公开(公告)号：US20240102799A1

公开(公告)日：2024-03-28

申请号：US18530130

申请日：2023-12-05

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Ying-Chung CHEN ,  Hsun-Wei CHAN ,  Lu-Ming LAI ,  Kuang-Hsiung CHEN

IPC: G01C3/08

CPC classification number: G01C3/08

Abstract: An optical module includes: a carrier; an optical element disposed on the upper side of the carrier; and a housing disposed on the upper side of the carrier, the housing defining an aperture exposing at least a portion of the optical element, an outer sidewall of the housing including at least one singulation portion disposed on the upper side of the carrier, wherein the singulation portion of the housing is a first portion of the housing, and wherein the housing further includes a second portion and a surface of the singulation portion of the housing is rougher than a surface of the second portion of the housing.

公开(公告)号：US20220199550A1

公开(公告)日：2022-06-23

申请号：US17129641

申请日：2020-12-21

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chi Sheng TSENG ,  Lu-Ming LAI ,  Hui-Chung LIU ,  Yu-Che HUANG

IPC: H01L23/00 ,  H01L23/538 ,  H01R12/61 ,  H01L21/50 ,  G01L1/26

Abstract: A semiconductor device package and a method for manufacturing a semiconductor device package are provided. The semiconductor device package includes a carrier, a sensor module, a connector, and a stress buffer structure. The sensor module is disposed on the carrier. The connector is connected to the carrier. The stress buffer structure connects the connector to the sensor module.

公开(公告)号：US20210358823A1

公开(公告)日：2021-11-18

申请号：US16877197

申请日：2020-05-18

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chi Sheng TSENG ,  Lu-Ming LAI ,  Yu-Che HUANG ,  Shih-Chieh TANG ,  Yu-Min PENG ,  Hui-Chung LIU

IPC: H01L23/31 ,  H01L21/56

Abstract: A semiconductor package structure and a method for manufacturing a semiconductor package structure are provided. The semiconductor package structure includes a semiconductor package structure includes a semiconductor die and a light absorbing layer. The semiconductor die has a first surface, a second surface and a third surface. An active layer of the semiconductor die is adjacent to the first surface. The second surface is opposite to the first surface. The third surface extends from the first surface to the second surface. The light absorbing layer covers the second surface and the third surface of the semiconductor die. The semiconductor die has a thickness defined from the first surface to the second surface, and the thickness of the semiconductor die is less than or equal to about 300 micrometers (μm).

公开(公告)号：US20210280755A1

公开(公告)日：2021-09-09

申请号：US16809506

申请日：2020-03-04

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Hsin-Ying HO ,  Hsun-Wei CHAN ,  Shih-Chieh TANG ,  Lu-Ming LAI

IPC: H01L33/58 ,  G02B3/00

Abstract: A semiconductor device package includes a light-emitting device, a diffuser structure, a first optical sensor, and a second optical sensor. The light-emitting device has a light-emitting surface. The diffuser structure is above the light-emitting surface of the light-emitting device. The first optical sensor is disposed below the diffuser structure, and the first optical sensor is configured to detect a first reflected light reflected by the diffuser structure. The second optical sensor is disposed below the diffuser structure, and the second optical sensor is configured to detect a second reflected light reflected by the diffuser structure.

公开(公告)号：US20210183839A1

公开(公告)日：2021-06-17

申请号：US17187539

申请日：2021-02-26

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Hsin-Ying HO ,  Ying-Chung CHEN ,  Lu-Ming LAI

IPC: H01L25/16 ,  F21V8/00 ,  G02B6/42 ,  H01L31/0232 ,  H01L27/15 ,  H01L25/00 ,  H01L27/146 ,  H01L31/12 ,  H01L31/0203 ,  H01L33/48 ,  H01S5/02253 ,  H01S5/02325 ,  H01S5/02326

Abstract: An optical module includes a carrier, a light emitter disposed on the carrier, a light detector disposed on the carrier, and a housing disposed on the carrier. The housing defines a first opening that exposes the light emitter and a second opening that exposes the light detector. The optical module further includes a first light transmission element disposed on the first opening and a second light transmission element disposed on the second opening. A first opaque layer is disposed on the first light transmission element, the first opaque layer defining a first aperture, and a second opaque layer disposed on the second light transmission element, the second opaque layer defining a second aperture.

