公开(公告)号：US11817512B2

公开(公告)日：2023-11-14

申请号：US17751446

申请日：2022-05-23

Applicant: Maxeon Solar Pte. Ltd.

Inventor： Taeseok Kim ,  Gabriel Harley ,  John Wade Viatella ,  Périne Jaffrennou

IPC: H01L31/0224 ,  H01L31/18 ,  B23K26/364 ,  B23K26/354 ,  H01L31/05 ,  H01L31/0745 ,  H01L21/60

CPC classification number: H01L31/022441 ,  B23K26/354 ,  B23K26/364 ,  H01L31/0516 ,  H01L31/0745 ,  H01L31/182 ,  H01L2021/60292 ,  Y02E10/50

Abstract: Approaches for foil-based metallization of solar cells and the resulting solar cells are described. For example, a method of fabricating a solar cell involves locating a metal foil above a plurality of alternating N-type and P-type semiconductor regions disposed in or above a substrate. The method also involves laser welding the metal foil to the alternating N-type and P-type semiconductor regions. The method also involves patterning the metal foil by laser ablating through at least a portion of the metal foil at regions in alignment with locations between the alternating N-type and P-type semiconductor regions. The laser welding and the patterning are performed at the same time.

公开(公告)号：US20230253517A1

公开(公告)日：2023-08-10

申请号：US18137935

申请日：2023-04-21

Applicant: Maxeon Solar Pte. Ltd.

Inventor： Pei Hsuan Lu ,  Benjamin I. Hsia ,  David Aaron Randolph Barkhouse ,  Lewis C. Abra ,  George G. Correos ,  Marc Robinson ,  Paul W. Loscutoff ,  Ryan Reagan ,  David Okawa ,  Tamir Lance ,  Thierry Nguyen

IPC: H01L31/0465 ,  H01L31/0475 ,  H01L31/049 ,  H01L31/05 ,  H01L31/0224

CPC classification number: H01L31/0465 ,  H01L31/0475 ,  H01L31/049 ,  H01L31/0508 ,  H01L31/022433

Abstract: Metallization of semiconductor substrates using a laser beam, and the resulting structures, e.g., micro-electronic devices, semiconductor substrates and/or solar cells, solar cell circuit, solar cell strings, and solar cell arrays are described. A solar cell string can include a plurality of solar cells. The plurality of solar cells can include a substrate and a plurality of semiconductor regions disposed in or above the substrate. A plurality of conductive contact structures is electrically connected to the plurality semiconductor regions. Each conductive contact structure includes a locally deposited metal portion disposed in contact with a corresponding one of the semiconductor regions.

公开(公告)号：US11652180B2

公开(公告)日：2023-05-16

申请号：US15815420

申请日：2017-11-16

Applicant: Maxeon Solar Pte. Ltd.

Inventor： John Liptac ,  Paul Dentinger ,  Robert Lamkin ,  James Page ,  Tom Reynolds

IPC: H01L31/0525 ,  G01S3/786 ,  H01L31/02 ,  H01L31/042 ,  H01L31/048 ,  H01L31/0352 ,  H01L31/05 ,  H02S20/32 ,  H01L31/054 ,  F24S50/20 ,  H01L31/0224

CPC classification number: H01L31/0525 ,  F24S50/20 ,  G01S3/7861 ,  H01L31/0201 ,  H01L31/022433 ,  H01L31/035281 ,  H01L31/042 ,  H01L31/048 ,  H01L31/0508 ,  H01L31/0547 ,  H02S20/32 ,  Y02E10/47 ,  Y02E10/52

Abstract: Embodiments of the present invention may utilize one or more techniques, alone or in combination, to maximize a surface area of a receiver that is configured to convert light into another form of energy. One technique enhances collection efficiency by controlling a size, shape, and/or position of a cell relative to an expected illumination profile under various conditions. Another technique positions non-active elements (such as electrical contacts and/or interconnects) on surfaces likely to be shaded from incident light by other elements of the receiver. Another technique utilizes embodiments of interconnect structures occupying a small footprint. According to certain embodiments, the receiver may be cooled by exposure to a fluid such as water or air.

公开(公告)号：US20250125763A1

公开(公告)日：2025-04-17

申请号：US18380176

申请日：2023-10-15

Applicant: Maxeon Solar Pte. Ltd.

Inventor： Nicholas Berry

IPC: H02S30/10 ,  F16B12/44

Abstract: A photovoltaic module crossbar is disclosed. The photovoltaic module crossbar includes a central portion, a first angled end portion extending from the central portion in a first direction and configured to incur deformations from a first component of a photovoltaic module frame that interlock with deformations in the first component of the photovoltaic module frame, and a second angled end portion extending from the central portion in a second direction and configured to incur deformations from a second component of the photovoltaic module frame that interlock with deformations in the second component of the photovoltaic module frame.

公开(公告)号：US12230727B2

公开(公告)日：2025-02-18

申请号：US18114119

申请日：2023-02-24

Applicant: Maxeon Solar Pte. Ltd.

Inventor： Matthieu Moors ,  David D. Smith ,  Gabriel Harley ,  Taeseok Kim

IPC: H01L31/061 ,  H01L31/0216 ,  H01L31/0224 ,  H01L31/068 ,  H01L31/18

Abstract: A method of fabricating a solar cell is disclosed. The method can include forming a dielectric region on a surface of a solar cell structure and forming a metal layer on the dielectric layer. The method can also include configuring a laser beam with a particular shape and directing the laser beam with the particular shape on the metal layer, where the particular shape allows a contact to be formed between the metal layer and the solar cell structure.

