公开(公告)号：US20100214742A1

公开(公告)日：2010-08-26

申请号：US12149769

申请日：2008-05-07

Applicant: Charles W.C. Lin ,  Wei-Kuang Pan ,  Chia-Chung Wang

Inventor： Charles W.C. Lin ,  Wei-Kuang Pan ,  Chia-Chung Wang

IPC: H05K7/20

CPC classification number: H01L23/36 ,  H01L21/563 ,  H01L23/3114 ,  H01L2224/73203

Abstract: A memory module has a good heat sinking effect. Each chip on the memory module has a surface exposed in the air. Or, a thermal pad can further adhere to the surface of the chips. Thus, the heat sinking effect of the memory module is improved; and an easy and convenient producing method is obtained.

Abstract translation: 内存模块具有良好的散热效果。 存储器模块上的每个芯片具有在空气中暴露的表面。 或者，散热垫可以进一步粘附到芯片的表面。 因此，存储器模块的散热效果得到改善; 得到容易且方便的制造方法。

公开(公告)号：US20100181594A1

公开(公告)日：2010-07-22

申请号：US12714417

申请日：2010-02-26

Applicant: Charles W.C. Lin ,  Chia-Chung Wang ,  Sangwhoo Lim

Inventor： Charles W.C. Lin ,  Chia-Chung Wang ,  Sangwhoo Lim

IPC: H01L33/00

CPC classification number: H01L21/486 ,  H01L23/3677 ,  H01L33/483 ,  H01L33/642 ,  H01L2224/32188 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/12041 ,  H01L2924/16152 ,  H01L2924/19041 ,  H05K1/021 ,  H05K1/182 ,  H05K3/0061 ,  H05K2201/09054 ,  H05K2201/10106 ,  H05K2203/0369 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A semiconductor chip assembly includes a semiconductor device, a heat spreader, a conductive trace and an adhesive. The semiconductor device extends into a cavity in the adhesive, is electrically connected to the conductive trace and is thermally connected to the heat spreader. The heat spreader includes a post and a base. The post extends upwardly from the base into an opening in the adhesive and is located below the cavity, and the base extends laterally from the post. The cavity extends to the post. The adhesive extends between the cavity and the conductive trace and between the base and the conductive trace. The conductive trace is located outside the cavity and provides signal routing between a pad and a terminal.

Abstract translation: 半导体芯片组件包括半导体器件，散热器，导电迹线和粘合剂。 半导体器件延伸到粘合剂中的空腔中，电连接到导电迹线并且热连接到散热器。 散热器包括一个柱子和一个底座。 柱从基部向上延伸到粘合剂中的开口中并且位于空腔下方，并且基部从柱横向延伸。 空腔延伸到柱子。 粘合剂在空腔和导电迹线之间以及基底和导电迹线之间延伸。 导电迹线位于腔体外部，并提供焊盘和端子之间的信号路由。

公开(公告)号：US20100167436A1

公开(公告)日：2010-07-01

申请号：US12642859

申请日：2009-12-21

Applicant: Charles W.C. Lin ,  Chia-Chung Wang

Inventor： Charles W.C. Lin ,  Chia-Chung Wang

IPC: H01L33/00 ,  H01L21/50 ,  H01L21/60

CPC classification number: H01L21/486 ,  H01L23/3677 ,  H01L33/486 ,  H01L33/642 ,  H01L2224/32013 ,  H01L2224/32188 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/181 ,  H01L2924/19041 ,  H05K1/0204 ,  H05K3/0061 ,  H05K2201/09054 ,  H05K2201/10106 ,  H05K2203/0369 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A method of making a semiconductor chip assembly includes providing a thermal post, a signal post and a base, mounting an adhesive on the base including inserting the thermal post into a first opening in the adhesive and the signal post into a second opening in the adhesive, mounting a conductive layer on the adhesive including aligning the thermal post with a first aperture in the conductive layer and the signal post with a second aperture in the conductive layer, then flowing the adhesive into and upward in a first gap located in the first aperture between the thermal post and the conductive layer and in a second gap located in the second aperture between the signal post and the conductive layer, solidifying the adhesive, then providing a conductive trace that includes a pad, a terminal, the signal post and a selected portion of the conductive layer, mounting a semiconductor device on a heat spreader that includes the thermal post and the base, electrically connecting the semiconductor device to the conductive trace and thermally connecting the semiconductor device to the heat spreader.

