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    Micromechanical sensor
    42.
    发明授权
    Micromechanical sensor 有权
    微机械传感器

    公开(公告)号：US07213465B2

    公开(公告)日：2007-05-08

    申请号：US10958014

    申请日：2004-10-04

    Applicant: Hubert Benzel ,  Frank Schaefer ,  Christoph Schelling

    Inventor： Hubert Benzel ,  Frank Schaefer ,  Christoph Schelling

    IPC: G01F9/00

    CPC classification number: B81C1/00246 ,  B81B2201/0292 ,  B81C2203/0778 ,  G01K7/015 ,  G01L9/0054 ,  G01L19/147 ,  G01P1/023 ,  G01P15/08 ,  G01P15/0802 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48464 ,  H01L2224/73257 ,  H01L2924/16235 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012

    Abstract: A micromechanical sensor, and a method for manufacturing a micromechanical sensor, featuring, in addition to a sensor element, at least a part of an evaluation circuit. In this context, the micromechanical sensor contains at least a first structural element made of a first material. The first structural element houses at least one sensor region and a part of an evaluation circuit, at least one sensor element being located in the sensor region. Moreover, at least one first and one second side are to be distinguished from one another in the first structural element. The first side of the first structural element features at least the sensor element, while the second side of the first structural element features at least a part of the evaluation circuit. At least parts of the sensor region and/or of the evaluation circuit are formed from the first material by micromechanical processing.

    Abstract translation: 微机械传感器和微机械传感器的制造方法，除传感器元件之外，还具有评估电路的至少一部分。 在本文中，微机械传感器至少包含由第一材料制成的第一结构元件。 第一结构元件容纳至少一个传感器区域和评估电路的一部分，至少一个传感器元件位于传感器区域中。 此外，在第一结构元件中至少一个第一和第二侧面将彼此区分开。 第一结构元件的第一侧至少具有传感器元件，而第一结构元件的第二侧具有评估电路的至少一部分。 传感器区域和/或评估电路的至少一部分通过微机械处理由第一材料形成。

    Method for production of a semiconductor component and a semiconductor component produced by said method
    44.
    发明授权
    Method for production of a semiconductor component and a semiconductor component produced by said method 有权
    用于制造通过所述方法制造的半导体部件和半导体部件的方法

    公开(公告)号：US07037438B2

    公开(公告)日：2006-05-02

    申请号：US10070286

    申请日：2001-04-20

    Applicant: Hubert Benzel ,  Heribert Weber ,  Hans Artmann ,  Frank Schaefer

    Inventor： Hubert Benzel ,  Heribert Weber ,  Hans Artmann ,  Frank Schaefer

    IPC: H01L21/302

    CPC classification number: G01L9/0042 ,  B81B2201/0264 ,  B81B2203/0127 ,  B81B2203/0315 ,  B81C1/00047 ,  B81C1/00595 ,  B81C2201/0115 ,  G01L9/0045 ,  H01L21/3063

    Abstract: A method is for producing a semiconductor component, e.g., a multilayer semiconductor element, e.g., a micromechanical component, e.g., a pressure sensor, having a semiconductor substrate, e.g., made of silicon, and a semiconductor component produced according to the method. To reduce the production cost of such a semiconductor component, in a first step a first porous layer is produced in the semiconductor component, and in a second step a hollow or cavity is produced under or from the first porous layer in the semiconductor component, with the hollow or cavity capable of being provided with an external access opening.

    Abstract translation: 一种用于制造半导体部件的方法，例如多层半导体元件，例如具有例如由硅制成的半导体衬底的微机械部件，例如压力传感器，以及根据该方法制造的半导体部件。 为了降低这种半导体部件的制造成本，在第一步骤中，在半导体部件中制造第一多孔层，在第二工序中，在半导体部件的第一多孔层的下面或从半导体部件的第一多孔层制造中空或空腔， 所述中空或空腔能够设置有外部通路口。

    Method for manufacturing a semiconductor component, as well as a semiconductor component, in particular a membrane sensor
    45.
    发明申请
    Method for manufacturing a semiconductor component, as well as a semiconductor component, in particular a membrane sensor 有权
    用于制造半导体部件的方法以及半导体部件，特别是膜传感器

    公开(公告)号：US20050181529A1

    公开(公告)日：2005-08-18

    申请号：US11011888

    申请日：2004-12-13

    Applicant: Hubert Benzel ,  Frank Schaefer ,  Simon Armbruster ,  Gerhard Lammel ,  Christoph Schelling ,  Joerg Brasas

    Inventor： Hubert Benzel ,  Frank Schaefer ,  Simon Armbruster ,  Gerhard Lammel ,  Christoph Schelling ,  Joerg Brasas

    IPC: B81B3/00 ,  H01L21/00 ,  H01L29/24 ,  H01L33/00

    CPC classification number: B81C1/00158 ,  B81B3/007 ,  B81B2201/0264 ,  B81B2203/0127 ,  B81B2203/0315 ,  B81C2201/0115 ,  B81C2201/0116 ,  B81C2201/0136

    Abstract: A manufacturing method for a micromechanical semiconductor element includes providing on a semiconductor substrate a patterned stabilizing element having at least one opening. The opening is arranged such that it allows access to a first region in the semiconductor substrate, the first region having a first doping. Furthermore, a selective removal of at least a portion of the semiconductor material having the first doping out of the first region of the semiconductor substrate is provided. In addition, a membrane is produced above the first region using a first epitaxy layer applied on the stabilizing element. In a further method step, at least a portion of the first region is used to produce a cavity underneath the stabilizing element. In this manner, the present invention provides for the production of the patterned stabilizing element by means of a second epitaxy layer, which is applied on the semiconductor substrate.