公开(公告)号：US20210017018A1

公开(公告)日：2021-01-21

申请号：US16517444

申请日：2019-07-19

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Wei-Wei LIU ,  Huei-Siang WONG ,  Lu-Ming LAI

IPC: B81B7/00 ,  B81C1/00

Abstract: A semiconductor package structure includes an electronic device having an exposed region adjacent to a first surface, a dam surrounding the exposed region of the semiconductor die and disposed on the first surface, the dam having a top surface away from the first surface, an encapsulant encapsulating the first surface of the electronic device, exposing the exposed region of the electronic device. A surface of the dam is retracted from a top surface of the encapsulant. A method for manufacturing the semiconductor package structure is also provided.

公开(公告)号：US20190202686A1

公开(公告)日：2019-07-04

申请号：US16212609

申请日：2018-12-06

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chi Sheng TSENG ,  Lu-Ming LAI ,  Shih-Chieh TANG ,  Hsin-Ying HO ,  Hsun-Wei CHAN

IPC: B81B7/02 ,  H01L33/60

Abstract: A semiconductor device package is provided, which includes a carrier, a first reflective element, a second reflective element, a first optical component, a second optical component and a microelectromechanical system (MEMS) device. The carrier has a first surface. The first reflective element is disposed on the first surface of the carrier. The second reflective element disposed on the first surface of the carrier. The first optical component is disposed on the first reflective element. The second optical component is disposed on the second reflective element. The MEMS device is disposed on the first surface of the carrier to provide light beams to the first reflective element and the second reflective element. The light beams provided to the first reflective element are reflected to the first optical component and the light beams provided to the second reflective element are reflected to the second optical component.

公开(公告)号：US20190097387A1

公开(公告)日：2019-03-28

申请号：US16118228

申请日：2018-08-30

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Yu-Hsuan TSAI ,  Lu-Ming LAI ,  Ying-Chung CHEN ,  Shih-Chieh TANG

IPC: H01S5/022 ,  H01S5/02 ,  H01L33/62 ,  H01L23/00 ,  H01L23/538 ,  H01L25/075 ,  H01S5/40 ,  H01L33/48

Abstract: An optical package structure includes a substrate having a first surface, an interposer bonded to the first surface through a bonding layer, the interposer having a first area from a top view perspective, and an optical device on the interposer, having a second area from the top view perspective, the first area being greater than the second area. A method for manufacturing the optical package structure is also provided.

公开(公告)号：US20180066982A1

公开(公告)日：2018-03-08

申请号：US15687090

申请日：2017-08-25

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Yu-Min PENG ,  Ching-Han HUANG ,  Lu-Ming LAI

IPC: G01J1/04

CPC classification number: G01J1/0407 ,  G01J1/0422

Abstract: The present disclosure relates to an optical device. The optical device comprises an electronic component, a plurality of light conducting pillars and an opaque layer. The electronic component includes a plurality of pixels. Each of the light conducting pillars is disposed over a corresponding pixel of the plurality of pixels of the electronic component. The opaque layer covers a lateral surface of each of the light conducting pillars.

公开(公告)号：US20170287863A1

公开(公告)日：2017-10-05

申请号：US15628485

申请日：2017-06-20

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chin-Cheng KUO ,  Ying-Te OU ,  Lu-Ming LAI

IPC: H01L23/00 ,  H01L21/78 ,  H01L21/768 ,  H01L23/528 ,  H01L23/522

CPC classification number: H01L24/13 ,  H01L21/561 ,  H01L23/3114 ,  H01L23/3185 ,  H01L24/05 ,  H01L24/11 ,  H01L24/14 ,  H01L2224/0401 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05666 ,  H01L2224/13024 ,  H01L2224/13111 ,  H01L2924/10156 ,  H01L2924/00014

Abstract: A semiconductor die includes a semiconductor body, an insulating layer, a conductive circuit layer and at least one conductive bump. The semiconductor body has a first surface, a second surface and a side surface extending between the first surface and the second surface. The insulating layer is disposed on the first surface and the side surface of the semiconductor body. The insulating layer includes a first insulating layer over the semiconductor body and a second insulating layer over the first insulating later. The insulating layer includes a step structure. The conductive circuit layer is electrically connected to the first surface of the semiconductor body, the conductive circuit layer includes at least one pad, and the conductive bump is electrically connected to the pad.