Abstract translation: 制造半导体芯片组件的方法包括提供热柱，信号柱和基座，将粘合剂安装在基座上，包括将热柱插入粘合剂中的第一开口中，并将信号柱插入粘合剂中的第二开口中 将导电层安装在所述粘合剂上，包括使所述热柱与所述导电层中的第一孔对准并且所述信号柱与所述导电层中的第二孔对准，然后使所述粘合剂在位于所述第一孔中的第一间隙中并向上流动 在热柱和导电层之间以及位于信号柱和导电层之间的第二孔中的第二间隙中，固化粘合剂，然后提供包括垫，端子，信号柱和选定的导电迹线 导电层的一部分，将半导体器件安装在包括热柱和基底的散热器上，电连接半导体 或器件连接到导电迹线并将半导体器件热连接到散热器。

公开(公告)号：US20100155769A1

公开(公告)日：2010-06-24

申请号：US12714421

申请日：2010-02-26

Applicant: Charles W.C. Lin ,  Chia-Chung Wang ,  Sangwhoo Lim

Inventor： Charles W.C. Lin ,  Chia-Chung Wang ,  Sangwhoo Lim

IPC: H01L33/00

CPC classification number: H01L21/486 ,  H01L21/4882 ,  H01L23/3677 ,  H01L33/483 ,  H01L33/62 ,  H01L33/642 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A semiconductor chip assembly includes a semiconductor device, a heat spreader, a conductive trace and an adhesive. The heat spreader includes a base. A cavity extends through the adhesive into the base. The semiconductor device extends into the cavity, is electrically connected to the conductive trace and is thermally connected to the heat spreader. The adhesive extends between the cavity and the conductive trace and between the base and the conductive trace. The conductive trace is located outside the cavity and provides signal routing between a pad and a terminal.

Abstract translation: 半导体芯片组件包括半导体器件，散热器，导电迹线和粘合剂。 散热器包括一个底座。 空腔通过粘合剂延伸到基座中。 半导体器件延伸到腔中，电连接到导电迹线并且热连接到散热器。 粘合剂在空腔和导电迹线之间以及基底和导电迹线之间延伸。 导电迹线位于腔体外部，并提供焊盘和端子之间的信号路由。

公开(公告)号：US20100096662A1

公开(公告)日：2010-04-22

申请号：US12642795

申请日：2009-12-19

Applicant: Charles W.C. Lin ,  Chia-Chung Wang

Inventor： Charles W.C. Lin ,  Chia-Chung Wang

IPC: H01L33/00 ,  H01L23/48 ,  H01L23/367

CPC classification number: H01L21/486 ,  H01L23/3677 ,  H01L33/486 ,  H01L33/642 ,  H01L2224/32013 ,  H01L2224/32188 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/181 ,  H01L2924/19041 ,  H05K1/0204 ,  H05K3/0061 ,  H05K2201/09054 ,  H05K2201/10106 ,  H05K2203/0369 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A semiconductor chip assembly includes a semiconductor device, a heat spreader, a conductive trace and an adhesive. The semiconductor device is electrically connected to the conductive trace and thermally connected to the heat spreader. The heat spreader includes a thermal post and a base. The thermal post extends upwardly from the base into a first opening in the adhesive, and the base extends laterally from the thermal post. The conductive trace includes a pad, a terminal and a signal post. The signal post extends upwardly from the terminal into a second opening in the adhesive.

