公开(公告)号：US06927964B2

公开(公告)日：2005-08-09

申请号：US10604772

申请日：2003-08-15

Applicant: Ho-Ming Tong ,  Chun-Chi Lee ,  Jen-Kuang Fang ,  Min-Lung Huang ,  Jau-Shoung Chen ,  Ching-Huei Su ,  Chao-Fu Weng ,  Yung-Chi Lee ,  Yu-Chen Chou ,  Tsung-Hua Wu ,  Su Tao

Inventor： Ho-Ming Tong ,  Chun-Chi Lee ,  Jen-Kuang Fang ,  Min-Lung Huang ,  Jau-Shoung Chen ,  Ching-Huei Su ,  Chao-Fu Weng ,  Yung-Chi Lee ,  Yu-Chen Chou ,  Tsung-Hua Wu ,  Su Tao

IPC: H01L21/60 ,  H01L23/31 ,  H01L23/525 ,  H02H5/00

CPC classification number: H01L24/12 ,  H01L23/3171 ,  H01L23/5258 ,  H01L24/11 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05556 ,  H01L2224/05572 ,  H01L2224/13099 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2924/00

Abstract: A semiconductor device with a capability can prevent a burnt fuse pad from re-electrical connection, wherein the semiconductor device includes a bump pad and a fuse pad over a wafer. The fuse pad includes the burnt fuse pad having a gap for electrical isolation. The semiconductor device comprises a dielectric layer, disposed substantially above the burnt fuse pad and filling the gap, and a bump structure, disposed on the bump pad. The foregoing semiconductor device can further comprise a passivation layer, which exposes the bump pad and a portion of the burnt fuse pad. Wherein, the dielectric layer is over the passivation layer, covers the exposed portion of the burnt fuse pad and fills the gap.

Abstract translation: 具有能力的半导体器件可以防止燃烧的熔丝焊盘再次电连接，其中半导体器件包括凸块焊盘和晶片上的熔丝焊盘。 保险丝座包括具有用于电隔离的间隙的燃烧的保险丝座。 该半导体器件包括介于绝缘层上的绝缘层，该绝缘层基本上设置在烧结的熔丝焊盘的上方并填充间隙，以及设置在凸点焊盘上的凸块结构。 上述半导体器件还可以包括钝化层，其暴露凸块焊盘和烧焦的熔丝焊盘的一部分。 其中，电介质层在钝化层上方，覆盖烧结的熔丝垫的暴露部分并填充间隙。

公开(公告)号：US20050016859A1

公开(公告)日：2005-01-27

申请号：US10710020

申请日：2004-06-14

Applicant: Min-Lung Huang ,  Chi-Long Tsai ,  Chao-Fu Weng ,  Ching-Huei Su

Inventor： Min-Lung Huang ,  Chi-Long Tsai ,  Chao-Fu Weng ,  Ching-Huei Su

IPC: C25D5/02 ,  C25D5/18 ,  H01L21/288 ,  H01L21/60 ,  H01L23/48

CPC classification number: C25D5/022 ,  C25D5/18 ,  H01L21/2885 ,  H01L24/11 ,  H01L2224/05022 ,  H01L2224/05572 ,  H01L2224/056 ,  H01L2224/13099 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2224/05099

Abstract: A bump fabrication process is provided. A substrate having a plurality of openings of various widths thereon is provided. The substrate is dipped into an electrolytic solution. A step current that increases gradually is provided to the solution to perform an electroplating operation so that the conductive material is deposited inside the openings to form bumps with uniform thickness.

Abstract translation: 提供凸块制造工艺。 提供了具有多个宽度的多个开口的基板。 将基板浸入电解液中。 提供逐渐增加的步进电流以进行电镀操作，使得导电材料沉积在开口内部以形成具有均匀厚度的凸块。

公开(公告)号：US06846719B2

公开(公告)日：2005-01-25

申请号：US10248804

申请日：2003-02-20

Applicant: Ho-Ming Tong ,  Chun-Chi Lee ,  Jen-Kuang Fang ,  Min-Lung Huang ,  Jau-Shoung Chen ,  Ching-Huei Su ,  Chao-Fu Weng ,  Yung-Chi Lee ,  Yu-Chen Chou ,  Tsung-Hua Wu ,  Su Tao

Inventor： Ho-Ming Tong ,  Chun-Chi Lee ,  Jen-Kuang Fang ,  Min-Lung Huang ,  Jau-Shoung Chen ,  Ching-Huei Su ,  Chao-Fu Weng ,  Yung-Chi Lee ,  Yu-Chen Chou ,  Tsung-Hua Wu ,  Su Tao

IPC: H01L21/60 ,  H01L21/76

CPC classification number: H01L24/05 ,  H01L24/02 ,  H01L24/11 ,  H01L24/12 ,  H01L2224/0401 ,  H01L2224/05027 ,  H01L2224/05572 ,  H01L2224/056 ,  H01L2224/1147 ,  H01L2224/13099 ,  H01L2924/0002 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2224/05552

Abstract: A wafer bump fabrication process is provided in the present invention. A wafer with multiple bonding pads and a passivation layer, which exposes the bonding pads, is provided. The surface of each bonding pad has an under bump metallurgy layer. A patterned photoresist layer with a plurality of opening is formed which openings expose the under bump metallurgy layer. Afterwards a curing process is performed to cure the patterned photoresist layer. Following a solder paste fill-in process is performed to fill a solder paste into the openings. A reflow process is performed to form bumps from the solder paste in the openings. The patterned photoresist layer is removed.

