公开(公告)号：US20170148650A1

公开(公告)日：2017-05-25

申请号：US15428156

申请日：2017-02-09

Applicant: Industrial Technology Research Institute ,  PlayNitride Inc.

Inventor： Ming-Hsien Wu ,  Yen-Hsiang Fang ,  Chia-Hsin Chao

IPC: H01L21/67 ,  H01L21/683 ,  H01L33/62 ,  H01L33/00 ,  H01L21/66

CPC classification number: H01L21/67144 ,  G01R31/2635 ,  H01L21/6835 ,  H01L22/20 ,  H01L22/22 ,  H01L24/75 ,  H01L24/81 ,  H01L33/0095 ,  H01L33/06 ,  H01L33/12 ,  H01L33/62 ,  H01L2221/6835 ,  H01L2221/68368 ,  H01L2224/75 ,  H01L2933/0066

Abstract: An electric-programmable magnetic module comprising a micro electro mechanical system (MEMS) chip and a bonding equipment is provided. The MEMS chip comprises a plurality of electromagnetic coils and each of the electromagnetic coils is individually controlled. The MEMS chip is assembled with and carried by the bonding equipment.

公开(公告)号：US20160104695A1

公开(公告)日：2016-04-14

申请号：US14970548

申请日：2015-12-16

Applicant: Industrial Technology Research Institute

Inventor： Wen-Yung Yeh ,  Chia-Hsin Chao ,  Ming-Hsien Wu ,  Kuang-Yu Tai

IPC: H01L25/075 ,  H01L33/54 ,  H01L33/32 ,  H01L33/58 ,  H01L33/06 ,  H01L33/62 ,  H01L33/38

CPC classification number: H01L25/0753 ,  H01L27/156 ,  H01L33/06 ,  H01L33/32 ,  H01L33/38 ,  H01L33/44 ,  H01L33/54 ,  H01L33/58 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A light emitting device array including a circuit substrate and a plurality of device layers is provided. The circuit substrate includes a plurality of bonding pads and a plurality of conductive bumps located over the bonding pads. The device layers are capable of emitting different colored lights electrically connected with the circuit substrate through the conductive bumps and the bonding pads. The device layers capable of emitting different colored lights have different thicknesses and the conductive bumps bonded with the device layers capable of emitting different colored lights have different heights such that top surfaces of the device layers capable of emitting different colored lights are located on a same level of height.

Abstract translation: 提供了包括电路基板和多个器件层的发光器件阵列。 电路基板包括多个接合焊盘和位于焊盘上方的多个导电凸块。 器件层能够通过导电凸块和焊盘发射与电路基板电连接的不同颜色的光。 能够发射不同颜色的光的器件层具有不同的厚度，并且与能够发射不同颜色的光的器件层结合的导电凸起具有不同的高度，使得能够发射不同颜色的光的器件层的顶表面位于同一水平 的高度。

公开(公告)号：US09171779B2

公开(公告)日：2015-10-27

申请号：US14472400

申请日：2014-08-29

Applicant: Industrial Technology Research Institute

Inventor： Jui-Ying Lin ,  Yen-Hsiang Fang ,  Chia-Hsin Chao ,  Yao-Jun Tsai ,  Yi-Chen Lin

IPC: H01S5/024 ,  H01L23/48 ,  H01L21/306 ,  H01L27/02 ,  H01L33/20 ,  H01L33/62 ,  H01L21/768 ,  H01L23/00 ,  H01S5/02 ,  H01S5/026 ,  H01S5/34 ,  G02B6/12 ,  G02B6/34 ,  H01L29/861

CPC classification number: H01L23/481 ,  G02B6/12 ,  G02B6/34 ,  G02B2006/12061 ,  H01L21/30604 ,  H01L21/486 ,  H01L21/76898 ,  H01L23/13 ,  H01L23/147 ,  H01L23/49827 ,  H01L23/60 ,  H01L24/05 ,  H01L24/06 ,  H01L24/08 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/80 ,  H01L25/167 ,  H01L27/0255 ,  H01L29/861 ,  H01L33/20 ,  H01L33/62 ,  H01L2224/04 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/04042 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/06102 ,  H01L2224/08148 ,  H01L2224/08238 ,  H01L2224/16148 ,  H01L2224/16238 ,  H01L2224/29294 ,  H01L2224/32148 ,  H01L2224/32238 ,  H01L2224/48091 ,  H01L2224/48105 ,  H01L2224/48148 ,  H01L2224/48229 ,  H01L2224/73265 ,  H01L2224/80801 ,  H01L2224/80805 ,  H01L2224/81439 ,  H01L2224/81444 ,  H01L2224/81447 ,  H01L2224/83439 ,  H01L2224/83444 ,  H01L2224/83447 ,  H01L2224/83805 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85447 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/12035 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1434 ,  H01L2933/0066 ,  H01S5/0208 ,  H01S5/02469 ,  H01S5/026 ,  H01S5/34 ,  H01L2924/00 ,  H01L2224/80 ,  H01L2924/00012 ,  H01L2224/45099

