公开(公告)号：US20170365546A1

公开(公告)日：2017-12-21

申请号：US15626687

申请日：2017-06-19

Applicant: Invensas Corporation

Inventor： Cyprian Emeka Uzoh ,  Pezhman Monadgemi ,  Terrence Caskey ,  Fatima Lina Ayatollahi ,  Belgacem Haba ,  Charles G. Woychik ,  Michael Newman

IPC: H01L23/498 ,  H01L23/48 ,  H01L23/367 ,  H01L21/768 ,  H01L23/373 ,  H01L23/36

CPC classification number: H01L23/49827 ,  H01L21/76829 ,  H01L21/76898 ,  H01L23/36 ,  H01L23/367 ,  H01L23/3677 ,  H01L23/3736 ,  H01L23/481 ,  H01L23/49838 ,  H01L23/49866 ,  H01L2924/00 ,  H01L2924/0002

Abstract: An interconnect element includes a semiconductor or insulating material layer that has a first thickness and defines a first surface; a thermally conductive layer; a plurality of conductive elements; and a dielectric coating. The thermally conductive layer includes a second thickness of at least 10 microns and defines a second surface of the interconnect element. The plurality of conductive elements extend from the first surface of the interconnect element to the second surface of the interconnect element. The dielectric coating is between at least a portion of each conductive element and the thermally conductive layer.

公开(公告)号：US20170194373A1

公开(公告)日：2017-07-06

申请号：US15407842

申请日：2017-01-17

Applicant: Invensas Corporation

Inventor： Charles G. Woychik ,  Cyprian Emeka Uzoh ,  Michael Newman ,  Terrence Caskey

IPC: H01L27/146 ,  H01L23/31 ,  H01L21/56 ,  H01L21/48 ,  H01L23/00 ,  H01L23/498 ,  H01L21/683

CPC classification number: H01L27/14634 ,  H01L21/4846 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/486 ,  H01L21/56 ,  H01L21/561 ,  H01L21/563 ,  H01L21/6835 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/5384 ,  H01L24/11 ,  H01L24/16 ,  H01L24/17 ,  H01L24/80 ,  H01L24/81 ,  H01L24/97 ,  H01L27/14618 ,  H01L27/14636 ,  H01L27/1469 ,  H01L2221/68345 ,  H01L2221/68359 ,  H01L2221/68377 ,  H01L2221/68381 ,  H01L2224/13 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/81191 ,  H01L2224/81801 ,  H01L2224/97 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/15311 ,  H01L2924/15788 ,  H01L2924/351 ,  H05K1/0298 ,  H01L2224/81 ,  H01L2924/00

Abstract: A microelectronic assembly including a dielectric region, a plurality of electrically conductive elements, an encapsulant, and a microelectronic element are provided. The encapsulant may have a coefficient of thermal expansion (CTE) no greater than twice a CTE associated with at least one of the dielectric region or the microelectronic element.

公开(公告)号：US20170141094A1

公开(公告)日：2017-05-18

申请号：US15419237

申请日：2017-01-30

Applicant: Invensas Corporation

Inventor： Terrence Caskey ,  Ilyas Mohammed

IPC: H01L25/18 ,  H01L25/065 ,  H01L21/683 ,  H01L25/00 ,  H01L21/56 ,  H01L23/31 ,  H01L23/00

CPC classification number: H01L25/18 ,  H01L21/565 ,  H01L21/568 ,  H01L21/6835 ,  H01L21/76802 ,  H01L21/76877 ,  H01L23/13 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/3185 ,  H01L23/49816 ,  H01L23/5389 ,  H01L24/05 ,  H01L24/06 ,  H01L24/13 ,  H01L24/16 ,  H01L24/19 ,  H01L24/20 ,  H01L24/29 ,  H01L24/32 ,  H01L24/43 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/96 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/117 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/04105 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05548 ,  H01L2224/05554 ,  H01L2224/05571 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/06155 ,  H01L2224/12105 ,  H01L2224/13023 ,  H01L2224/131 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/1329 ,  H01L2224/133 ,  H01L2224/14131 ,  H01L2224/27334 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48108 ,  H01L2224/48145 ,  H01L2224/4824 ,  H01L2224/73207 ,  H01L2224/73215 ,  H01L2224/73217 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2224/82031 ,  H01L2224/82039 ,  H01L2224/82047 ,  H01L2224/83005 ,  H01L2224/83192 ,  H01L2224/852 ,  H01L2224/92144 ,  H01L2224/92147 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06548 ,  H01L2225/06562 ,  H01L2225/06596 ,  H01L2225/1035 ,  H01L2225/1052 ,  H01L2225/1076 ,  H01L2225/1082 ,  H01L2924/00014 ,  H01L2924/0665 ,  H01L2924/12042 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/15311 ,  H01L2924/18162 ,  H01L2924/186 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/014 ,  H01L2224/05552

