公开(公告)号：US20090014204A1

公开(公告)日：2009-01-15

申请号：US12106513

申请日：2008-04-21

Applicant: MING WANG ,  DONG-QING HE ,  XIAO-HONG ZHANG ,  CHENG-HSIEN LIN

Inventor： MING WANG ,  DONG-QING HE ,  XIAO-HONG ZHANG ,  CHENG-HSIEN LIN

IPC: H05K1/00

CPC classification number: H05K1/118 ,  H05K1/0281 ,  H05K3/281 ,  H05K2201/09145

Abstract: A flexible printed circuit board includes a base and a coverlay. The base includes a main portion and a distal portion connecting with the main portion. The distal portion has a first part and a second exposed part. The coverlay is formed on the base and covers the main portion and the first part of the distal portion. The second exposed part of the distal portion is uncovered by the coverlay. The coverlay includes a curved edge serving as an interface between the first part and second part of the distal portion.

Abstract translation: 柔性印刷电路板包括基底和覆盖物。 基部包括与主要部分连接的主要部分和远端部分。 远侧部分具有第一部分和第二暴露部分。 覆盖层形成在基部上并覆盖远端部分的主要部分和第一部分。 远端部分的第二暴露部分被覆盖物覆盖。 覆盖物包括用作远端部分的第一部分和第二部分之间的界面的弯曲边缘。

公开(公告)号：US20080070429A1

公开(公告)日：2008-03-20

申请号：US11567593

申请日：2006-12-06

Applicant: WEN-CHIN LEE ,  CHENG-HSIEN LIN

Inventor： WEN-CHIN LEE ,  CHENG-HSIEN LIN

IPC: H05K1/00

CPC classification number: H05K3/3442 ,  H05K2201/09181 ,  H05K2201/10636 ,  H05K2201/10727 ,  Y02P70/611 ,  Y02P70/613

Abstract: An exemplary surface mounted electronic component has block body including a bottom soldering surface, a top surface and a peripheral wall having a first peripheral wall portion and a second peripheral wall portion. The bottom soldering surface defines a first soldering area and a second soldering area. The first peripheral wall portion adjoins the first soldering area and has at least a first cutout defined between the first peripheral wall portion and the first soldering area. The second peripheral wall portion adjoins the second soldering area and has at least a second cutout defined between the second peripheral wall portion and the second soldering area. When the surface mounted electronic component is soldered, the melting solder can climb up the cutouts of the sidewall due to capillary effect and ‘chimney effect’, thereby avoiding ‘tombstoning’.

Abstract translation: 示例性的表面安装电子部件具有块体，其包括底部焊接表面，顶表面和具有第一周壁部分和第二周壁部分的周壁。 底部焊接表面限定第一焊接区域和第二焊接区域。 所述第一周壁部分邻接所述第一焊接区域，并且至少具有限定在所述第一周壁部分和所述第一焊接区域之间的第一切口。 所述第二周壁部分邻接所述第二焊接区域，并且在所述第二周壁部分和所述第二焊接区域之间具有至少第二切口。 当表面安装的电子部件被焊接时，由于毛细管效应和“烟囱效应”，熔化焊料可以爬上侧壁的切口，从而避免“墓碑”。

公开(公告)号：US07338299B1

公开(公告)日：2008-03-04

申请号：US11567593

申请日：2006-12-06

Applicant: Wen-Chin Lee ,  Cheng-Hsien Lin

Inventor： Wen-Chin Lee ,  Cheng-Hsien Lin

IPC: H01R12/00

CPC classification number: H05K3/3442 ,  H05K2201/09181 ,  H05K2201/10636 ,  H05K2201/10727 ,  Y02P70/611 ,  Y02P70/613

Abstract: An exemplary surface mounted electronic component has block body including a bottom soldering surface, a top surface and a peripheral wall having a first peripheral wall portion and a second peripheral wall portion. The bottom soldering surface defines a first soldering area and a second soldering area. The first peripheral wall portion adjoins the first soldering area and has at least a first cutout defined between the first peripheral wall portion and the first soldering area. The second peripheral wall portion adjoins the second soldering area and has at least a second cutout defined between the second peripheral wall portion and the second soldering area. When the surface mounted electronic component is soldered, the melting solder can climb up the cutouts of the sidewall due to capillary effect and ‘chimney effect’, thereby avoiding ‘tombstoning’.