Abstract: A semiconductor laser structure is provided. The semiconductor laser comprises a central thermal shunt, a ring shaped silicon waveguide, a contiguous thermal shunt, an adhesive layer and a laser element. The central thermal shunt is located on a SOI substrate which has a buried oxide layer surrounding the central thermal shunt. The ring shaped silicon waveguide is located on the buried oxide layer and surrounds the central thermal shunt. The ring shaped silicon waveguide includes a P-N junction of a p-type material portion, an n-type material portion and a depletion region there between. The contiguous thermal shunt covers a portion of the buried oxide layer and surrounds the ring shaped silicon waveguide. The adhesive layer covers the ring shaped silicon waveguide and the buried oxide layer. The laser element covers the central thermal shunt, the adhesive layer and the contiguous thermal shunt.

Abstract translation: 提供半导体激光器结构。 半导体激光器包括中心热分流器，环形硅波导，连续热分流器，粘合剂层和激光元件。 中心热分流器位于具有围绕中心热分流的掩埋氧化物层的SOI衬底上。 环形硅波导位于掩埋氧化层上并围绕中心热分流。 环形硅波导包括p型材料部分的P-N结，n型材料部分和其间的耗尽区域。 连续的热分流器覆盖一部分掩埋的氧化物层并且环绕着环形硅波导。 粘合剂层覆盖环形硅波导和掩埋氧化物层。 激光元件覆盖中心热分流器，粘合剂层和相邻热分流器。

公开(公告)号：US20150063745A1

公开(公告)日：2015-03-05

申请号：US14472390

申请日：2014-08-29

Applicant: Industrial Technology Research Institute

Inventor： Jui-Ying Lin ,  Chia-Hsin Chao ,  Shu-Mei Yang ,  Chun-Hsing Lee ,  Chien-Chun Lu

IPC: G02B6/12 ,  G02B6/34

CPC classification number: H01L23/481 ,  G02B6/12 ,  G02B6/34 ,  G02B2006/12061 ,  H01L21/30604 ,  H01L21/486 ,  H01L21/76898 ,  H01L23/13 ,  H01L23/147 ,  H01L23/49827 ,  H01L23/60 ,  H01L24/05 ,  H01L24/06 ,  H01L24/08 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/80 ,  H01L25/167 ,  H01L27/0255 ,  H01L29/861 ,  H01L33/20 ,  H01L33/62 ,  H01L2224/04 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/04042 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/06102 ,  H01L2224/08148 ,  H01L2224/08238 ,  H01L2224/16148 ,  H01L2224/16238 ,  H01L2224/29294 ,  H01L2224/32148 ,  H01L2224/32238 ,  H01L2224/48091 ,  H01L2224/48105 ,  H01L2224/48148 ,  H01L2224/48229 ,  H01L2224/73265 ,  H01L2224/80801 ,  H01L2224/80805 ,  H01L2224/81439 ,  H01L2224/81444 ,  H01L2224/81447 ,  H01L2224/83439 ,  H01L2224/83444 ,  H01L2224/83447 ,  H01L2224/83805 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85447 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/12035 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1434 ,  H01L2933/0066 ,  H01S5/0208 ,  H01S5/02469 ,  H01S5/026 ,  H01S5/34 ,  H01L2924/00 ,  H01L2224/80 ,  H01L2924/00012 ,  H01L2224/45099

Abstract: An optical coupling module includes a silicon photonic substrate, and an optical waveguide module. The silicon photonic substrate has a first surface and a first grating on the first surface for diffracting the light which passes through the grating. The optical waveguide module is disposed on the silicon photonic substrate, wherein the optical waveguide module includes an optical waveguide having an end disposed in corresponding to the first grating of the silicon photonic substrate. Otherwise, the optical waveguide module has a reflective surface coupled to the end of the optical waveguide and adapted to reflect the light emerging from or incident into the grating to form an optical path between the silicon photonic substrate and the optical waveguide for transmitting the light.