Abstract translation: 半导体芯片组件包括半导体器件，散热器，导电迹线和粘合剂。 半导体器件电连接到导电迹线并热连接到散热器。 散热器包括热柱和基座。 热柱从基部向上延伸到粘合剂中的第一开口中，并且基部从热柱横向延伸。 导电迹线包括垫，端子和信号柱。 信号柱从端子向上延伸到粘合剂中的第二开口中。

公开(公告)号：US20100072510A1

公开(公告)日：2010-03-25

申请号：US12626883

申请日：2009-11-28

Applicant: Charles W.C. Lin ,  Chia-Chung Wang ,  David M. Sigmond

Inventor： Charles W.C. Lin ,  Chia-Chung Wang ,  David M. Sigmond

IPC: H01L33/00

CPC classification number: H01L21/486 ,  H01L23/3677 ,  H01L24/45 ,  H01L24/48 ,  H01L33/483 ,  H01L33/642 ,  H01L2224/32188 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/3011 ,  H05K1/0204 ,  H05K3/0061 ,  H05K2201/09054 ,  H05K2201/10106 ,  H05K2203/0369 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012

Abstract: A semiconductor chip assembly includes a semiconductor device, a heat spreader, a conductive trace and an adhesive. The semiconductor device is electrically connected to the conductive trace and thermally connected to the heat spreader. The heat spreader includes a post, a base and a cap. The post extends upwardly from the base into an opening in the adhesive, the base extends below and laterally from the post, and the cap extends above and laterally from the post. The adhesive extends between the post and the conductive trace and between the base and the conductive trace. The conductive trace provides signal routing between a pad and a terminal and the heat spreader provides thermal dissipation between the cap and the base.

Abstract translation: 半导体芯片组件包括半导体器件，散热器，导电迹线和粘合剂。 半导体器件电连接到导电迹线并热连接到散热器。 散热器包括柱子，底座和帽子。 柱从基部向上延伸到粘合剂中的开口中，基部从柱延伸到下方和侧向，并且帽从柱上方和侧向延伸。 粘合剂在柱和导电迹线之间以及基部和导电迹线之间延伸。 导电迹线提供垫和端子之间的信号路由，并且散热器在盖和基座之间提供散热。

公开(公告)号：US20100055812A1

公开(公告)日：2010-03-04

申请号：US12617725

申请日：2009-11-13

Applicant: Charles W.C. Lin ,  Chia-Chung Wang

Inventor： Charles W.C. Lin ,  Chia-Chung Wang

IPC: H01L21/50

CPC classification number: H01L23/3677 ,  H01L21/486 ,  H01L24/45 ,  H01L24/48 ,  H01L33/483 ,  H01L33/62 ,  H01L33/642 ,  H01L2224/32188 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/19041 ,  H05K1/0204 ,  H05K3/0061 ,  H05K2201/09054 ,  H05K2201/10106 ,  H05K2203/0369 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A method of making a semiconductor chip assembly includes providing a post and a base, mounting an adhesive on the base including inserting the post into an opening in the adhesive, mounting a conductive layer on the adhesive including aligning the post with an aperture in the conductive layer, then flowing the adhesive into and upward in a gap located in the aperture between the post and the conductive layer, solidifying the adhesive, then providing a conductive trace that includes a pad, a terminal and a selected portion of the conductive layer, mounting a semiconductor device on a heat spreader that includes the post and the base, electrically connecting the semiconductor device to the conductive trace and thermally connecting the semiconductor device to the heat spreader.

Abstract translation: 一种制造半导体芯片组件的方法包括提供柱和基座，在基底上安装粘合剂，包括将柱插入粘合剂中的开口中，将导电层安装在粘合剂上，包括使导柱与导电 然后使粘合剂在位于柱和导电层之间的孔中的间隙中并向上流动，固化粘合剂，然后提供包括导电层的焊盘，端子和选定部分的导电迹线，安装 包括柱和基座的散热器上的半导体器件，将半导体器件电连接到导电迹线并将半导体器件热连接到散热器。

