola Arvidsson

IPC: H05K7/00 ,  H05K13/04 ,  H05K3/32 ,  H05K1/18 ,  H05K3/30 ,  H05K3/34

CPC classification number: H05K13/04 ,  H05K1/181 ,  H05K3/301 ,  H05K3/325 ,  H05K3/3447 ,  H05K13/0447 ,  H05K2201/10303 ,  H05K2201/1059 ,  H05K2201/10871 ,  H05K2203/0195 ,  Y10T29/49147 ,  Y10T29/53209

Abstract: A method for mounting connection pins in respective through-holes. Each pin having an anchoring part for insertion into said through-hole, a contact part to extend outside said through-hole and having a contact end for contact with the surface of another module of the electronic assembly, and a flange part to abut against said component carrier and located between said anchoring part and said contact part. A die tool has several similar recesses all adapted to receive a contact end of the contact part of a connection pin. The anchoring part of the pin is inserted in a through-hole of the component carrier, and the pin is anchored in the component carrier by exerting a force on a free end of the anchoring part of the pin while an end surface of the contact end abuts the bottom surface of similar recesses in the die tool.

Abstract translation: 一种将连接销安装在各个通孔中的方法。 每个销具有用于插入到所述通孔中的锚固部分，接触部分，其延伸到所述通孔的外部，并具有用于与电子组件的另一个模块的表面接触的接触端，以及抵靠所述通孔的凸缘部分 并且位于所述锚固部和所述接触部之间。 模具具有几个相似的凹部，其全部适于接收连接销的接触部分的接触端。 销的固定部分插入到部件载体的通孔中，并且通过在销的固定部分的自由端施加力而将销锚定在部件载体中，同时接触端的端面 邻接模具工具中相似凹槽的底面。

公开(公告)号：US20150235733A1

公开(公告)日：2015-08-20

申请号：US14180475

申请日：2014-02-14

Applicant: LEAR CORPORATION

Inventor： George E. Fox ,  Bert W. Eakins

IPC: H01B5/02 ,  H05K1/18

CPC classification number: H05K1/18 ,  H01R12/585 ,  H01R12/718 ,  H01R13/055 ,  H05K3/308 ,  H05K2201/10303 ,  H05K2201/10856 ,  H05K2201/10871

Abstract: The present disclosure includes an electrical terminal that may include a first portion, a second portion, and/or a middle portion. A middle portion may be disposed between first and second portions and/or a middle portion may include a first middle section, a second middle section, a recessed portion disposed between the first middle section and the second middle section, and/or an aperture. The electrical terminal may include a transition portion that may be disposed between a middle portion and a second portion.

Abstract translation: 本公开包括可以包括第一部分，第二部分和/或中间部分的电端子。 中间部分可以设置在第一和第二部分之间，和/或中间部分可以包括第一中间部分，第二中间部分，设置在第一中间部分和第二中间部分之间的凹部，和/或孔。 电端子可以包括可以设置在中间部分和第二部分之间的过渡部分。

公开(公告)号：US09093775B2

公开(公告)日：2015-07-28

申请号：US14000851

申请日：2011-02-25

Applicant: Igor Perez-Uria ,  Ola Arvidsson

Inventor： Igor Perez-Uria ,  Ola Arvidsson

IPC: H01R9/24 ,  H01R13/516 ,  H05K3/36 ,  H05K1/14 ,  H05K3/34

CPC classification number: H01R13/516 ,  H05K1/141 ,  H05K3/3447 ,  H05K3/368 ,  H05K2201/042 ,  H05K2201/10303 ,  H05K2201/10871

Abstract: A connection pin for mounting in a through-hole provided in a component carrier of an electronic assembly, the connection pin comprising an anchoring part adapted for insertion into said through-hole, a contact part adapted to extend outside said through-hole, and a flange part adapted to abut against said component carrier and located between said anchoring part and said contact part. The connection pin is provided with an internal cavity, which is provided with an outer opening at a free end of the anchoring part. The contact part is provided with a protruding elongated interconnection member at a free end thereof, and the respective shapes of the interconnection member and the internal cavity are such that the interconnection member is adapted for insertion into a corresponding internal cavity of another similar connection pin. A method for producing an electronic assembly with stackable modules is also disclosed.