Abstract translation: 示例性的表面安装电子部件具有块体，其包括底部焊接表面，顶表面和具有第一周壁部分和第二周壁部分的周壁。 底部焊接表面限定第一焊接区域和第二焊接区域。 所述第一周壁部分邻接所述第一焊接区域，并且至少具有限定在所述第一周壁部分和所述第一焊接区域之间的第一切口。 所述第二周壁部分邻接所述第二焊接区域，并且在所述第二周壁部分和所述第二焊接区域之间具有至少第二切口。 当表面安装的电子部件被焊接时，由于毛细管效应和“烟囱效应”，熔化焊料可以爬上侧壁的切口，从而避免“墓碑”。

公开(公告)号：US20070266559A1

公开(公告)日：2007-11-22

申请号：US11560787

申请日：2006-11-16

Applicant: WEN-CHIN LEE ,  CHENG-HSIEN LIN

Inventor： WEN-CHIN LEE ,  CHENG-HSIEN LIN

IPC: H01K3/10 ,  H05K3/10

CPC classification number: H05K3/4652 ,  H05K3/0035 ,  H05K3/421 ,  H05K3/429 ,  H05K2201/096 ,  H05K2201/09845 ,  H05K2203/0554 ,  H05K2203/1476 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: An exemplary method for forming stacked via-holes in a multilayer printed circuit board includes the steps of: providing a base circuit board; attaching a first copper-coated-substrate having a first substrate and a first copper layer thereon and a second copper-coated-substrate having a second substrate and a second copper layer thereon onto the base circuit board in a manner such that; forming at least one first window in the second copper layer, making at least one first hole in the second substrate through the at least one first window, forming at least one second window in the first copper layer through the at least one first hole, and making at least one second hole in the first substrate though the at least one second window, thus forming at least one part-finished stacked via-hole; and plating the at least one part-finished stacked via-hole thereby forming at least one stacked via-hole.

Abstract translation: 在多层印刷电路板中形成堆叠的通孔的示例性方法包括以下步骤：提供基底电路板; 将其上具有第一基板和第一铜层的第一铜涂覆基板和其上具有第二基板和第二铜层的第二铜涂覆基板以如下方式附接到基板电路板上; 在所述第二铜层中形成至少一个第一窗口，通过所述至少一个第一窗口在所述第二基板中形成至少一个第一孔，通过所述至少一个第一孔在所述第一铜层中形成至少一个第二窗口，以及 通过所述至少一个第二窗口在所述第一基板中形成至少一个第二孔，从而形成至少一个部分精加工的堆叠通孔; 以及对所述至少一个部分精加工的堆叠通孔进行电镀，从而形成至少一个堆叠的通孔。

公开(公告)号：US06837861B2

公开(公告)日：2005-01-04

申请号：US10237284

申请日：2002-09-09

Applicant: Cheng-Hsien Lin

Inventor： Cheng-Hsien Lin

IPC: A61H7/00 ,  A61H23/02

CPC classification number: A61H23/0254 ,  A61H7/004 ,  A61H2201/0149 ,  A61H2201/1215 ,  A61H2201/1669 ,  A61H2201/1671

Abstract: An electric massage device comprises a motor, a base, at least one gear train including a driven gear rotatably supported in the base, at least one movable member, and at least one massage member. The driven gear is driven by an output shaft of the motor. The driven gear includes engaging grooves in a side thereof. The movable member includes a toothed portion having a plurality of teeth. The massage member is securely connected to the movable member to move therewith. The engaging grooves of the driven gear and the teeth of the movable member are so configured that when the output shaft turns in a direction, the movable member and the massage member are turned, and that when the output shaft turns in a reverse direction, the movable member and the massage member move reciprocatingly.

