公开(公告)号：US20230131442A1

公开(公告)日：2023-04-27

申请号：US17956846

申请日：2022-09-30

Applicant: Innolux Corporation

Inventor： Yi-Hung Lin ,  Hsiu-Yi Tsai ,  Chia-Ping Tseng ,  Chia-Chi Ho

IPC: H01L27/12

Abstract: An electronic device includes a substrate, a driving element, a conductive layer, and an electronic element is provided. The driving element is disposed on the substrate. The conductive layer is disposed on the substrate, wherein there is a first distance (B) between the driving element and an edge of the conductive layer. The electronic element is disposed on the conductive layer and is electrically connected to the driving element, wherein there is a second distance (A) between the electronic element and the edge of the conductive layer, and the first distance (B) is greater than the second distance (A).

公开(公告)号：US20230090376A1

公开(公告)日：2023-03-23

申请号：US17523895

申请日：2021-11-10

Applicant: Innolux Corporation

Inventor： Yeong-E Chen ,  Yi-Hung Lin ,  Cheng-En Cheng ,  Wen-Hsiang Liao ,  Cheng-Chi Wang

IPC: H01L23/498 ,  H01L21/48

Abstract: An electronic component and a manufacturing method thereof are provided. The electronic component includes a structure member and a connecting member. The structure member includes at least one working unit. The at least one working unit is disposed in a first region. The connecting member is disposed on the structure member and includes a second region. The second region is overlapped with the first region, and a metal density of the second region is less than a metal density of the first region. The electronic component and the manufacturing method thereof of the embodiment of the disclosure include the effect of improving the reliability or quality of the electronic component.

公开(公告)号：US20220216302A1

公开(公告)日：2022-07-07

申请号：US17561716

申请日：2021-12-24

Applicant: Innolux Corporation

Inventor： Chen-Lin Yeh ,  Chin-Lung Ting ,  Chung-Kuang Wei ,  Jen-Hai Chi ,  Yi-Hung Lin ,  Yan-Zheng Wu

IPC: H01L29/08 ,  H05K1/11 ,  H05K3/34

Abstract: Disclosed is an electronic device, including a substrate, a first electrode, a second electrode, a modulation element, a first solder, and a switch element. The first electrode is disposed on the substrate. The second electrode is disposed on the substrate. The modulation element is disposed on the substrate and includes at least two connecting pads. The first solder is disposed between the first electrode and one connecting pad of the modulation element. The switch element is disposed on the substrate. The one connecting pad of the modulation element is electrically connected to the switch element sequentially through the first solder, the first electrode, and the second electrode.

公开(公告)号：US12224226B2

公开(公告)日：2025-02-11

申请号：US17898410

申请日：2022-08-29

Applicant: InnoLux Corporation

Inventor： Chin-Lung Ting ,  Chung-Kuang Wei ,  Cheng-Chi Wang ,  Yeong-E Chen ,  Yi-Hung Lin

IPC: H05K1/02 ,  H01L23/00 ,  H01L23/44 ,  H01L23/498 ,  H01L25/065 ,  H01L25/075

Abstract: An electronic device is disclosed. The electronic device includes a circuit layer, an electronic element and a thermal conducting element. The electronic element is disposed on the circuit layer and electrically connected to the circuit layer. The thermal conducting element is disposed between the circuit layer and the electronic element. The thermal conducting element is used for performing heat exchange with the electronic element.

公开(公告)号：US20250029910A1

公开(公告)日：2025-01-23

申请号：US18909897

申请日：2024-10-08

Applicant: Innolux Corporation

Inventor： Yeong-E Chen ,  Yi-Hung Lin ,  Cheng-En Cheng ,  Wen-Hsiang Liao ,  Cheng-Chi Wang

IPC: H01L23/498 ,  H01L21/48 ,  H01L23/00

Abstract: An electronic component includes a first electronic unit including a plurality of pads, a first conductive layer, a second conductive layer, a first insulating layer having a first thickness, a second insulating layer having a second thickness, a second electronic unit, and a solder ball. The first conductive layer is disposed between the first electronic unit and the second conductive layer, and electrically connected to at least one of the pads through a conductive via. The first insulating layer is disposed between the first conductive layer and the second conductive layer. The second conductive layer is disposed between the first insulating layer and the second insulating layer. The first thickness is different from the second thickness. The second conductive layer is disposed between the first conductive layer and the second electronic unit. The second conductive layer is electrically connected to the second electronic unit through the solder ball.

