公开(公告)号：US11608265B2

公开(公告)日：2023-03-21

申请号：US17357234

申请日：2021-06-24

Applicant: Infineon Technologies AG

Inventor： Stephan Pindl ,  Carsten Ahrens ,  Stefan Jost ,  Ulrich Krumbein

IPC: B81C1/00 ,  B81B3/00

Abstract: A method for providing a semiconductor layer arrangement on a substrate which comprises providing a semiconductor layer arrangement having a functional layer and a semiconductor substrate layer, attaching the semiconductor layer arrangement to a glass substrate layer such that the functional layer is arranged between the glass substrate layer and the semiconductor substrate layer, and removing the semiconductor substrate layer at least partially such that the glass substrate layer substitutes the semiconductor substrate layer as the substrate of the semiconductor layer arrangement.

公开(公告)号：US11524891B2

公开(公告)日：2022-12-13

申请号：US17151392

申请日：2021-01-18

Applicant: Infineon Technologies AG

Inventor： Wolfgang Klein ,  Evangelos Angelopoulos ,  Stefan Barzen ,  Marc Fueldner ,  Stefan Geissler ,  Matthias Friedrich Herrmann ,  Ulrich Krumbein ,  Konstantin Tkachuk ,  Giordano Tosolini ,  Juergen Wagner

IPC: B81C1/00 ,  H04R7/02 ,  H04R31/00 ,  B81B3/00 ,  B81B7/02 ,  H04R1/08 ,  H04R7/08

Abstract: A microfabricated structure includes a perforated stator; a first isolation layer on a first surface of the perforated stator; a second isolation layer on a second surface of the perforated stator; a first membrane on the first isolation layer; a second membrane on the second isolation layer; and a pillar coupled between the first membrane and the second membrane, wherein the first isolation layer includes a first tapered edge portion having a common surface with the first membrane, wherein the second isolation layer includes a first tapered edge portion having a common surface with the second membrane, and wherein an endpoint of the first tapered edge portion of the first isolation layer is laterally offset with respect to an endpoint of the first tapered edge portion of the second isolation layer.

公开(公告)号：US11292097B2

公开(公告)日：2022-04-05

申请号：US16402248

申请日：2019-05-03

Applicant: Infineon Technologies AG

Inventor： Alfons Dehe ,  Reinhard Gabl ,  Ulrich Krumbein

IPC: B23Q3/18 ,  H04R7/18 ,  H04R17/00 ,  H04R19/00 ,  H04R31/00 ,  B81B3/00 ,  B81C1/00

Abstract: A structure for fixing a membrane to a carrier including a carrier; a suspended structure; and a holding structure with a rounded concave shape which is configured to fix the suspended structure to the carrier and where a tapered side of the holding structure physically connects to the suspended structure is disclosed. A method of forming the holding structure on a carrier to support a suspended structure is further disclosed. The method may include: forming a holding structure on a carrier; forming a suspended structure on the holding structure; shaping the holding structure such that it has a concave shape; and arranging the holding structure such that a tapered side of the holding structure physically connects to the suspended structure.

公开(公告)号：US11117798B2

公开(公告)日：2021-09-14

申请号：US16270219

申请日：2019-02-07

Applicant: Infineon Technologies AG

Inventor： Gunar Lorenz ,  Alfons Dehe ,  Marc Fueldner ,  Bernd Goller ,  Ulrich Krumbein ,  Andreas Wiesbauer

IPC: H01L29/84 ,  B81B7/00 ,  B81B3/00 ,  B81B7/02 ,  H04R19/04 ,  H04R1/02 ,  G01L9/00 ,  H04R19/00

Abstract: A MEMS sensor includes a housing with an interior volume, wherein the housing has an access port to the interior volume, a MEMS component in the housing, and a protection structure, which reduces an introduction of electromagnetic disturbance radiation with a wavelength in the range between 10 nm and 20 μm into the interior volume through the access port and reduces a propagation of the electromagnetic disturbance radiation in the interior volume.

公开(公告)号：US20190270637A1

公开(公告)日：2019-09-05

申请号：US16270315

申请日：2019-02-07

Applicant: Infineon Technologies AG

Inventor： Marc Fueldner ,  Niccolo De Milleri ,  Bernd Goller ,  Ulrich Krumbein ,  Gerhard Lohninger ,  Giordano Tosolini ,  Andreas Wiesbauer

IPC: B81B7/00 ,  H04R1/02

Abstract: A MEMS assembly includes a housing having an internal volume V, wherein the housing has a sound opening to the internal volume V, a MEMS component in the housing adjacent to the sound opening, and a layer element arranged at least regionally at a surface region of the housing that faces the internal volume V, wherein the layer element includes a layer material having a lower thermal conductivity and a higher heat capacity than the housing material of the housing that adjoins the layer element.