公开(公告)号：US12199201B2

公开(公告)日：2025-01-14

申请号：US17864225

申请日：2022-07-13

Applicant: Maxeon Solar Pte. Ltd.

Inventor： Richard Hamilton Sewell ,  Gabriel Harley ,  Nils-Peter Harder

IPC: H01L31/0224 ,  H01L31/0216 ,  H01L31/0236 ,  H01L31/0745 ,  H01L31/18

Abstract: Thermocompression bonding approaches for foil-based metallization of non-metal surfaces of solar cells, and the resulting solar cells, are described. For example, a solar cell includes a substrate and a plurality of alternating N-type and P-type semiconductor regions disposed in or above the substrate. A plurality of conductive contact structures is electrically connected to the plurality of alternating N-type and P-type semiconductor regions. Each conductive contact structure includes a metal foil portion disposed in direct contact with a corresponding one of the alternating N-type and P-type semiconductor regions.

公开(公告)号：US20240421236A1

公开(公告)日：2024-12-19

申请号：US18621417

申请日：2024-03-29

Applicant: MAXEON SOLAR PTE. LTD.

Inventor： Ratson MORAD ,  Gilad ALMOGY ,  Itai SUEZ ,  Jean HUMMEL ,  Nathan BECKETT ,  Yafu LIN ,  John GANNON ,  Michael J. STARKEY ,  Robert STUART ,  Tamir LANCE ,  Dan MAYDAN

IPC: H01L31/02 ,  H01L31/0224 ,  H01L31/0352 ,  H01L31/042 ,  H01L31/044 ,  H01L31/048 ,  H01L31/05 ,  H01L31/0747 ,  H01L31/18 ,  H02J3/38 ,  H02J3/46 ,  H02J5/00 ,  H02S40/32 ,  H02S40/34

Abstract: A high efficiency configuration for a solar cell module comprises solar cells conductively bonded to each other in a shingled manner to form super cells, which may be arranged to efficiently use the area of the solar module, reduce series resistance, and increase module efficiency.

公开(公告)号：US12125929B2

公开(公告)日：2024-10-22

申请号：US15946229

申请日：2018-04-05

Applicant: MAXEON SOLAR PTE. LTD.

Inventor： Gabriela Elena Bunea ,  Thierry Nguyen ,  Lewis Abra

IPC: H01L31/05 ,  H01L31/02 ,  H01L31/044 ,  H01L31/049 ,  H01L31/054 ,  H01L31/18

CPC classification number: H01L31/0508 ,  H01L31/02008 ,  H01L31/044 ,  H01L31/049 ,  H01L31/054 ,  H01L31/18

Abstract: Aspects of the disclosure provide a solar device and a method for making the solar device. The solar device can include solar cells configured to form a solar cell string with at least a string terminal, and an insulated interconnector including two conductive ends configured to connect the string terminal to peripheral circuitry of the solar device. The method can include disposing the solar cells to form a solar cell string with at least a string terminal, and disposing an insulated interconnector with two conductive ends to connect the string terminal to peripheral circuitry of the solar device.

公开(公告)号：US12080815B2

公开(公告)日：2024-09-03

申请号：US18137935

申请日：2023-04-21

Applicant: Maxeon Solar Pte. Ltd.

Inventor： Pei Hsuan Lu ,  Benjamin I. Hsia ,  David Aaron Randolph Barkhouse ,  Lewis C. Abra ,  George G. Correos ,  Marc Robinson ,  Paul W. Loscutoff ,  Ryan Reagan ,  David Okawa ,  Tamir Lance ,  Thierry Nguyen

IPC: H01L31/0465 ,  H01L31/0224 ,  H01L31/0475 ,  H01L31/049 ,  H01L31/05

CPC classification number: H01L31/0465 ,  H01L31/022433 ,  H01L31/0475 ,  H01L31/049 ,  H01L31/0508

Abstract: Metallization of semiconductor substrates using a laser beam, and the resulting structures, e.g., micro-electronic devices, semiconductor substrates and/or solar cells, solar cell circuit, solar cell strings, and solar cell arrays are described. A solar cell string can include a plurality of solar cells. The plurality of solar cells can include a substrate and a plurality of semiconductor regions disposed in or above the substrate. A plurality of conductive contact structures is electrically connected to the plurality semiconductor regions. Each conductive contact structure includes a locally deposited metal portion disposed in contact with a corresponding one of the semiconductor regions.

公开(公告)号：US12080811B2

公开(公告)日：2024-09-03

申请号：US17176489

申请日：2021-02-16

Applicant: MAXEON SOLAR PTE. LTD.

Inventor： Seung Bum Rim ,  Gabriel Harley

IPC: H01L31/0216 ,  H01L31/02 ,  H01L31/0224 ,  H01L31/068 ,  H01L31/18

CPC classification number: H01L31/0216 ,  H01L31/02002 ,  H01L31/022425 ,  H01L31/022441 ,  H01L31/0682 ,  H01L31/1896 ,  Y02E10/547

Abstract: One embodiment relates to a method of fabricating a solar cell. A silicon lamina is cleaved from the silicon substrate. The backside of the silicon lamina includes the P-type and N-type doped regions. A metal foil is attached to the backside of the silicon lamina. The metal foil may be used advantageously as a built-in carrier for handling the silicon lamina during processing of a frontside of the silicon lamina. Another embodiment relates to a solar cell that includes a silicon lamina having P-type and N-type doped regions on the backside. A metal foil is adhered to the backside of the lamina, and there are contacts formed between the metal foil and the doped regions. Other embodiments, aspects and features are also disclosed.