公开(公告)号：US20100113667A1

公开(公告)日：2010-05-06

申请号：US12440824

申请日：2007-08-23

Applicant: Yoshitsugu Morita ,  Minoru Isshiki ,  Tomoko Kato

Inventor： Yoshitsugu Morita ,  Minoru Isshiki ,  Tomoko Kato

IPC: C08L83/04 ,  C08K3/38 ,  C08K3/14 ,  C08K3/22 ,  C08K3/08 ,  C08K3/34 ,  C08K3/28

CPC classification number: C08L83/04 ,  C08G77/12 ,  C08G77/14 ,  C08G77/70 ,  H01L2224/73253 ,  H01L2924/1301 ,  C08L83/00 ,  H01L2924/00

Abstract: A curable silicone composition comprising at least the following components: (A) an epoxy-containing organopolysiloxane; (B) a curing agent for an epoxy resin; (C) a thermally conductive metal powder; and (D) a thermally conductive nonmetal powder; exhibits low viscosity, excellent handleability and curability and, when cured, forms a cured body of flexibility, low specific gravity, and excellent thermal conductivity. An electronic component sealed or adhesively bonded with use of a cured body obtained by curing the aforementioned composition provides high reliability.

Abstract translation: 至少包含以下组分的可固化有机硅组合物：（A）含环氧基的有机聚硅氧烷; （B）环氧树脂用固化剂; （C）导热金属粉末; 和（D）导热非金属粉末; 显示出低粘度，优异的可操作性和固化性，并且当固化时形成柔韧性，低比重和优异导热性的固化体。 使用通过固化上述组合物获得的固化体密封或粘合的电子部件提供高可靠性。

公开(公告)号：US20080207848A1

公开(公告)日：2008-08-28

申请号：US11576628

申请日：2005-09-28

Applicant: Yoshitsugu Morita ,  Hiroshi Ueki ,  Minoru Isshiki

Inventor： Yoshitsugu Morita ,  Hiroshi Ueki ,  Minoru Isshiki

IPC: C08L83/06 ,  C08G77/14

CPC classification number: C08G77/14 ,  C08G59/3254 ,  C08L83/06 ,  C08L2205/02 ,  C08L83/00 ,  C08L2666/48 ,  C08L2666/52 ,  C08L2666/44

Abstract: A curable silicone composition containing an organopolysiloxane that contains in one molecule at least one epoxy-containing organic group, has a polystyrene-referenced weight-average molecular weight at least 500, and is expressed by the following general unit formula: (RSiO3/2)x[R1aSiO(4-a)/2]y (where R represents a cycloalkyl group, and R1 represents hydrogen atom or a univalent organic group, except for an aromatic group and a cycloalkyl group, at least one R1 in one molecule being an epoxy-containing univalent organic group, and where the following condition is observed: 0 0; y>0; and x+y=1).

Abstract translation: 含有一分子中含有至少一个含环氧基的有机基团的有机聚硅氧烷的可固化有机硅组合物的聚苯乙烯参考重均分子量至少为500，并由以下通式表示：（RSiO < （2-a）/ 2（a-1）2 SiO 2（4-a）/ 2 （其中R表示环烷基，R 1表示氢原子或一价有机基团，除了芳基和环烷基，至少一个R' 在一个分子中，SUP> 1 是含环氧基的一价有机基团，其中观察到以下条件：0 0; y> 0; x + y = 1）。

公开(公告)号：US07279024B2

公开(公告)日：2007-10-09

申请号：US10803506

申请日：2004-03-17

Applicant: Masahito Uchikoshi ,  Norio Yokoyama ,  Tamas Kekesi ,  Minoru Isshiki

Inventor： Masahito Uchikoshi ,  Norio Yokoyama ,  Tamas Kekesi ,  Minoru Isshiki

IPC: C22B23/00

CPC classification number: C22B23/0423 ,  C22B3/42 ,  C22B23/0461 ,  Y02P10/234

Abstract: High purity cobalt with a very few content of impurities such as copper, a method of manufacturing thereof, and high purity cobalt targets are provided. The cobalt containing impurities such as copper is dissolved in a hydrochloric acid solution, and the concentration of the hydrochloric acid of the aqueous solution of cobalt chloride is adjusted to 0.1 kmol/m3 to 3 kmol/m3. Then, cobalt is added in the aqueous solution of cobalt chloride, and an inert gas is injected into the solution with agitating, in order to convert the divalent copper ions contained in the aqueous solution of cobalt chloride to monovalent copper ions. Then, the aqueous solution of cobalt chloride is fed into a column filled up with the anion exchange resins. Cobalt is not absorbed on the anion exchange resins although the monovalent copper ions are absorbed on the anion exchange resins. Therefore, copper can be separated from the aqueous solution of cobalt chloride. And then, the aqueous solution of cobalt chloride is evaporated to dryness and heated to 623 K to 873 K in a hydrogen atmosphere to generate cobalt.

