Abstract:
A method of Raman detection for a portable, integrated spectrometer instrument includes directing Raman scattered photons by a sample to an avalanche photodiode (APD), the APD configured to generate an output signal responsive to the intensity of the Raman scattered photons incident thereon. The output signal of the APD is amplified and passed through a discriminator so as to reject at least one or more of amplifier noise and dark noise. A number of discrete output pulses within a set operational range of the discriminator is counted so as to determine a number of photons detected by the APD.
Abstract:
A self-adhering sensor for non-invasively attaching to a portion of a skin is provided. The sensor comprises a biocompatible substrate, and an array of solid nanoelectrodes coupled to the biocompatible substrate and configured to self-adhere to the skin. Also provided is a sensor for attaching to a portion of a skin, where the sensor comprises an array of solid electrodes configured to self-adhere to the skin, where each of the solid structures comprises a stem and one or more projections extending out from the stem, where both the stem and the projections are solid. The stem comprises a mechanical stopper to control the extent of penetration of the solid electrodes into the skin. The sensor further comprises an electrolyte coating disposed on one or more of the solid structures.
Abstract:
A micro-electromechanical system (MEMS) based current & magnetic field sensor includes a MEMS-based magnetic field sensing component a structural component comprising a silicon substrate and a compliant layer comprising a material selected from the group consisting of silicon dioxide and silicon nitride, a magnetic-to-mechanical converter coupled to the structural component to provide a mechanical indication of the magnetic field, and a strain responsive component coupled to the structural component to sense the mechanical indication and to provide an indication of the current in the current carrying conductor in response thereto.
Abstract:
A method of manufacturing a sensor is provided. The method includes disposing a sacrificial layer on a substrate, disposing a low-thermal-conductivity layer on the sacrificial layer, and disposing a first set of conductive arms and a second set of conductive arms on the low-thermal-conductivity layer to form a plurality of thermal junctions. The plurality of thermal junctions is adapted to form a plurality of hot junctions and a plurality of cold junctions when subjected to a difference in temperature. The method also includes removing the sacrificial layer and a portion of the low-thermal-conductivity layer to form a cavity therein. The cavity is configured to provide insulation for the plurality of hot junctions. A thermopile sensor is also provided, and a calorimetric gas sensor implementing the thermopile sensor is provided.