公开(公告)号：US08674305B2

公开(公告)日：2014-03-18

申请号：US13926058

申请日：2013-06-25

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Markus Rossi ,  Ville Kettunen

IPC: G01S17/08 ,  G08B13/181

CPC classification number: G01V8/12 ,  G01J1/0411 ,  G01J5/08 ,  G01S7/4811 ,  G01S17/026

Abstract: An opto-electronic module includes a detecting channel comprising a detecting member for detecting light and an emission channel comprising an emission member for emitting light generally detectable by said detecting member. Therein, a radiation distribution characteristic for an emission of light from said emission channel is non rotationally symmetric; and/or a sensitivity distribution characteristic for a detection in said detecting channel of light incident on said detection channel is non rotationally symmetric; and/or a central or main emission direction for an emission of light from said emission channel and a central or main detection direction for a detection of light incident on said detection channel are aligned not parallel to each other; and/or at least a first one of the channels comprises one or more passive optical components.

Abstract translation: 光电模块包括检测通道，该检测通道包括用于检测光的检测部件和发射通道，该发射通道包括用于发射由所述检测部件可检测的光的发射部件。 其中，用于从所述发射通道发射光的辐射分布特性是非旋转对称的; 和/或用于在入射到所述检测通道的光的所述检测通道中的检测的灵敏度分布特性是非旋转对称的; 和/或用于发射来自所述发射通道的光的中心或主发射方向以及用于检测入射在所述检测通道上的光的中心或主检测方向彼此不对准; 和/或至少第一个通道包括一个或多个无源光学部件。

公开(公告)号：US20140070817A1

公开(公告)日：2014-03-13

申请号：US14076820

申请日：2013-11-11

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Hartmut Rudmann ,  Matthias Gloor

IPC: G01R31/28

CPC classification number: G01M11/00 ,  G01D18/00 ,  G01N21/55 ,  G01R31/282 ,  G01S7/497 ,  G01S17/026

Abstract: The present disclosure describes techniques for testing optical devices in a manner that, in some implementations, simulates the environment in which the devices will be used when they are integrated into the end-product or system. For example, one aspect includes providing a transparent sheet that is positioned near the optical device in a manner that simulates at least some aspects of the environment when the device is incorporated into the end-product or system. The testing can be performed, for example, while the optical devices are in production or at some other time prior to their being integrated into an end-product or system.

Abstract translation: 本公开描述了以下方式测试光学设备的技术：在一些实现中，模拟当设备将被集成到终端产品或系统中时将被使用的环境。 例如，一个方面包括提供一种位于光学装置附近的透明片材，以便在该装置被结合到最终产品或系统中时模拟环境的至少一些方面。 例如，可以在光学装置正在生产中或在将其集成到最终产品或系统之前的某个其他时间进行测试。

公开(公告)号：US08606057B1

公开(公告)日：2013-12-10

申请号：US13685193

申请日：2012-11-26

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Hartmut Rudmann ,  Mario Cesana ,  Jukka Alasirnio ,  Philippe Bouchilloux ,  Susanne Westenhoefer ,  Jens Geiger

IPC: G02B6/12

CPC classification number: H05K3/4697 ,  H01L23/49833 ,  H01L24/97 ,  H01L27/14618 ,  H01L27/14632 ,  H01L31/0203 ,  H01L2224/04026 ,  H01L2224/24227 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/33181 ,  H01L2224/83192 ,  H01L2224/83851 ,  H01L2224/97 ,  H01L2924/12041 ,  H01L2924/12043 ,  H01L2924/12044 ,  H01L2924/15153 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/1579 ,  H05K1/182 ,  H05K1/183 ,  H05K2201/10121 ,  H05K2203/063 ,  H01L2224/83 ,  H01L2924/00

Abstract: Opto-electronic modules include conductive wiring and connections that can facilitate integrating the modules into an external device. Some opto-electronic modules include an opto-electronic stack that includes at least one lens and an opto-electronic element. Conductive paths can extend from the bottom to the top of the module. The conductive paths can include conductive pads on the surface of the opto-electronic element, as well as wiring at least partially embedded in a substrate and walls of a housing for the opto-electronic stack. Conductive connections can be disposed between a top surface of the substrate and the bottom surface of the walls such that the conductive connections electrically connect the second wiring to the first wiring and to the conductive pads on the surface of the opto-electronic element. The modules can be fabricated, for example, in wafer-level processes so that multiple opto-electronic modules can be manufactured at the same time.