Abstract translation: 提供了非常少量杂质如铜的高纯度钴，其制造方法和高纯度钴靶。 将含钴杂质如铜溶解在盐酸溶液中，氯化钴水溶液的盐酸浓度调节至0.1kmol / m 3至3kmol / m 3， SUP> 3 。 然后，将钴加入到氯化钴水溶液中，并将惰性气体搅拌注入溶液中，以将氯化钴水溶液中所含的二价铜离子转化为一价铜离子。 然后，将氯化钴水溶液加入填充有阴离子交换树脂的柱中。 尽管单价铜离子被吸收在阴离子交换树脂上，但是钴不会吸收在阴离子交换树脂上。 因此，可以从氯化钴水溶液中分离出铜。 然后，将氯化钴水溶液蒸发至干，并在氢气氛中加热至623K至873K，以产生钴。

公开(公告)号：US20070225437A1

公开(公告)日：2007-09-27

申请号：US10578798

申请日：2004-11-04

Applicant: Yoshitsugu Morita ,  Minoru Isshiki ,  Hiroshi Ueki ,  Atsushi Togashi

Inventor： Yoshitsugu Morita ,  Minoru Isshiki ,  Hiroshi Ueki ,  Atsushi Togashi

IPC: C08L83/06 ,  C09D183/06 ,  C09J183/06

CPC classification number: C09J183/06 ,  C08L83/00 ,  C08L83/06

Abstract: A curable silicone composition includes: (A) an organopolysiloxane represented by the siloxane unit formula (1) given below and having at least two univalent organic groups that contain epoxy groups and are free of aromatic rings: [R13SiO1/2]a [R22SiO2/2]b [R3SiO3/2]c (where R1, R2, and R3 are univalent organic groups, at least two of which are contain epoxy groups and are free of aromatic rings; more than 20 mole % of R3 are aryl groups; a+b+c & equals; 1; on average, “a” satisfies the following condition: 0≦a≦0.8; on average, “b” satisfies the following condition: 0≦b≦0.8; and, on average satisfies the following condition: 0.2≦c≦1.0); (B) a linear-chain organopolysiloxane having at least two univalent organic groups that contain phenolic hydroxyl groups; and (C) a curing accelerator.

Abstract translation: 可固化的有机硅组合物包括：（A）由下式给出的硅氧烷单元式（1）表示的具有至少两个含有环氧基并且不含芳环的一价有机基团的有机聚硅氧烷：[R 1 3 SiO 2 1/2 2 2 2 > 2/2 3 R 1，R 2，R 3和R 3是一价有机基团，其中至少两个含有环氧基并且不含芳环; 大于20摩尔％的R 3是芳基; a + b + c等于1;平均而言，“a”满足以下条件：0 <= a <= 0.8;平均 ，“b”满足以下条件：0 <= b <= 0.8;平均满足下列条件：0.2 <= c <= 1.0）; （B）具有至少两个含有酚羟基的一价有机基团的直链有机聚硅氧烷; 和（C）固化促进剂。

公开(公告)号：US06720083B2

公开(公告)日：2004-04-13

申请号：US10103456

申请日：2002-03-20

Applicant: Kimio Yamakawa ,  Minoru Isshiki ,  Katsutoshi Mine

Inventor： Kimio Yamakawa ,  Minoru Isshiki ,  Katsutoshi Mine

IPC: B32B2520

CPC classification number: H01L24/32 ,  C08K7/18 ,  C08K2201/016 ,  C08L2666/54 ,  C09J11/02 ,  C09J183/04 ,  H01L21/563 ,  H01L24/83 ,  H01L2224/16225 ,  H01L2224/27013 ,  H01L2224/2919 ,  H01L2224/73203 ,  H01L2224/83051 ,  H01L2224/8319 ,  H01L2224/8385 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/14 ,  Y10T428/31511 ,  Y10T428/31663 ,  H01L2924/00

Abstract: An adhesive composition for bonding of semiconductor chips to their chip mounting components comprising a curable polymer composition that comprises a spherical filler having an average particle size from greater than 100 to 1,000 &mgr;m and an aspect ratio of 1 to 1.5. Semiconductor devices according to this invention are characterized in that a semiconductor chip therein is bonded to the mounting component for said chip by the aforementioned adhesive.