Abstract translation: 电动按摩装置包括马达，基座，至少一个齿轮系，包括可旋转地支撑在基座中的从动齿轮，至少一个可移动部件和至少一个按摩部件。 从动齿轮由电动机的输出轴驱动。 从动齿轮包括在其一侧的接合槽。 可动构件包括具有多个齿的齿部。 按摩部件可靠地与可动部件连结，与其一起移动。 从动齿轮的接合槽和可动件的齿的结构使得当输出轴沿一个方向转动时，可移动部件和按摩部件被转动，并且当输出轴沿相反方向转动时， 可动构件和按摩构件往复移动。

公开(公告)号：US06676581B1

公开(公告)日：2004-01-13

申请号：US10195442

申请日：2002-07-15

Applicant: Cheng Hsien Lin

Inventor： Cheng Hsien Lin

IPC: A63B7100

CPC classification number: A47C9/002 ,  A47C1/03244 ,  A47C1/035 ,  A47C7/40 ,  A47C7/62 ,  Y10S482/904

Abstract: A stretching device is mounted to a positioning portion of furniture and includes a motor, a telescopic rod, and a handlebar. The motor is activatable for moving the telescopic rod in a retracting or extending direction. The telescopic rod is located in a position corresponding to a backrest of the furniture and includes an upper end fixed to the handlebar to move therewith. The handlebar is located on top of the furniture and includes a pair of grips. The handlebar further includes at least one button for controlling turning directions of the motor. When a user sits or lies in the furniture with two hands grasping the grips, a body of the user is stretched when the button is pushed to cause the motor to turn in a direction for moving the telescopic rod in the extending direction.

Abstract translation: 拉伸装置安装到家具的定位部分，并且包括马达，伸缩杆和把手。 电动机可激活以使伸缩杆在缩回或延伸方向移动。 伸缩杆位于对应于家具的靠背的位置，并且包括固定到车把以与其一起移动的上端。 把手位于家具的顶部，并包括一对把手。 车把还包括用于控制电动机转向的至少一个按钮。 当用户坐在或躺在家具中时，握住把手的两只手，使用者的身体被拉伸，当按钮被按压时，使得电动机沿着延伸方向移动伸缩杆的方向转动。

公开(公告)号：US08268537B2

公开(公告)日：2012-09-18

申请号：US12332321

申请日：2008-12-10

Applicant: Pai-Hung Huang ,  Chih-Kang Yang ,  Cheng-Hsien Lin

Inventor： Pai-Hung Huang ,  Chih-Kang Yang ,  Cheng-Hsien Lin

IPC: G03F7/20

CPC classification number: H05K3/0097 ,  H05K3/0082 ,  H05K3/064 ,  H05K2203/1554 ,  Y10T29/49162

Abstract: A printed circuit board substrate includes a metal-clad substrate and a number of N spaced circuit substrates arranged on the metal-clad substrate along an imaginary circle, N is a natural number greater than 2. The circuit substrates are equiangularly arranged about the center of the circle, and each of the circuit substrates is oriented 360/N degrees with respect to a neighboring printed circuit board.

Abstract translation: 印刷电路板基板包括金属包覆基板和沿着假想圆布置在金属包覆基板上的多个N个间隔开的电路基板，N是大于2的自然数。电路基板绕等角度地布置在 圆圈和每个电路基板相对于相邻的印刷电路板定向成360度/ N度。

公开(公告)号：US20120009669A1

公开(公告)日：2012-01-12

申请号：US13087664

申请日：2011-04-15

Applicant: SHOW-WEN LIU ,  CHENG-HSIEN LIN ,  YU CHANG ,  CHENG-FANG HSU ,  TSYH-LANG LIN

Inventor： SHOW-WEN LIU ,  CHENG-HSIEN LIN ,  YU CHANG ,  CHENG-FANG HSU ,  TSYH-LANG LIN

IPC: C07H15/04 ,  C12N5/071 ,  C07K14/00

CPC classification number: C07H15/04

Abstract: A bifunctional compound with a monosaccharide and a N2S2 ligand, and more particularly, a bifunctional compound with a N2S2 ligand and aminohexylacetyl galactosamine (ah-GalNAc4) is provided. A method for preparing the bifunctional compound with a monosaccharide and a N2S2 ligand is also provided, including activating a carboxyl group in an organic ligand, reacting the activated carboxyl group with a galactopyranoside through amidation, and then hydrolyzing. The bifunctional compound of the present invention is widely useful in nuclear medicine for preparation of liver imaging agents for assisting in correct diagnosis of diseases.