Abstract translation: 光电模块包括导电布线和连接，可以方便将模块集成到外部设备中。 一些光电模块包括包括至少一个透镜和光电元件的光电堆叠。 导电路径可以从模块的底部延伸到顶部。 导电路径可以包括在光电子元件的表面上的导电焊盘，以及至少部分地嵌入基板的布线和用于光电叠层的壳体的壁。 导电连接可以设置在基板的顶表面和壁的底表面之间，使得导电连接将第二布线电连接到第一布线和光电元件表面上的导电垫。 模块可以例如在晶片级处理中制造，从而可以同时制造多个光电模块。

公开(公告)号：US20130284906A1

公开(公告)日：2013-10-31

申请号：US13923565

申请日：2013-06-21

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Hartmut Rudmann ,  Markus Rossi

IPC: H01L31/16

CPC classification number: H01L31/16 ,  B29D11/00298 ,  B29D11/00307 ,  G01J1/0209 ,  G01J1/0233 ,  G01J1/0271 ,  G01J1/0411 ,  G01J1/06 ,  G01J1/42 ,  G01J5/00 ,  G01J5/022 ,  G01J5/0235 ,  G01J5/024 ,  G01J5/0265 ,  G01J5/045 ,  G01J5/0806 ,  G01J5/20 ,  G01J2001/061 ,  G02B3/0031 ,  G02B3/0056 ,  G02B13/0085 ,  H01L25/167 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14627 ,  H01L27/14687 ,  H01L31/02325 ,  H01L31/167 ,  H01L2924/0002 ,  Y10T29/49002 ,  H01L2924/00

Abstract: Manufacturing opto-electronic modules (1) includes providing a substrate wafer (PW) on which detecting members (D) are arranged; providing a spacer wafer (SW); providing an optics wafer (OW), the optics wafer comprising transparent portions (t) transparent for light generally detectable by the detecting members and at least one blocking portion (b) for substantially attenuating or blocking incident light generally detectable by the detecting members; and preparing a wafer stack (2) in which the spacer wafer (SW) is arranged between the substrate wafer (PW) and the optics wafer (OW) such that the detecting members (D) are arranged between the substrate wafer and the optics wafer. Emission members (E) for emitting light generally detectable by the detecting members (D) can be arranged on the substrate wafer (PW). Single modules (1) can be obtained by separating the wafer stack (2) into separate modules.

公开(公告)号：US20200064584A1

公开(公告)日：2020-02-27

申请号：US15769916

申请日：2016-10-21

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Kai Engelhardt ,  Markus Rossi

IPC: G02B7/02 ,  G02B27/42 ,  G02B13/18

Abstract: This disclosure describes optical assemblies that generate output with substantial stability over a wide variation in temperature. The optical assemblies can be integrated, for example, as part of array generators arranged to project an array or other pattern of dots onto an object or projection plane.

公开(公告)号：US20200018899A1

公开(公告)日：2020-01-16

申请号：US16483987

申请日：2018-02-09

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Simon Gubser ,  Qichuan Yu ,  Choon Hein Law ,  Ji Wang

IPC: G02B6/13 ,  B29D11/00

Abstract: The present disclosure describes light guides and a method of manufacturing light guides that include a rectangular prism-shaped bar, a first polymer or metal cladding on four sides of the rectangular prism-shaped bar, and a second polymer cladding disposed on the first polymer cladding on the four sides of the rectangular prism-shaped bar.