Abstract translation: 一种用于将半导体芯片粘合到其芯片安装部件上的粘合剂组合物，其包含可固化聚合物组合物，其包含平均粒度大于100至1,000μm，长宽比为1至1.5的球形填料。 根据本发明的半导体器件的特征在于，其中的半导体芯片通过上述粘合剂结合到用于所述芯片的安装部件。

公开(公告)号：US06498400B2

公开(公告)日：2002-12-24

申请号：US09812860

申请日：2001-03-21

Applicant: Kimio Yamakawa ,  Minoru Isshiki ,  Yoshiko Otani ,  Katsutoshi Mine

Inventor： Kimio Yamakawa ,  Minoru Isshiki ,  Yoshiko Otani ,  Katsutoshi Mine

IPC: H01L2328

CPC classification number: H01L24/83 ,  C09J7/22 ,  C09J7/35 ,  C09J2201/128 ,  C09J2483/00 ,  H01L24/29 ,  H01L24/73 ,  H01L2224/16225 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/29191 ,  H01L2224/29298 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/83101 ,  H01L2224/8319 ,  H01L2224/8388 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/1301 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  Y10T428/28 ,  Y10T428/2813 ,  Y10T428/2848 ,  H01L2924/00014 ,  H01L2924/0715 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929

Abstract: A semiconductor device comprising a semiconductor element; a substrate; and a hot-melt adhesive sheet bonding the semiconductor element to the substrate, wherein the hot-melt adhesive sheet comprises a spacer having the form of a sheet and a hot melt adhesive on both sides of the spacer. A semiconductor device comprising a semiconductor element; a substrate; and a hot-melt adhesive sheet bonding the semiconductor element to the substrate, wherein the hot-melt adhesive sheet comprises a mixture of a hot melt adhesive and a spacer, wherein the adhesive is selected from a silicone-modified epoxy resin adhesive, a silicone adhesive, and a silicone-modified polyimide adhesive, and the spacer has the form of particles.

Abstract translation: 一种半导体器件，包括半导体元件; 底物; 以及将所述半导体元件接合到所述基板的热熔粘合片，其中所述热熔粘合片包括在所述间隔件的两侧上具有片状的形式的隔离物和热熔粘合剂。 一种半导体器件，包括半导体元件; 底物; 以及将所述半导体元件接合到所述基板的热熔粘合片，其中所述热熔粘合片包括热熔粘合剂和间隔物的混合物，其中所述粘合剂选自硅氧烷改性的环氧树脂粘合剂，硅树脂 粘合剂和硅氧烷改性的聚酰亚胺粘合剂，并且间隔物具有颗粒的形式。

公开(公告)号：US06469079B1

公开(公告)日：2002-10-22

申请号：US09437831

申请日：1999-11-10

Applicant: Toshio Okuhara ,  Tadashi Tadokoro ,  Hiroaki Shiota ,  Takeyuki Suzuki ,  Minoru Isshiki

Inventor： Toshio Okuhara ,  Tadashi Tadokoro ,  Hiroaki Shiota ,  Takeyuki Suzuki ,  Minoru Isshiki

IPC: C08K557

CPC classification number: C08K3/34 ,  C08K5/098 ,  C08L27/24 ,  C08L51/04 ,  C08L2666/24

Abstract: A chlorinated vinyl chloride resin composition comprising 100 parts by weight of chlorinated vinyl chloride resin and a hydroxypolycarboxylic acid salt, e.g., sodium tartrate, and/or 0.2 to 1.5 parts by weight of zeolite. The composition exhibits improved thermal stability and is particularly suited to pipe extrusion.

Abstract translation: 氯化氯乙烯树脂组合物，其包含100重量份氯化氯乙烯树脂和羟基多羧酸盐，例如酒石酸钠，和/或0.2至1.5重量份的沸石。 该组合物表现出改善的热稳定性，并且特别适用于管道挤出。

公开(公告)号：US06391081B1

公开(公告)日：2002-05-21

申请号：US09533537

申请日：2000-03-23

Applicant: Masahito Uchikoshi ,  Norio Yokoyama ,  Minoru Isshiki ,  Kouji Mimura

Inventor： Masahito Uchikoshi ,  Norio Yokoyama ,  Minoru Isshiki ,  Kouji Mimura

IPC: C22B905

CPC classification number: C22B4/005 ,  C22B9/226 ,  C22B23/06

Abstract: A metal purification method and a metal refinement method in which metals of high purity can be easily refined and recovered without increasing the size of the purification and refining devices or complicating the operation. To this end, metals containing impurities are molten in a plasma arc containing active hydrogen to remove the impurities. If the metals contain ceramics inclusions, the metals are molten in a plasma arc containing active hydrogen and the ceramics inclusions are caused to float over the molten metal by exploiting the difference of density between the molten metal and the ceramics inclusions. The floating ceramics inclusions are decomposed and removed. For application to refining, the metal oxides are molten in a plasma arc containing active hydrogen so as to be reduced to metals.