Abstract translation: 提供了具有单糖和N2S2配体的双官能化合物，更具体地，提供了具有N 2 S 2配体和氨基己基乙酰基半乳糖胺（ah-GalNAc 4）的双官能化合物。 还提供了用单糖和N 2 S 2配体制备双功能化合物的方法，包括活化有机配体中的羧基，通过酰胺化使活化的羧基与吡喃半乳糖苷反应，然后水解。 本发明的双功能化合物在制备用于辅助正确诊断疾病的肝成像剂的核医学中广泛有用。

公开(公告)号：US20110313183A1

公开(公告)日：2011-12-22

申请号：US13087862

申请日：2011-04-15

Applicant: SHOW-WEN LIU ,  CHENG-HSIEN LIN ,  TSYH-LANG LIN ,  CHENG-FANG HSU ,  YU CHANG

Inventor： SHOW-WEN LIU ,  CHENG-HSIEN LIN ,  TSYH-LANG LIN ,  CHENG-FANG HSU ,  YU CHANG

IPC: C07F7/22 ,  C07C213/10

CPC classification number: C07F7/2208

Abstract: A method for preparation of N-methyl-3-(2-tributylstannylphenoxy)-3-phenylpropanamine is provided, which includes formation of N-methyl-3-(2-tributylstannylphenoxy)-3-phenylpropanamine, useful as a precursor of a norepinephrine transporter (NET) contrast label [123Iodine](R)—N-methyl-3-(2-iodophenoxy)-3-phenylpropanamine ([123I]MIPP) with a leaving group Bu3Sn.

Abstract translation: 提供了制备N-甲基-3-（2-三丁基甲锡烷基苯氧基）-3-苯基丙胺的方法，包括形成N-甲基-3-（2-三丁基甲锡烷基苯氧基）-3-苯基丙胺，可用作去甲肾上腺素的前体 转运蛋白（NET）对比标记物[123碘]（R）-N-甲基-3-（2-碘苯氧基）-3-苯基丙胺（[123 I] MIPP）与离去基团Bu 3 Sn。

公开(公告)号：US08076499B2

公开(公告)日：2011-12-13

申请号：US12540448

申请日：2009-08-13

Applicant: Show-Wen Liu ,  Cheng-Hsien Lin ,  Tsyh-Lang Lin ,  Cheng-Fang Hsu

Inventor： Show-Wen Liu ,  Cheng-Hsien Lin ,  Tsyh-Lang Lin ,  Cheng-Fang Hsu

IPC: C07F3/10 ,  C07F7/00

CPC classification number: C07C277/08 ,  C07B2200/05 ,  C07C279/06

Abstract: A method for preparing a precursor of radioactive 3-iodobenzylguanidine- N,N′-bis(tert-butyloxycarbonyl)-3-(tri-n-butyltin)benzylguanidine) (MSnBG) is revealed. The method includes following steps. Firstly, obtain 3-iodobenzylguanidine bicarbonate by an addition reaction between 3-iodobenzylamine hydrochloride and cyanamide. Use di-tert-butyl dicarbonate as a protecting agent for NH group and convert 3-iodobenzylguanidine bicarbonate into N,N′-bis(tert-butyloxycarbonyl)-N-(3-iodobenzyl) guanidine. At last, under catalysis of bis(triphenylphosphine) palladium dichloride, obtain a final product MSnBG by a substitution reaction between N,N′-bis(tert-butyloxycarbonyl)-N-(3-iodobenzyl) guanidine and bis(tri-n-butyltin). MSnBG is used in no-carrier-added synthesis of [*l]MIBG.

Abstract translation: 揭示了制备放射性3-碘苄基胍-N，N'-双（叔丁氧基羰基）-3-（三正丁基锡）苄基胍）前体的方法（MSnBG）。 该方法包括以下步骤。 首先，通过3-碘苄胺盐酸盐和氨腈之间的加成反应获得3-碘苄基胍碳酸氢盐。 使用二碳酸二叔丁酯作为NH基团的保护剂，并将3-碘苄基胍碳酸氢盐转化成N，N'-双（叔丁氧基羰基）-N-（3-碘苄基）胍。 最后，在双（三苯基膦）二氯化钯的催化下，通过N，N'-双（叔丁氧基羰基）-N-（3-碘苄基）胍与双（三正丁基）二氯化钯的取代反应得到最终产物MSnBG， 丁基锡）。 MSnBG用于[* 1] MIBG的无载体添加合成。