Abstract translation: 一种用于安装在设置在电子组件的部件托架中的通孔中的连接销，所述连接销包括适于插入所述通孔的锚固部分，适于延伸到所述通孔外部的接触部分，以及 凸缘部分适于抵靠所述部件载体并且位于所述锚定部分和所述接触部分之间。 连接销设置有内部空腔，其在锚定部分的自由端处设置有外部开口。 接触部分在其自由端处设置有突出的细长互连构件，并且互连构件和内部空腔的相应形状使得互连构件适于插入到另一相似连接销的相应内部空腔中。 还公开了一种用于制造具有可堆叠模块的电子组件的方法。

公开(公告)号：US20150173192A1

公开(公告)日：2015-06-18

申请号：US14405094

申请日：2013-05-23

Applicant: SAGEMCOM BROADBAND SAS

Inventor： Stephane Kohn

IPC: H05K1/14 ,  H05K1/11

CPC classification number: H05K1/14 ,  H05K1/11 ,  H05K3/3447 ,  H05K3/368 ,  H05K2201/042 ,  H05K2201/10242 ,  H05K2201/10409 ,  H05K2201/10803 ,  H05K2201/1081 ,  H05K2201/10818 ,  H05K2201/10848 ,  H05K2201/10871 ,  H05K2201/2036

Abstract: The invention provides a spacer for soldering comprising an elongate body having one end provided with a tapped hole and an opposite end provided with a transverse bearing surface having a smooth centering peg projecting therefrom, the peg has a longitudinal outer passage extending over at least a fraction of its length as far as the transverse bearing surface to enable molten solder to penetrate by capillarity as far as the transverse bearing surface. The invention also provides a module including such a spacer.

Abstract translation: 本发明提供了一种用于焊接的间隔件，其包括细长本体，其一端设有螺纹孔，另一端设置有横向支承表面，该横向支承表面具有从其突出的平滑的定中心钉，所述栓具有纵向外部通道， 其长度为横向支承表面，以使熔融焊料能够通过毛细管力渗透到横向支承表面。 本发明还提供了一种包括这种间隔件的模块。

公开(公告)号：US20130343007A1

公开(公告)日：2013-12-26

申请号：US14000365

申请日：2011-02-25

Applicant: Igor Perez-Uria ,  Ola Arvidsson

Inventor： Igor Perez-Uria ,  Ola Arvidsson

IPC: H05K13/04 ,  H05K1/18

CPC classification number: H05K13/04 ,  H05K1/181 ,  H05K3/301 ,  H05K3/325 ,  H05K3/3447 ,  H05K13/0447 ,  H05K2201/10303 ,  H05K2201/1059 ,  H05K2201/10871 ,  H05K2203/0195 ,  Y10T29/49147 ,  Y10T29/53209

Abstract: A method for mounting connection pins in respective through-holes. Each pin having an anchoring part for insertion into said through-hole, a contact part to extend outside said through-hole and having a contact end for contact with the surface of another module of the electronic assembly, and a flange part to abut against said component carrier and located between said anchoring part and said contact part. A die tool has several similar recesses all adapted to receive a contact end of the contact part of a connection pin. The anchoring part of the pin is inserted in a through-hole of the component carrier, and the pin is anchored in the component carrier by exerting a force on a free end of the anchoring part of the pin while an end surface of the contact end abuts the bottom surface of similar recesses in the die tool.

