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    METHODS FOR PRINTING SOLDER PASTE AND OTHER VISCOUS MATERIALS AT HIGH RESOLUTION
    41.
    发明申请
    METHODS FOR PRINTING SOLDER PASTE AND OTHER VISCOUS MATERIALS AT HIGH RESOLUTION 有权

    公开(公告)号：US20220379396A1

    公开(公告)日：2022-12-01

    申请号：US17818308

    申请日：2022-08-08

    Applicant: IO Tech Group Ltd.

    Inventor： Michael Zenou ,  Ziv Gilan ,  Guy Nesher

    IPC: B23K1/00 ,  H05K3/34 ,  B41M3/00 ,  B41F16/00 ,  B05D3/06 ,  B05D1/26 ,  B05D1/28 ,  B05C5/02 ,  B05C1/08 ,  B05C9/14

    Abstract: Systems and methods in which dot-like portions of a material (e.g., a viscous material such as a solder paste) are printed or otherwise transferred onto an intermediate substrate at a first printing unit, the intermediate substrate having the dot-like portions of material printed thereon is transferred to a second printing unit, and the dot-like portions of material are transferred from the intermediate substrate to a final substrate at the second printing unit. Optionally, the first printing unit includes a coating system that creates a uniform layer of the material on a donor substrate, and the material is transferred in the individual dot-like portions from the donor substrate onto the intermediate substrate at the first printing unit. Each of the first and second printing units may employ a variety of printing or other transfer technologies. The system may also include material curing and imaging units to aid in the overall process.

    Laser-based droplet array jetting of high viscous materials
    44.
    发明授权
    Laser-based droplet array jetting of high viscous materials 有权

    公开(公告)号：US11097465B2

    公开(公告)日：2021-08-24

    申请号：US16383891

    申请日：2019-04-15

    Applicant: IO Tech Group Ltd.

    Inventor： Michael Zenou ,  Ziv Gilan

    IPC: B41J2/14 ,  B29C64/268 ,  B29C64/205 ,  B29C64/112 ,  B41M5/00 ,  B33Y10/00 ,  B05D1/02 ,  B05D3/06

    Abstract: Laser jetting of droplets of a viscous material, such as an ink, is performed by coating a layer of ink on a mesh-like transport screen, with the ink being retained within spaces of the mesh-like transport screen. The ink-coated mesh-like transport screen is conveyed to a working area and a laser beam is used to heat the ink within the spaces of the mesh-like transport screen, thereby causing ink droplets to be jetted from the spaces of the mesh-like transport screen. Structures are formed on a receiving substrate arranged near the working area by jetting the ink droplets, either in an aggregation or sequentially, across a gap from the mesh-like transport screen to the receiving substrate and displacing the mesh-like transport screen and the laser beam relative to one another at times between the jetting of the droplets, or by directly printing ink droplets onto the receiving substrate.

    Multi-material dispensing and coating systems
    46.
    发明授权
    Multi-material dispensing and coating systems 有权

    公开(公告)号：US10603684B2

    公开(公告)日：2020-03-31

    申请号：US16292599

    申请日：2019-03-05

    Applicant: IO Tech Group Ltd.

    Inventor： Michael Zenou ,  Ziv Gilan

    IPC: B05D1/26 ,  B05D1/40 ,  B05C11/02 ,  B05C11/10 ,  B05D7/00 ,  B05C5/02

    Abstract: Systems and methods for dispensing liquid materials as may be used in applications for coating flexible films and the like. Such a film may be coated by dispensing a rheological material onto its surface while drawing the film through a gap between a pair of rollers. The gap defines the thickness of a layer of the material applied to the film and is maintained at a desired width by microwires positioned through the gap. Another film across the gap from that to which the rheological material is applied aids in the coating of the layer and a contact area of the second film may be adjusted relative to the gap, e.g., when changing materials or when the coating film becomes abraded or deformed.

    LEVELING SYSTEM FOR 3D PRINTER
    47.
    发明申请
    LEVELING SYSTEM FOR 3D PRINTER 审中-公开

    公开(公告)号：US20200023582A1

    公开(公告)日：2020-01-23

    申请号：US16509121

    申请日：2019-07-11

    Applicant: IO Tech Group, Ltd.

    Inventor： Ziv Gilan ,  Daniel Liptz ,  Michael Zenou

    IPC: B29C64/245 ,  B29C64/268 ,  B29C64/379

    Abstract: A leveling system for a 3D printing system for laser dispensing includes inner and outer frames, each supported at its corners by respective actuators of first and second sets of actuators. The outer frame supports an optical plane within which material to be dispensed by laser irradiation is disposed. The inner frame supports a receiving medium plane within which a substrate on which said material to be dispensed by laser irradiation is disposed. Each actuator operates independently to displace a respective frame corner in the vertical direction. The inner and outer frames each is attached at their respective corners to a respective actuator by a rod, thus allowing the inner and outer frames to freely rotate with respect to one another. An additional frame may support sensors for monitoring the 3D printing system.

    Method to electrically connect chip with top connectors using 3D printing
    49.
    发明授权
    Method to electrically connect chip with top connectors using 3D printing 有权

    公开(公告)号：US12046575B2

    公开(公告)日：2024-07-23

    申请号：US15929281

    申请日：2020-04-22

    Applicant: IO Tech Group Ltd.

    Inventor： Michael Zenou ,  Ziv Gilan ,  Guy Nesher

    IPC: H05K3/00 ,  H01L23/00 ,  H05K3/12 ,  H05K3/32

    CPC classification number: H01L24/82 ,  H05K3/1283 ,  H05K3/32 ,  H01L2224/82051 ,  H01L2224/82103 ,  H01L2224/8284

    Abstract: A method for fabricating a three-dimensional (3D) electronic device. A liquid support material (e.g., an epoxy acrylate with a photoinitiator) is applied by a laser-induced forward transfer (LIFT) process to a printed circuit board (PCB) having one or more connectors and one or more electronic components thereon, and then cured to solid form by cooling and/or exposure to ultraviolet (UV) radiation. A layer of conductive material (e.g., a metal) is printed on the solidified support material by LIFT to electrically connect the one or more electronic components to respective ones of the connectors on the PCB. Subsequently, the layer of conductive material is dried by heating and metal particles in the conductive layer sintered using a laser beam. The assembly may then be encapsulated in an encapsulant.

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