公开(公告)号：US20190255669A1

公开(公告)日：2019-08-22

申请号：US16402248

申请日：2019-05-03

Applicant: Infineon Technologies AG

Inventor： Alfons Dehe ,  Reinhard Gabl ,  Ulrich Krumbein

IPC: B23Q3/18 ,  H04R17/00 ,  H04R19/00 ,  H04R31/00 ,  B81C1/00 ,  B81B3/00 ,  H04R7/18

Abstract: A structure for fixing a membrane to a carrier including a carrier; a suspended structure; and a holding structure with a rounded concave shape which is configured to fix the suspended structure to the carrier and where a tapered side of the holding structure physically connects to the suspended structure is disclosed. A method of forming the holding structure on a carrier to support a suspended structure is further disclosed. The method may include: forming a holding structure on a carrier; forming a suspended structure on the holding structure; shaping the holding structure such that it has a concave shape; and arranging the holding structure such that a tapered side of the holding structure physically connects to the suspended structure.

公开(公告)号：US20180109892A1

公开(公告)日：2018-04-19

申请号：US15843915

申请日：2017-12-15

Applicant: Infineon Technologies AG

Inventor： Andreas Wiesbauer ,  Christian Jenkner ,  Ulrich Krumbein ,  Marc Füldner

IPC: H04R29/00

CPC classification number: H04R29/004 ,  H04R2201/003

Abstract: According to an embodiment, a transducer system includes a transducing element and a symmetry detection circuit. The transducing element includes a signal plate, a first sensing plate, and a second sensing plate. The symmetry detection circuit is coupled to a differential output of the transducer element and is configured to output an error signal based on asymmetry in the differential output.

公开(公告)号：US20170297899A1

公开(公告)日：2017-10-19

申请号：US15629834

申请日：2017-06-22

Applicant: Infineon Technologies AG

Inventor： Alfons Dehe ,  Stefan Barzen ,  Ulrich Krumbein ,  Wolfgang Friza ,  Wolfgang Klein

IPC: B81B3/00 ,  B81C1/00

CPC classification number: B81B3/0072 ,  B81B2203/0109 ,  B81C1/00325

Abstract: A method for forming a microelectromechanical device may provide forming a first layer at least one of in or over a semiconductor carrier; forming a second layer at least one of in or over at least a central region of the first layer, such that a peripheral region of the first layer is at least partially free of the second layer; removing material under at least a central region of the second layer to release at least one of the central region of the second layer or a central region of the first layer; and/or removing material under at least the peripheral region of the first layer to such that the second layer is supported by the semiconductor carrier via the first layer.

公开(公告)号：US20170247245A1

公开(公告)日：2017-08-31

申请号：US15054310

申请日：2016-02-26

Applicant: Infineon Technologies AG

Inventor： Alfons Dehe ,  Stefan Barzen ,  Ulrich Krumbein ,  Wolfgang Friza ,  Wolfgang Klein

IPC: B81B3/00 ,  B81C1/00

CPC classification number: B81B3/0072 ,  B81B2203/0109 ,  B81C1/00325

Abstract: A microelectromechanical device may include: a semiconductor carrier; a microelectromechanical element disposed in a position distant to the semiconductor carrier; wherein the microelectromechanical element is configured to generate or modify an electrical signal in response to a mechanical signal and/or is configured to generate or modify a mechanical signal in response to an electrical signal; at least one contact pad, which is electrically connected to the microelectromechanical element for transferring the electrical signal between the contact pad and the microelectromechanical element; and a connection structure which extends from the semiconductor carrier to the microelectromechanical element and mechanically couples the microelectromechanical element with the semiconductor carrier.

公开(公告)号：US09745188B1

公开(公告)日：2017-08-29

申请号：US15054310

申请日：2016-02-26

Applicant: Infineon Technologies AG

Inventor： Alfons Dehe ,  Stefan Barzen ,  Ulrich Krumbein ,  Wolfgang Friza ,  Wolfgang Klein

IPC: B81B3/00 ,  B81C1/00

CPC classification number: B81B3/0072 ,  B81B2203/0109 ,  B81C1/00325

Abstract: A microelectromechanical device may include: a semiconductor carrier; a microelectromechanical element disposed in a position distant to the semiconductor carrier; wherein the microelectromechanical element is configured to generate or modify an electrical signal in response to a mechanical signal and/or is configured to generate or modify a mechanical signal in response to an electrical signal; at least one contact pad, which is electrically connected to the microelectromechanical element for transferring the electrical signal between the contact pad and the microelectromechanical element; and a connection structure which extends from the semiconductor carrier to the microelectromechanical element and mechanically couples the microelectromechanical element with the semiconductor carrier.