    Abstract translation: 微机电半导体元件的制造方法包括在半导体衬底上提供具有至少一个开口的图案化稳定元件。 开口被布置成使得其允许接近半导体衬底中的第一区域，第一区域具有第一掺杂。 此外，提供了选择性地去除半导体衬底的第一区域中具有第一掺杂的半导体材料的至少一部分。 此外，使用施加在稳定元件上的第一外延层，在第一区域上方产生膜。 在另一方法步骤中，第一区域的至少一部分用于在稳定元件下方产生空腔。 以这种方式，本发明提供了通过施加在半导体衬底上的第二外延层来生产图案化的稳定元件。

    Micromechanical sensor
    47.
    发明申请
    Micromechanical sensor 有权
    微机械传感器

    公开(公告)号：US20050115321A1

    公开(公告)日：2005-06-02

    申请号：US10958014

    申请日：2004-10-04

    Applicant: Hubert Benzel ,  Frank Schaefer ,  Christoph Schelling

    Inventor： Hubert Benzel ,  Frank Schaefer ,  Christoph Schelling

    IPC: G01K7/01 ,  G01L9/00 ,  G01P1/02 ,  G01P15/08 ,  G01N25/00 ,  G01N7/00 ,  H01L21/461

    CPC classification number: B81C1/00246 ,  B81B2201/0292 ,  B81C2203/0778 ,  G01K7/015 ,  G01L9/0054 ,  G01L19/147 ,  G01P1/023 ,  G01P15/08 ,  G01P15/0802 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48464 ,  H01L2224/73257 ,  H01L2924/16235 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012

    Abstract: A micromechanical sensor, and a method for manufacturing a micromechanical sensor, featuring, in addition to a sensor element, at least a part of an evaluation circuit. In this context, the micromechanical sensor contains at least a first structural element made of a first material. The first structural element houses at least one sensor region and a part of an evaluation circuit, at least one sensor element being located in the sensor region. Moreover, at least one first and one second side are to be distinguished from one another in the first structural element. The first side of the first structural element features at least the sensor element, while the second side of the first structural element features at least a part of the evaluation circuit. At least parts of the sensor region and/or of the evaluation circuit are formed from the first material by micromechanical processing.

    Abstract translation: 微机械传感器和微机械传感器的制造方法，除传感器元件之外，还具有评估电路的至少一部分。 在本文中，微机械传感器至少包含由第一材料制成的第一结构元件。 第一结构元件容纳至少一个传感器区域和评估电路的一部分，至少一个传感器元件位于传感器区域中。 此外，在第一结构元件中至少一个第一和第二侧面将彼此区分开。 第一结构元件的第一侧至少具有传感器元件，而第一结构元件的第二侧具有评估电路的至少一部分。 传感器区域和/或评估电路的至少一部分通过微机械处理由第一材料形成。

    Method for producing cavities having optically transparent wall
    48.
    发明申请
    Method for producing cavities having optically transparent wall 有权
    用于制造具有光学透明壁的空腔的方法

    公开(公告)号：US20050016949A1

    公开(公告)日：2005-01-27

    申请号：US10492009

    申请日：2002-09-04

    Applicant: Hubert Benzel ,  Heribert Weber ,  Frank Schaefer

    Inventor： Hubert Benzel ,  Heribert Weber ,  Frank Schaefer

    IPC: B81B1/00 ,  B81B3/00 ,  B81C1/00 ,  H01B13/00

    CPC classification number: B81C1/00047 ,  B81C1/00246 ,  B81C2201/0115 ,  B81C2201/014

    Abstract: A method is proposed which will enable cavities having optically transparent walls to be produced simply and cost-effectively in a component by using standard methods of microsystems technology. For this purpose, a silicon region is first produced, which is surrounded on all sides by at least one optically transparent cladding layer. At least one opening is then produced in the cladding layer. Over this opening, the silicon surrounded by the cladding layer is dissolved out, forming a cavity within the cladding layer. In this context, the cladding layer acts as an etch barrier layer.

    Abstract translation: 提出了一种通过使用微系统技术的标准方法，能够简单且成本有效地在部件中产生具有光学透明壁的空腔的方法。 为此目的，首先制造出硅区域，其通过至少一个光学透明覆层在所有侧面上被包围。 然后在包层中产生至少一个开口。 在该开口上，由包覆层包围的硅被溶出，在包覆层内形成空腔。 在本文中，包覆层用作蚀刻阻挡层。

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