Abstract translation: 在本发明中提供了晶片凸块制造工艺。 提供具有多个接合焊盘的晶片和暴露焊接焊盘的钝化层。 每个焊盘的表面具有凸块下的冶金层。 形成具有多个开口的图案化光致抗蚀剂层，这些开口暴露凸块下金属层。 之后进行固化工艺以固化图案化的光致抗蚀剂层。 进行焊膏填充处理以将焊膏填充到开口中。 进行回流处理以从开口中的焊膏形成凸起。 去除图案化的光致抗蚀剂层。

公开(公告)号：US06673711B2

公开(公告)日：2004-01-06

申请号：US10248863

申请日：2003-02-26

Applicant: Ho-Ming Tong ,  Chun-Chi Lee ,  Jen-Kuang Fang ,  Min-Lung Huang ,  Jau-Shoung Chen ,  Ching-Huei Su ,  Chao-Fu Weng ,  Yung-Chi Lee ,  Yu-Chen Chou

Inventor： Ho-Ming Tong ,  Chun-Chi Lee ,  Jen-Kuang Fang ,  Min-Lung Huang ,  Jau-Shoung Chen ,  Ching-Huei Su ,  Chao-Fu Weng ,  Yung-Chi Lee ,  Yu-Chen Chou

IPC: H01L2144

CPC classification number: H01L24/11 ,  H01L2224/0401 ,  H01L2224/05124 ,  H01L2224/05139 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05171 ,  H01L2224/05172 ,  H01L2224/05184 ,  H01L2224/05558 ,  H01L2224/05571 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05666 ,  H01L2224/05671 ,  H01L2224/05672 ,  H01L2224/05684 ,  H01L2224/11332 ,  H01L2224/11334 ,  H01L2224/1147 ,  H01L2224/11474 ,  H01L2224/11906 ,  H01L2224/13099 ,  H01L2924/0002 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2224/05552 ,  H01L2924/00014 ,  H01L2924/013

Abstract: A solder ball fabricating process for forming solder balls over a wafer having an active layer is provided. A patterned solder mask layer is formed over the active surface of the wafer. The patterned solder mask layer has an opening that exposes a bonding pad on the wafer. Solder material is deposited into the opening over the bonding pad. A reflow process is conducted to form a pre-solder body. The aforementioned steps are repeated so that various solder materials are fused together to form a solder ball over the bonding pad.

Abstract translation: 提供了一种用于在具有有源层的晶片上形成焊球的焊球制造工艺。 在晶片的有效表面上形成图案化的焊接掩模层。 图案化的焊接掩模层具有暴露晶片上的焊盘的开口。 焊料沉积在焊盘上的开口中。 进行回流工艺以形成预焊料体。 重复上述步骤，使得各种焊料材料熔合在一起以在焊盘上形成焊球。

公开(公告)号：US06617237B1

公开(公告)日：2003-09-09

申请号：US10248882

申请日：2003-02-27

Applicant: Ho-Ming Tong ,  Chun-Chi Lee ,  Jen-Kuang Fang ,  Min-Lung Huang ,  Jau-Shoung Chen ,  Ching-Huei Su ,  Chao-Fu Weng ,  Yung-Chi Lee ,  Yu-Chen Chou ,  Tsung-Hua Wu ,  Su Tao

Inventor： Ho-Ming Tong ,  Chun-Chi Lee ,  Jen-Kuang Fang ,  Min-Lung Huang ,  Jau-Shoung Chen ,  Ching-Huei Su ,  Chao-Fu Weng ,  Yung-Chi Lee ,  Yu-Chen Chou ,  Tsung-Hua Wu ,  Su Tao

IPC: H01L2144

CPC classification number: H01L24/11 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05027 ,  H01L2224/0508 ,  H01L2224/05572 ,  H01L2224/11332 ,  H01L2224/11334 ,  H01L2224/1147 ,  H01L2224/13099 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14

Abstract: A lead-free solder bump fabrication process for producing a plurality of lead-free solder bumps over a wafer is provided. The lead-free solder bump fabrication process includes forming a lead-free pre-formed solder bump over each bonding pad on the wafer and then forming a patterned solder mask layer over the active surface of the wafer. The openings in the solder mask layer expose the respective lead-free pre-formed solder bumps on the wafer. Thereafter, lead-free solder material is deposited into the opening. The material composition of the lead-free solder material differs from the material composition of the lead-free pre-formed solder bump. A reflow process is conducted so that the lead-free pre-formed solder bump fuses with the lead-free solder material to form a lead-free solder bump. Finally, the solder mask layer is removed.

Abstract translation: 提供了一种用于在晶片上产生多个无铅焊料凸块的无铅焊料凸块制造工艺。 无铅焊料凸块制造工艺包括在晶片上的每个接合焊盘上形成无铅预成形焊料凸块，然后在晶片的有效表面上形成图案化的焊接掩模层。 焊接掩模层中的开口露出晶片上的相应的无铅预制焊料凸点。 此后，将无铅焊料材料沉积到开口中。 无铅焊料的材料组成不同于无铅预成形焊料凸块的材料组成。 进行回流处理，使得无铅预成形焊料凸块与无铅焊料材料熔合以形成无铅焊料凸块。 最后，去除焊接掩模层。