Abstract translation: 光耦合模块包括硅光子衬底和光波导模块。 硅光子衬底具有在第一表面上的第一表面和第一光栅，用于衍射通过光栅的光。 光波导模块设置在硅光子基板上，其中光波导模块包括光波导，该光波导具有与硅光子基板的第一光栅对应的端部。 否则，光波导模块具有耦合到光波导的端部并且适于反射从光栅出射或入射到光栅中的光的反射表面，以在硅光子基板和用于传输光的光波导之间形成光路。

公开(公告)号：US20150063386A1

公开(公告)日：2015-03-05

申请号：US14472400

申请日：2014-08-29

Applicant: Industrial Technology Research Institute

Inventor： Jui-Ying Lin ,  Yen-Hsiang Fang ,  Chia-Hsin Chao ,  Yao-Jun Tsai ,  Yi-Chen Lin

IPC: H01S5/024 ,  H01S5/02 ,  H01S5/34 ,  H01S5/026

CPC classification number: H01L23/481 ,  G02B6/12 ,  G02B6/34 ,  G02B2006/12061 ,  H01L21/30604 ,  H01L21/486 ,  H01L21/76898 ,  H01L23/13 ,  H01L23/147 ,  H01L23/49827 ,  H01L23/60 ,  H01L24/05 ,  H01L24/06 ,  H01L24/08 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/80 ,  H01L25/167 ,  H01L27/0255 ,  H01L29/861 ,  H01L33/20 ,  H01L33/62 ,  H01L2224/04 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/04042 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/06102 ,  H01L2224/08148 ,  H01L2224/08238 ,  H01L2224/16148 ,  H01L2224/16238 ,  H01L2224/29294 ,  H01L2224/32148 ,  H01L2224/32238 ,  H01L2224/48091 ,  H01L2224/48105 ,  H01L2224/48148 ,  H01L2224/48229 ,  H01L2224/73265 ,  H01L2224/80801 ,  H01L2224/80805 ,  H01L2224/81439 ,  H01L2224/81444 ,  H01L2224/81447 ,  H01L2224/83439 ,  H01L2224/83444 ,  H01L2224/83447 ,  H01L2224/83805 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85447 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/12035 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1434 ,  H01L2933/0066 ,  H01S5/0208 ,  H01S5/02469 ,  H01S5/026 ,  H01S5/34 ,  H01L2924/00 ,  H01L2224/80 ,  H01L2924/00012 ,  H01L2224/45099

Abstract: A semiconductor laser structure is provided. The semiconductor laser comprises a central thermal shunt, a ring shaped silicon waveguide, a contiguous thermal shunt, an adhesive layer and a laser element. The central thermal shunt is located on a SOI substrate which has a buried oxide layer surrounding the central thermal shunt. The ring shaped silicon waveguide is located on the buried oxide layer and surrounds the central thermal shunt. The ring shaped silicon waveguide includes a P-N junction of a p-type material portion, an n-type material portion and a depletion region there between. The contiguous thermal shunt covers a portion of the buried oxide layer and surrounds the ring shaped silicon waveguide. The adhesive layer covers the ring shaped silicon waveguide and the buried oxide layer. The laser element covers the central thermal shunt, the adhesive layer and the contiguous thermal shunt.

Abstract translation: 提供半导体激光器结构。 半导体激光器包括中心热分流器，环形硅波导，连续热分流器，粘合剂层和激光元件。 中心热分流器位于具有围绕中心热分流的掩埋氧化物层的SOI衬底上。 环形硅波导位于掩埋氧化层上并围绕中心热分流。 环形硅波导包括p型材料部分的P-N结，n型材料部分和其间的耗尽区域。 连续的热分流器覆盖一部分掩埋的氧化物层并且环绕着环形硅波导。 粘合剂层覆盖环形硅波导和掩埋氧化物层。 激光元件覆盖中心热分流器，粘合剂层和相邻热分流器。

公开(公告)号：US20240258280A1

公开(公告)日：2024-08-01

申请号：US18396725

申请日：2023-12-27

Applicant: Industrial Technology Research Institute

Inventor： Ren-Lu Chen ,  Chy-Lin Wang ,  Li-Chun Huang ,  Chia-Hsin Chao ,  Ming-Hsien Wu

IPC: H01L25/075 ,  H01L33/58

CPC classification number: H01L25/0753 ,  H01L33/58

Abstract: An image compensation device including a substrate and island display units is provided. The substrate includes a central area and configuration rings surrounding the central area and spaced apart from the central area at different intervals. The island display units are disposed on the substrate. One of the island display units is disposed at the central area, and the other island display units are respectively disposed at the configuration rings. Each island display unit includes a real display area and a dummy display area located around the real display area, and includes real pixels and dummy pixels. The real pixels are disposed in the real display area. The dummy pixels are disposed in the dummy display area, and a number of the dummy pixels is greater than a number of the real pixels to compensate for a display image spliced by discrete images.