Abstract translation: 一种将连接销安装在各个通孔中的方法。 每个销具有用于插入到所述通孔中的锚固部分，接触部分，其延伸到所述通孔的外部，并具有用于与电子组件的另一个模块的表面接触的接触端，以及抵靠所述通孔的凸缘部分 并且位于所述锚固部和所述接触部之间。 模具具有几个相似的凹部，其全部适于接收连接销的接触部分的接触端。 销的固定部分插入到部件载体的通孔中，并且通过在销的固定部分的自由端施加力而将销锚定在部件载体中，同时接触端的端面 邻接模具工具中相似凹槽的底面。

公开(公告)号：US20130050954A1

公开(公告)日：2013-02-28

申请号：US13659066

申请日：2012-10-24

Applicant: TDK-Lambda Americas, Inc.

Inventor： L. Ray Albrecht, III ,  Gordon K.Y. Lee ,  Jin He

IPC: H05K7/20 ,  H05K3/34

CPC classification number: H05K7/20463 ,  H05K1/0203 ,  H05K1/0204 ,  H05K1/144 ,  H05K7/20454 ,  H05K7/205 ,  H05K2201/042 ,  H05K2201/10303 ,  H05K2201/10409 ,  H05K2201/1056 ,  H05K2201/10871 ,  Y10T29/49144

Abstract: A thermal management system/method allowing efficient electrical/thermal attachment of heat sourcing PCBs to heat sinking PCBs using reflow/wave/hand soldering is disclosed. The disclosed system/method may incorporate a combination of support pins, spacer pads, and/or contact paste that mechanically attaches a heat sourcing PCB (and its associated components) to a heat sinking PCB such that thermal conductivity between the two PCBs can be optimized while simultaneously allowing controlled electrical conductivity between the two PCBs. Controlled electrical isolation between the two PCBs is provided for using spacer pads that may also be thermal conductive. Contact paste incorporated in some embodiments permits enhanced conductivity paths between the heat sourcing PCB, a thermally conductive plate mounted over the heat sourcing PCB, and the heat sinking PCB. The use of self-centering support pins incorporating out-gassing vents in some embodiments allows reflow/wave/hand soldering as desired.

Abstract translation: 公开了一种热管理系统/方法，其允许使用回流/波/手焊接将散热PCB的热源PCB与电源/热附件进行高效电连接。 所公开的系统/方法可以包括将热源PCB（及其相关部件）机械连接到散热PCB上的支撑销，间隔垫和/或接触膏的组合，使得可以优化两个PCB之间的导热性 同时允许两个PCB之间的受控电导率。 两个PCB之间的受控电气隔离被提供用于使用也可以是导热的间隔垫。 在一些实施例中结合的接触膏允许加热PCB，安装在热源PCB上的导热板和散热PCB之间的增强的导电路径。 在一些实施例中，使用包含排气孔的自定心支撑销允许根据需要进行回流/波/手焊。

公开(公告)号：US07985002B2

公开(公告)日：2011-07-26

申请号：US12175946

申请日：2008-07-18

Applicant: Hsiang-Chen Wu

Inventor： Hsiang-Chen Wu

IPC: F21V21/00

CPC classification number: B60Q1/2696 ,  F21S43/14 ,  F21S43/195 ,  H05K1/141 ,  H05K3/0097 ,  H05K3/202 ,  H05K3/308 ,  H05K3/366 ,  H05K2201/048 ,  H05K2201/049 ,  H05K2201/10106 ,  H05K2201/10871

Abstract: An illuminant device and a manufacturing method thereof. The manufacturing method includes the following steps of providing a body with a plurality of connecting members, disposing a plurality of lamps on the connecting members, respectively, dividing the body with the lamps into a plurality of assembling units, installing the assembling units on a carrier, and assembling the carrier with a holder.

Abstract translation: 发光装置及其制造方法。 该制造方法包括以下步骤：为主体提供多个连接构件，将多个灯分别设置在连接构件上，将主体与灯分为多个组装单元，将组装单元安装在载体上 ，以及用支架组装所述载体。