DISPLAY PANEL
    3.
    发明申请
    DISPLAY PANEL 有权
    显示面板

    公开(公告)号:US20130341659A1

    公开(公告)日:2013-12-26

    申请号:US13923376

    申请日:2013-06-21

    Abstract: A display panel including a substrate, a meshed shielding pattern, and a plurality of light-emitting devices is provided. The meshed shielding pattern is disposed on the substrate so as to define a plurality of pixel regions on the substrate. The light-emitting devices are disposed on the substrate. At least one light-emitting device of the light-emitting devices is disposed in each pixel region of the pixel regions, wherein an area of the pixel region is A1, an area of the light-emitting device is A2, and a ratio of A2 to A1 is below 50%.

    Abstract translation: 提供了包括基板,网状屏蔽图案和多个发光装置的显示面板。 网状屏蔽图案设置在基板上,以便在基板上限定多个像素区域。 发光装置设置在基板上。 发光装置的至少一个发光装置配置在像素区域的各像素区域中,像素区域的面积为A1,发光装置的面积为A2,A2的比例 到A1低于50%。

    TRANSFER-BONDING METHOD FOR THE LIGHT EMITTING DEVICE AND LIGHT EMITTING DEVICE ARRAY
    4.
    发明申请
    TRANSFER-BONDING METHOD FOR THE LIGHT EMITTING DEVICE AND LIGHT EMITTING DEVICE ARRAY 审中-公开
    用于发光装置和发光装置阵列的转移接合方法

    公开(公告)号:US20160104695A1

    公开(公告)日:2016-04-14

    申请号:US14970548

    申请日:2015-12-16

    Abstract: A light emitting device array including a circuit substrate and a plurality of device layers is provided. The circuit substrate includes a plurality of bonding pads and a plurality of conductive bumps located over the bonding pads. The device layers are capable of emitting different colored lights electrically connected with the circuit substrate through the conductive bumps and the bonding pads. The device layers capable of emitting different colored lights have different thicknesses and the conductive bumps bonded with the device layers capable of emitting different colored lights have different heights such that top surfaces of the device layers capable of emitting different colored lights are located on a same level of height.

    Abstract translation: 提供了包括电路基板和多个器件层的发光器件阵列。 电路基板包括多个接合焊盘和位于焊盘上方的多个导电凸块。 器件层能够通过导电凸块和焊盘发射与电路基板电连接的不同颜色的光。 能够发射不同颜色的光的器件层具有不同的厚度,并且与能够发射不同颜色的光的器件层结合的导电凸起具有不同的高度,使得能够发射不同颜色的光的器件层的顶表面位于同一水平 的高度。

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