公开(公告)号：US20100055811A1

公开(公告)日：2010-03-04

申请号：US12617723

申请日：2009-11-13

Applicant: Charles W.C. Lin ,  Chia-Chung Wang

Inventor： Charles W.C. Lin ,  Chia-Chung Wang

IPC: H01L33/00 ,  H01L21/60

CPC classification number: H05K1/0204 ,  F21K9/00 ,  H01L21/486 ,  H01L23/3677 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L33/483 ,  H01L33/642 ,  H01L2224/32188 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/19041 ,  H05K3/0061 ,  H05K3/386 ,  H05K2201/09054 ,  H05K2201/10106 ,  H05K2203/0369 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012

Abstract: A method of making a semiconductor chip assembly includes providing a post and a base, mounting an adhesive on the base including inserting the post through an opening in the adhesive, mounting a substrate on the adhesive including inserting the post into an aperture in the substrate to form a gap in the aperture between the post and the substrate, then flowing the adhesive into and upward in the gap, solidifying the adhesive, then mounting a semiconductor device on a heat spreader that includes the post and the base, electrically connecting the semiconductor device to the substrate and thermally connecting the semiconductor device to the heat spreader.

Abstract translation: 制造半导体芯片组件的方法包括提供柱和底座，将粘合剂安装在基座上，包括将柱穿过粘合剂中的开口，将基底安装在粘合剂上，包括将柱插入基底中的孔中， 在柱和基板之间的孔中形成间隙，然后使粘合剂在间隙中向上流动，固化粘合剂，然后将半导体器件安装在包括柱和基座的散热器上，将半导体器件 并将半导体器件热连接到散热器上。

公开(公告)号：US20100001309A1

公开(公告)日：2010-01-07

申请号：US12557540

申请日：2009-09-11

Applicant: Chia-Chung Wang ,  Charles W.C. Lin

Inventor： Chia-Chung Wang ,  Charles W.C. Lin

IPC: H01L33/00

CPC classification number: H05K1/0204 ,  H01L23/3677 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L33/483 ,  H01L33/642 ,  H01L2224/32188 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/19041 ,  H05K3/0061 ,  H05K2201/09054 ,  H05K2201/10106 ,  H05K2203/0369 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012

Abstract: A semiconductor chip assembly includes a semiconductor device, a heat spreader, a substrate and an adhesive. The semiconductor device is electrically connected to the substrate and thermally connected to the heat spreader. The heat spreader includes a post and a base. The post extends upwardly through an opening in the adhesive into an aperture in the substrate, and the base extends laterally from the post. The adhesive extends between the post and the substrate and between the base and the substrate. The substrate includes first and second conductive layers and a dielectric layer therebetween and provides horizontal signal routing between a pad and a terminal at the first conductive layer.

Abstract translation: 半导体芯片组件包括半导体器件，散热器，衬底和粘合剂。 半导体器件电连接到衬底并热连接到散热器。 散热器包括一个柱子和一个底座。 该柱向上延伸穿过粘合剂中的开口到基底中的孔中，并且基部从柱延伸。 粘合剂在柱和基底之间以及基底和基底之间延伸。 衬底包括第一和第二导电层以及它们之间的电介质层，并且在第一导电层处提供衬垫和端子之间的水平信号路由。

公开(公告)号：US20090284932A1

公开(公告)日：2009-11-19

申请号：US12406510

申请日：2009-03-18

Applicant: Charles W.C. LIN

Inventor： Charles W.C. LIN

IPC: H05K7/20

CPC classification number: H01L23/4334 ,  H01L23/3128 ,  H01L23/3677 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/32188 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: The present invention thermally enhanced package with embedded metal slug and patterned circuitry discloses a thermal enhanced package with an embedded metal slug that can be easy directly assembled to the printed circuit board to significantly improve package's thermal dissipation efficiency through the assistance of metal traces in the application board.

Abstract translation: 本发明的具有嵌入式金属块和图案化电路的热增强封装公开了一种具有嵌入式金属块的热增强封装，其可以容易地直接组装到印刷电路板，以通过应用中的金属迹线的帮助显着提高封装的散热效率 板。