公开(公告)号：US20190383979A1

公开(公告)日：2019-12-19

申请号：US16334239

申请日：2017-09-15

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Markus Rossi ,  Hartmut Rudmann ,  Bassam Hallal

IPC: G02B5/18 ,  G01J3/02 ,  G01J3/18 ,  G02B5/10 ,  G02B27/42

Abstract: A method for manufacturing an optical device comprising providing a plurality of initials bars each having a first side face presented with a first optical component arrangement; positioning the initial bars in a row with their first side faces facing a neighboring one of the initial bars; fixing the initial bars to obtain a bar arrangement; obtaining prism bars by segmenting the bar arrangement by at least one of the steps: conducting a plurality of cuts so that each prism bar comprises a portion of at least two different ones of the initial bars, separating the bar arrangement into sections along cut lines or by creating cut faces at an angle with initial-bar directions; dividing the first optical component arrangement for obtaining a plurality of passive optical components, wherein each prism bar comprises one or more passive optical components comprising a first reflective face each which is of non-planar shape; segmenting prism bars into parts.

公开(公告)号：US20190265393A1

公开(公告)日：2019-08-29

申请号：US15752336

申请日：2016-08-12

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Dmitry Bakin ,  Markus Rossi ,  Kai Engelhardt

IPC: G02B3/04 ,  G02B3/00

Abstract: This disclosure describes illumination assemblies operable to generate a patterned illumination that maintain high contrast over a wide temperature range. An implementation of the illumination assembly can include an array of monochromatic light sources positioned on an illumination plane, first and second optical elements, and an exit aperture. A chief ray of each light source within the array of monochromatic light sources can substantially converge at an exit aperture. In such implementations light generated by the array of monochromatic light sources can be used efficiently.

公开(公告)号：US20190123213A1

公开(公告)日：2019-04-25

申请号：US16091352

申请日：2017-04-05

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Qichuan Yu ,  Hartmut Rudmann ,  Ji Wang ,  Kian Siang Ng ,  Simon Gubser ,  James Eilertsen ,  Sundar Raman Gnana Sambandam

IPC: H01L31/0203 ,  H01L31/0232 ,  H01L31/16 ,  H01L31/18 ,  H01L33/58 ,  H01L33/54 ,  H01L31/0216

Abstract: The wafer-level manufacturing method makes possible to manufacture ultrathin optical devices such as opto-electronic modules. A clear encapsulation is applied to an initial wafer including active optical components and a wafer-size substrate. Thereon, a photostructurable spectral filter layer is produced which defines apertures. Then, trenches are produced which extend through the clear encapsulation and establish sidewalls of intermediate products. Then, an opaque encapsulation is applied to the intermediate products, thus filling the trenches and producing aperture stops. Cutting through the opaque encapsulation material present in the trenches, singulated optical modules are produced, wherein side walls of the intermediate products are covered by the opaque encapsulation material. The wafer-size substrate can be attached to a rigid carrier wafer during most process steps.

公开(公告)号：US10243111B2

公开(公告)日：2019-03-26

申请号：US15631361

申请日：2017-06-23

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Hartmut Rudmann ,  Qichuan Yu ,  Simon Gubser ,  Bojan Tesanovic ,  Xu Yi ,  Eunice Ho Hui Ong ,  Hongyuan Liu ,  Ji Wang ,  Edmund Koon Tian Lua ,  Myo Paing ,  Jian Tang ,  Ming Jie Lee

IPC: H01L33/48 ,  H01L25/16 ,  H01L31/02 ,  H01L31/0203 ,  H01L31/0232 ,  H01L33/54 ,  H01L33/58 ,  H01L33/62

Abstract: The present disclosure describes wafer-level processes for fabricating optoelectronic device subassemblies that can be mounted, for example, to a circuit substrate, such as a flexible cable or printed circuit board, and integrated into optoelectronic modules that include one or more optical subassemblies stacked over the optoelectronic device subassembly. The optoelectronic device subassembly can be mounted onto the circuit substrate using solder reflow technology even if the optical subassemblies are composed of materials that are not reflow compatible.