Abstract translation: 金属净化方法和金属精制方法，其中可以容易地精炼和回收高纯度的金属，而不增加净化和精制装置的尺寸或使操作变得复杂。 为此，含有杂质的金属在含有活性氢的等离子弧中熔融以除去杂质。 如果金属含有陶瓷夹杂物，则金属在含有活性氢的等离子体电弧中熔融，并且通过利用熔融金属和陶瓷夹杂物之间的密度差，使陶瓷夹杂物漂浮在熔融金属上。 浮选的陶瓷夹杂物被分解和去除。 为了应用于精炼，金属氧化物在含有活性氢的等离子体电弧中熔化，从而还原成金属。

公开(公告)号：US06379792B1

公开(公告)日：2002-04-30

申请号：US09611204

申请日：2000-07-06

Applicant: Minoru Isshiki ,  Kimio Yamakawa ,  Yoshito Ushio ,  Ryoto Shima ,  Katsutoshi Mine

Inventor： Minoru Isshiki ,  Kimio Yamakawa ,  Yoshito Ushio ,  Ryoto Shima ,  Katsutoshi Mine

IPC: B32B2718

CPC classification number: H01L24/29 ,  C08K5/549 ,  C08L2666/44 ,  C09J7/10 ,  C09J183/04 ,  C09J2203/326 ,  H01L24/83 ,  H01L2224/16225 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/29191 ,  H01L2224/29298 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/8319 ,  H01L2224/8385 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01016 ,  H01L2924/0102 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/1301 ,  H01L2924/19041 ,  H01L2924/19043 ,  Y10T428/1471 ,  Y10T428/1476 ,  Y10T428/23 ,  Y10T428/28 ,  Y10T428/2852 ,  Y10T428/31663 ,  C08L83/04 ,  H01L2924/00014 ,  H01L2924/0715 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929

Abstract: A silicone adhesive sheet for bonding a semiconductor chip to a chip attachment component comprising a crosslinkable silicone composition containing a silatrane derivative, and a method for manufacturing a silicone adhesive sheet by subjecting a crosslinkable silicone composition containing a silatrane derivative to a crosslinking reaction between backing materials that do not stick to the crosslinked product of said composition, where at least one of the backing materials has a larger dielectric constant than that of the crosslinked product. The present silicone adhesive sheet allows a semiconductor chip and a chip attachment component to be bonded in a short time at a relatively low temperature.

Abstract translation: 一种用于将半导体芯片接合到芯片附着部件的硅氧烷粘合片，其包含含有硅烷衍生物的可交联硅氧烷组合物，以及通过使含有硅烷衍生物的可交联硅氧烷组合物在背衬材料之间进行交联反应来制造硅氧烷粘合片的方法 其不粘附于所述组合物的交联产物，其中至少一种背衬材料具有比交联产物更大的介电常数。 本发明的硅氧烷粘合片允许半导体芯片和芯片附着部件在较短的时间内以较低的温度结合。

公开(公告)号：US06242539B1

公开(公告)日：2001-06-05

申请号：US09119386

申请日：1998-07-20

Applicant: Tadashi Tadokoro ,  Takeyuki Suzuki ,  Minoru Isshiki

Inventor： Tadashi Tadokoro ,  Takeyuki Suzuki ,  Minoru Isshiki

IPC: C08F822

CPC classification number: C08F8/22 ,  C08F14/06

Abstract: A polyvinyl chloride resin having an average particle diameter of not less than 150 &mgr;m and porosity at 31-1,011 psi of not less than 0.15 cc/g is suspended in an aqueous medium and chlorinated by blowing gaseous chlorine into the aqueous suspension. In this way, floating resin formation during chlorination can be prevented and a chlorinated polyvinyl chloride resin excellent in free flow property and showing good resistance to initial discoloration and good thermal stability in heating and molding processes can be produced.

Abstract translation: 将平均粒径不小于150μm的聚氯乙烯树脂和31-1,011psi的孔隙率不低于0.15cc / g悬浮在水性介质中，并通过将气态氯吹入水性悬浮液中进行氯化。 这样可以防止在氯化过程中形成漂浮的树脂，并且可以制得自由流动性优异的氯化聚氯乙烯树脂，并且可以产生良好的抗初始变色性和在加热和模制过程中良好的热稳定性。