Abstract: A microelectronic package may include a first microelectronic unit including a semiconductor chip having first chip contacts, an encapsulant contacting an edge of the semiconductor chip, and first unit contacts exposed at a surface of the encapsulant and electrically connected with the first chip contacts. The package may include a second microelectronic unit including a semiconductor chip having second chip contacts at a surface thereof, and an encapsulant contacting an edge of the chip of the second unit and having a surface extending away from the edge. The surfaces of the chip and the encapsulant of the second unit define a face of the second unit. Package terminals at the face may be electrically connected with the first unit contacts through bond wires electrically connected with the first unit contacts, and the second chip contacts through metallized vias and traces formed in contact with the second chip contacts.

公开(公告)号：US09558964B2

公开(公告)日：2017-01-31

申请号：US14524280

申请日：2014-10-27

Applicant: Invensas Corporation

Inventor： Charles G. Woychik ,  Cyprian Emeka Uzoh ,  Michael Newman ,  Terrence Caskey

IPC: H01L21/56 ,  H01L23/48 ,  H01L21/48 ,  H05K1/02 ,  H01L23/31 ,  H01L23/498 ,  H01L23/538 ,  H01L21/683 ,  H01L23/00

CPC classification number: H01L27/14634 ,  H01L21/4846 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/486 ,  H01L21/56 ,  H01L21/561 ,  H01L21/563 ,  H01L21/6835 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/5384 ,  H01L24/11 ,  H01L24/16 ,  H01L24/17 ,  H01L24/80 ,  H01L24/81 ,  H01L24/97 ,  H01L27/14618 ,  H01L27/14636 ,  H01L27/1469 ,  H01L2221/68345 ,  H01L2221/68359 ,  H01L2221/68377 ,  H01L2221/68381 ,  H01L2224/13 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/81191 ,  H01L2224/81801 ,  H01L2224/97 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/15311 ,  H01L2924/15788 ,  H01L2924/351 ,  H05K1/0298 ,  H01L2224/81 ,  H01L2924/00

Abstract: A microelectronic assembly including a dielectric region, a plurality of electrically conductive elements, an encapsulant, and a microelectronic element are provided. The encapsulant may have a coefficient of thermal expansion (CTE) no greater than twice a CTE associated with at least one of the dielectric region or the microelectronic element.

Abstract translation: 提供了包括电介质区域，多个导电元件，密封剂和微电子元件的微电子组件。 密封剂可以具有不大于与电介质区域或微电子元件中的至少一个相关联的CTE的两倍的热膨胀系数（CTE）。

公开(公告)号：US20160329290A1

公开(公告)日：2016-11-10

申请号：US15212603

申请日：2016-07-18

Applicant: Invensas Corporation

Inventor： Belgacem Haba ,  Charles G. Woychik ,  Cyprian Emeka Uzoh ,  Michael Newman ,  Terrence Caskey

IPC: H01L23/00

CPC classification number: H01L24/13 ,  H01L21/563 ,  H01L23/564 ,  H01L24/02 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/14 ,  H01L24/16 ,  H01L24/17 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/02372 ,  H01L2224/0345 ,  H01L2224/03462 ,  H01L2224/03464 ,  H01L2224/0347 ,  H01L2224/03912 ,  H01L2224/03914 ,  H01L2224/0401 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05557 ,  H01L2224/05568 ,  H01L2224/05571 ,  H01L2224/05609 ,  H01L2224/05611 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05657 ,  H01L2224/05664 ,  H01L2224/10145 ,  H01L2224/1146 ,  H01L2224/11462 ,  H01L2224/11464 ,  H01L2224/1147 ,  H01L2224/11903 ,  H01L2224/13024 ,  H01L2224/13025 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13157 ,  H01L2224/13164 ,  H01L2224/1319 ,  H01L2224/14517 ,  H01L2224/1601 ,  H01L2224/16057 ,  H01L2224/16058 ,  H01L2224/16104 ,  H01L2224/16105 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16503 ,  H01L2224/17505 ,  H01L2224/17517 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81001 ,  H01L2224/81007 ,  H01L2224/811 ,  H01L2224/81139 ,  H01L2224/8192 ,  H01L2224/83104 ,  H01L2224/9201 ,  H01L2224/9212 ,  H01L2225/06513 ,  H01L2225/06524 ,  H01L2225/06541 ,  H01L2924/00014 ,  H05K1/181 ,  H05K3/30 ,  Y10T29/4913 ,  H01L2924/00012 ,  H01L2924/01015 ,  H01L2924/01074 ,  H01L2224/05552