公开(公告)号：US20240119909A1

公开(公告)日：2024-04-11

申请号：US18465156

申请日：2023-09-11

Applicant: Innolux Corporation

Inventor： Kung-Chen Kuo ,  Yi-Hung Lin ,  Po-Syun Chen

IPC: G09G3/34

CPC classification number: G09G3/3406 ,  G09G2300/0819 ,  G09G2300/0828 ,  G09G2300/0842

Abstract: A modulating device is provided. The modulating device includes multiple modulating elements, multiple pixel circuits, and a compensation circuit. The pixel circuits are electrically connected to the modulating elements correspondingly. The compensation circuit includes a driving unit, a voltage source, and a current source. The driving unit provides a driving signal to the pixel circuits. The voltage source is electrically connected to the driving unit. The voltage source provides a constant voltage to the pixel circuits. The current source is electrically connected to the driving unit. The current source provides a constant current to the pixel circuits.

公开(公告)号：US11852602B2

公开(公告)日：2023-12-26

申请号：US17748531

申请日：2022-05-19

Applicant: InnoLux Corporation

Inventor： Fuh-Tsang Wu ,  Yi-Hung Lin ,  Huei-Ying Chen

IPC: G01N27/12 ,  G01N27/07 ,  G01N27/06

CPC classification number: G01N27/126 ,  G01N27/06 ,  G01N27/07

Abstract: A liquid detection device and a method for manufacturing the same are provided. The liquid detection device includes: a substrate; a working electrode disposed on the substrate, wherein the working electrode includes a first metal portion and a first sensing portion, and the first sensing portion is disposed on the first metal portion; and a reference electrode disposed on the substrate.

公开(公告)号：US11798853B2

公开(公告)日：2023-10-24

申请号：US17315389

申请日：2021-05-10

Applicant: InnoLux Corporation

Inventor： Yeong-E Chen ,  Kuang-Chiang Huang ,  Yu-Ting Liu ,  Yi-Hung Lin ,  Cheng-En Cheng

IPC: H01L21/66 ,  H01L23/00 ,  H01L21/48

CPC classification number: H01L22/14 ,  H01L21/48 ,  H01L22/32 ,  H01L24/19 ,  H01L24/82 ,  H01L2224/829

Abstract: The present disclosure provides a manufacturing method of a package device, which includes providing a carrier substrate, a first conductive layer, and a release layer, where the carrier substrate has a device region and a peripheral region, and the first conductive layer and the release layer are disposed on the carrier substrate. The method further includes forming a second conductive layer on the release layer in the device region, where at least one of the first and second conductive layers includes a first pad in the peripheral region. The second conductive layer includes a second pad electrically connected to the first pad through the first conductive layer. The method also includes performing an inspection step to provide an input signal to one of the first and second pads, and to receive an output signal from another of the first and second pads.

公开(公告)号：US20230335508A1

公开(公告)日：2023-10-19

申请号：US18186970

申请日：2023-03-21

Applicant: Innolux Corporation

Inventor： Jia-Sin Lin ,  Yi-Hung Lin ,  Yan-Zheng Wu ,  Chen-Lin Yeh

IPC: H01L23/58 ,  H01L29/417 ,  H01L21/3213 ,  H01L23/552

CPC classification number: H01L23/585 ,  H01L29/41733 ,  H01L21/32131 ,  H01L23/552

Abstract: An electronic device and a repair method thereof are provided. The repair method of the electronic device includes: providing a panel, wherein the panel includes a substrate, a first conductive layer disposed on the substrate, a transistor disposed on the substrate, and a dielectric layer disposed between the first conductive layer and the transistor, wherein the transistor comprises a first electrode and a second electrode; and cutting at least one of the first electrode and the second electrode with a laser beam, wherein a cutting point formed by the laser beam does not overlap with the first conductive layer.

公开(公告)号：US11758666B2

公开(公告)日：2023-09-12

申请号：US17486935

申请日：2021-09-28

Applicant: InnoLux Corporation

Inventor： Hsueh-Hsuan Chou ,  Yi-Hung Lin

IPC: H05K3/00 ,  H05K3/06 ,  H01L21/48

CPC classification number: H05K3/007 ,  H01L21/4846 ,  H05K3/064

Abstract: A manufacturing method of a metal structure is disclosed, which includes the following steps: forming a seed layer on a substrate; forming a patterned metal layer on the seed layer, wherein the patterned metal layer includes a metal member; forming a first patterned photoresist layer on the seed layer, wherein a thickness of the first patterned photoresist layer is less than a thickness of the patterned metal layer; and performing a first patterning process to the seed layer through the first patterned photoresist layer to form a patterned seed layer, wherein after the first patterning process, the metal member includes a first part and a second part, the first part is disposed between the patterned seed layer and the second part, and a width of the first part is greater than a width of the second part.