公开(公告)号：US20240027755A1

公开(公告)日：2024-01-25

申请号：US18482010

申请日：2023-10-05

Applicant: Industrial Technology Research Institute

Inventor： Chia-Hsin Chao ,  Han-Kuei Fu ,  Meng-Han Lin ,  Ming-Hsien Wu

IPC: G02B27/00 ,  G02B27/01

CPC classification number: G02B27/0093 ,  G02B27/0172 ,  G02B2027/013 ,  G02B2027/0178

Abstract: A head-mounted eye tracking system including an eye tracker, a signal processor, and a plurality of light-emitting optical guides is provided. The eye tracker is adaptable for sensing eyeballs of a wearer. The eye tracker includes a plurality of light-emitting devices and a plurality of sensing devices. The plurality of light-emitting devices are adaptable for emitting a tracking beam. The sensing devices are adaptable for receiving the tracking beam reflected by the eyeballs of the wearer. The signal processor is signally connected to the eye tracker. The plurality of light-emitting optical guides is disposed corresponding to the plurality of light-emitting devices.

公开(公告)号：US20230185086A1

公开(公告)日：2023-06-15

申请号：US18089532

申请日：2022-12-27

Applicant: Industrial Technology Research Institute

Inventor： Cheng-Jhih Luo ,  Chia-Hsin Chao ,  Wei-Cheng Chao

IPC: G02B27/00 ,  G02B27/01 ,  G02B27/18 ,  G02B3/08 ,  G02B1/00

CPC classification number: G02B27/0093 ,  G02B27/0172 ,  G02B27/18 ,  G02B3/08 ,  G02B1/002 ,  G02B2027/0134 ,  G02B2027/0178

Abstract: A head-mounted augmented reality stereo vision optical film, including a light transmitting display layer, an optical projection layer, and an eye tracking layer, is provided. The light transmitting display layer has multiple pixel units. The optical projection layer has multiple light guide units. The light guide unit includes a pinhole configured corresponding to at least one of the pixel units. The eye tracking layer has multiple micro sensing elements.

公开(公告)号：US20230177870A1

公开(公告)日：2023-06-08

申请号：US17557061

申请日：2021-12-21

Applicant: Industrial Technology Research Institute

Inventor： Wei-Cheng Chao ,  Chia-Hsin Chao ,  Li-Chi Su ,  Chi-Chin Yang ,  Cheng-Jhih Luo

IPC: G06V40/145 ,  G06N3/04 ,  G06V40/20 ,  G06V10/74 ,  G06V10/82

CPC classification number: G06V40/145 ,  G06N3/04 ,  G06V40/20 ,  G06V10/761 ,  G06V10/82

Abstract: Provided is a recognition method of 3D vein pattern including the following steps. A plurality of first light beams are emitted by a recognition device to a wrist of a user. A plurality of first reflected light beams from the wrist are received by the recognition device to form a first 3D vein pattern of the wrist. Differences between the first 3D vein pattern and a wrist vein pattern of a database are compared to identify an identity or a gesture of the user. A recognition device of 3D vein pattern is also provided.

公开(公告)号：US20220206294A1

公开(公告)日：2022-06-30

申请号：US17229846

申请日：2021-04-13

Applicant: Industrial Technology Research Institute

Inventor： Cheng-Jhih Luo ,  Chia-Hsin Chao ,  Chun-Wen Chu ,  Ching-Ya Yeh

IPC: G02B27/00 ,  G02B27/01

Abstract: A head-mounted eye tracking system including an optical combiner, an eye tracker and a signal processor is provided. The optical combiner includes an optical coupler. The eye tracker is at least partially disposed on the optical combiner and is suitable for sensing an eyeball movement of a wearer. The eye tracker includes a plurality of light-emitting devices and a plurality of sensing devices. The plurality of light-emitting devices are suitable for emitting tracking beams. The plurality of sensing devices are suitable for receiving the tracking beams reflected by the eyeball of the wearer. The signal processor is signally connected to the eye tracker.