Abstract: Microelectronic assemblies and methods for making the same are disclosed herein. In one embodiment, a method of forming a microelectronic assembly comprises assembling first and second components to have first major surfaces of the first and second components facing one another and spaced apart from one another by a predetermined spacing, the first component having first and second oppositely-facing major surfaces, a first thickness extending in a first direction between the first and second major surfaces, and a plurality of first metal connection elements at the first major surface, the second component having a plurality of second metal connection elements at the first major surface of the second component; and plating a plurality of metal connector regions each connecting and extending continuously between a respective first connection element and a corresponding second connection element opposite the respective first connection element in the first direction.

Abstract translation: 本文公开了微电子组件及其制造方法。 在一个实施例中，形成微电子组件的方法包括组装第一和第二部件以使第一和第二部件的第一主表面彼此面对并且彼此隔开预定间隔，第一部件具有第一和第二相对 主表面，在第一和第二主表面之间沿第一方向延伸的第一厚度和在第一主表面处的多个第一金属连接元件，第二部件在第一主要部分具有多个第二金属连接元件 第二部件的表面; 以及电镀多个金属连接器区域，每个金属连接器区域在第一方向上在相应的第一连接元件和与相应的第一连接元件相对的相应的第二连接元件之间连续延伸。

公开(公告)号：US20160079214A1

公开(公告)日：2016-03-17

申请号：US14952064

申请日：2015-11-25

Applicant: Invensas Corporation

Inventor： Terrence Caskey ,  Ilyas Mohammed ,  Cyprian Uzoh ,  Charles G. Woychik ,  Michael Newman ,  Pezhman Monadgemi ,  Reynaldo Co ,  Ellis Chau ,  Belgacem Haba

IPC: H01L25/10 ,  H01L23/31 ,  H01L23/00 ,  H01L23/498

CPC classification number: H01L25/105 ,  H01L21/486 ,  H01L23/3114 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/49838 ,  H01L24/05 ,  H01L24/45 ,  H01L24/48 ,  H01L25/0655 ,  H01L2224/02379 ,  H01L2224/04042 ,  H01L2224/16225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45664 ,  H01L2224/48091 ,  H01L2224/48108 ,  H01L2224/48227 ,  H01L2224/73207 ,  H01L2224/73257 ,  H01L2225/1023 ,  H01L2225/1052 ,  H01L2225/1058 ,  H01L2225/107 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/381 ,  H05K1/0298 ,  H05K3/46 ,  Y10T29/49126 ,  Y10T29/49162 ,  H01L2924/00012 ,  H01L2224/85399 ,  H01L2224/05599

Abstract: A method for making an interposer includes forming a plurality of wire bonds bonded to one or more first surfaces of a first element. A dielectric encapsulation is formed contacting an edge surface of the wire bonds which separates adjacent wire bonds from one another. Further processing comprises removing at least portions of the first element, wherein the interposer has first and second opposite sides separated from one another by at least the encapsulation, and the interposer having first contacts and second contacts at the first and second opposite sides, respectively, for electrical connection with first and second components, respectively, the first contacts being electrically connected with the second contacts through the wire bonds.

Abstract translation: 制造插入件的方法包括形成结合到第一元件的一个或多个第一表面的多个引线键合。 形成电介质封装，其接触将引线接合部彼此分隔开的引线接合的边缘表面。 进一步的处理包括去除第一元件的至少一部分，其中插入件具有通过至少封装相互隔开的第一和第二相对侧，并且插入件分别在第一和第二相对侧具有第一接触和第二接触， 分别与第一和第二部件电连接，第一触点通过引线键与第二触点电连接。

公开(公告)号：US20150334831A1

公开(公告)日：2015-11-19

申请号：US14809570

申请日：2015-07-27

Applicant: Invensas Corporation

Inventor： Belgacem Haba ,  Ilyas Mohammed ,  Terrence Caskey ,  Reynaldo Co ,  Ellis Chau

IPC: H05K1/11 ,  H05K1/02

CPC classification number: H05K1/11 ,  H01L21/56 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/3157 ,  H01L23/49811 ,  H01L23/528 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/17 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L25/03 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/10126 ,  H01L2224/11334 ,  H01L2224/1134 ,  H01L2224/1191 ,  H01L2224/13017 ,  H01L2224/13022 ,  H01L2224/13076 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13101 ,  H01L2224/1403 ,  H01L2224/14051 ,  H01L2224/14135 ,  H01L2224/16105 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/1703 ,  H01L2224/17051 ,  H01L2224/32225 ,  H01L2224/45012 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45101 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45155 ,  H01L2224/45624 ,  H01L2224/45655 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/15322 ,  H01L2924/181 ,  H01L2924/19107 ,  H05K1/0298 ,  H05K1/181 ,  H05K1/185 ,  H05K2201/10515 ,  H05K2201/10977 ,  Y02P70/611 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/014

Abstract: A structure may include bond elements having bases joined to conductive elements at a first portion of a first surface and end surfaces remote from the substrate. A dielectric encapsulation element may overlie and extend from the first portion and fill spaces between the bond elements to separate the bond elements from one another. The encapsulation element has a third surface facing away from the first surface. Unencapsulated portions of the bond elements are defined by at least portions of the end surfaces uncovered by the encapsulation element at the third surface. The encapsulation element at least partially defines a second portion of the first surface that is other than the first portion and has an area sized to accommodate an entire area of a microelectronic element. Some conductive elements are at the second portion and configured for connection with such microelectronic element.

公开(公告)号：US09165911B2

公开(公告)日：2015-10-20

申请号：US14243994

申请日：2014-04-03

Applicant: Invensas Corporation

Inventor： Terrence Caskey ,  Ilyas Mohammed

IPC: H01L21/56 ,  H01L25/11 ,  H01L25/065 ,  H01L25/10 ,  H01L23/13 ,  H01L23/538 ,  H01L23/31 ,  H01L23/00 ,  H01L23/498

CPC classification number: H01L25/18 ,  H01L21/565 ,  H01L21/568 ,  H01L21/6835 ,  H01L21/76802 ,  H01L21/76877 ,  H01L23/13 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/3185 ,  H01L23/49816 ,  H01L23/5389 ,  H01L24/05 ,  H01L24/06 ,  H01L24/13 ,  H01L24/16 ,  H01L24/19 ,  H01L24/20 ,  H01L24/29 ,  H01L24/32 ,  H01L24/43 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/96 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/117 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/04105 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05548 ,  H01L2224/05554 ,  H01L2224/05571 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/06155 ,  H01L2224/12105 ,  H01L2224/13023 ,  H01L2224/131 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/1329 ,  H01L2224/133 ,  H01L2224/14131 ,  H01L2224/27334 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48108 ,  H01L2224/48145 ,  H01L2224/4824 ,  H01L2224/73207 ,  H01L2224/73215 ,  H01L2224/73217 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2224/82031 ,  H01L2224/82039 ,  H01L2224/82047 ,  H01L2224/83005 ,  H01L2224/83192 ,  H01L2224/852 ,  H01L2224/92144 ,  H01L2224/92147 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06548 ,  H01L2225/06562 ,  H01L2225/06596 ,  H01L2225/1035 ,  H01L2225/1052 ,  H01L2225/1076 ,  H01L2225/1082 ,  H01L2924/00014 ,  H01L2924/0665 ,  H01L2924/12042 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/15311 ,  H01L2924/18162 ,  H01L2924/186 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/014 ,  H01L2224/05552

Abstract: A microelectronic package may include a first microelectronic unit including a semiconductor chip having first chip contacts, an encapsulant contacting an edge of the semiconductor chip, and first unit contacts exposed at a surface of the encapsulant and electrically connected with the first chip contacts. The package may include a second microelectronic unit including a semiconductor chip having second chip contacts at a surface thereof, and an encapsulant contacting an edge of the chip of the second unit and having a surface extending away from the edge. The surfaces of the chip and the encapsulant of the second unit define a face of the second unit. Package terminals at the face may be electrically connected with the first unit contacts through bond wires electrically connected with the first unit contacts, and the second chip contacts through metalized vias and traces formed in contact with the second chip contacts.

Abstract translation: 微电子封装可以包括第一微电子单元，其包括具有第一芯片触点的半导体芯片，与半导体芯片的边缘接触的密封剂以及暴露在密封剂的表面处并与第一芯片触点电连接的第一单元触点。 封装可以包括第二微电子单元，其包括在其表面具有第二芯片触点的半导体芯片，以及与第二单元的芯片的边缘接触并且具有远离边缘延伸的表面的密封剂。 芯片的表面和第二单元的密封剂的表面限定了第二单元的面。 表面处的封装端子可以通过与第一单元触点电连接的接合线与第一单元触点电连接，并且第二芯片通过金属化通孔和与第二芯片触点接触形成的迹线接触。

公开(公告)号：US20150014688A1

公开(公告)日：2015-01-15

申请号：US14500858

申请日：2014-09-29

Applicant: Invensas Corporation

Inventor： Charles G. Woychik ,  Se Young Yang ,  Pezhman Monadgemi ,  Terrence Caskey

IPC: H01L21/66 ,  H01L23/00

CPC classification number: H01L22/32 ,  G01R31/2886 ,  H01L21/6835 ,  H01L22/14 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/81 ,  H01L25/04 ,  H01L25/0652 ,  H01L25/50 ,  H01L2221/68327 ,  H01L2221/68331 ,  H01L2221/6834 ,  H01L2221/68381 ,  H01L2224/11015 ,  H01L2224/11849 ,  H01L2224/13014 ,  H01L2224/13082 ,  H01L2224/14131 ,  H01L2224/14135 ,  H01L2224/16111 ,  H01L2224/16112 ,  H01L2224/16146 ,  H01L2224/16147 ,  H01L2224/16237 ,  H01L2224/16257 ,  H01L2224/16267 ,  H01L2224/16503 ,  H01L2224/17051 ,  H01L2224/8109 ,  H01L2224/81138 ,  H01L2224/8114 ,  H01L2224/81191 ,  H01L2224/81385 ,  H01L2224/81815 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06565 ,  H01L2924/00011 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/07811 ,  H01L2924/12 ,  H01L2924/14 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/81805

Abstract: A method of attaching a microelectronic element to a substrate can include aligning the substrate with a microelectronic element, the microelectronic element having a plurality of spaced-apart electrically conductive bumps each including a bond metal, and reflowing the bumps. The bumps can be exposed at a front surface of the microelectronic element. The substrate can have a plurality of spaced-apart recesses extending from a first surface thereof. The recesses can each have at least a portion of one or more inner surfaces that are non-wettable by the bond metal of which the bumps are formed. The reflowing of the bumps can be performed so that at least some of the bond metal of each bump liquefies and flows at least partially into one of the recesses and solidifies therein such that the reflowed bond material in at least some of the recesses mechanically engages the substrate.

Abstract translation: 将微电子元件附接到衬底的方法可以包括将衬底与微电子元件对准，微电子元件具有多个间隔开的导电凸块，每个包括接合金属，并且回流凸块。 凸起可以暴露在微电子元件的前表面处。 衬底可以具有从其第一表面延伸的多个间隔开的凹部。 这些凹部各自可以具有一个或多个内表面的至少一部分，该内表面不被其形成凸起的粘结金属润湿。 可以进行凸块的回流，使得每个凸块的至少一些粘结金属液化并且至少部分地流入其中一个凹部并在其中固化，使得至少一些凹部中的回流焊接材料机械地接合 基质。

公开(公告)号：US20140264794A1

公开(公告)日：2014-09-18

申请号：US13828938

申请日：2013-03-14

Applicant: INVENSAS CORPORATION

Inventor： Charles G. Woychik ,  Cyprian Emeka Uzoh ,  Michael Newman ,  Terrence Caskey

IPC: H05K1/02 ,  H01L21/58 ,  H01L23/495

CPC classification number: H01L27/14634 ,  H01L21/4846 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/486 ,  H01L21/56 ,  H01L21/561 ,  H01L21/563 ,  H01L21/6835 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/5384 ,  H01L24/11 ,  H01L24/16 ,  H01L24/17 ,  H01L24/80 ,  H01L24/81 ,  H01L24/97 ,  H01L27/14618 ,  H01L27/14636 ,  H01L27/1469 ,  H01L2221/68345 ,  H01L2221/68359 ,  H01L2221/68377 ,  H01L2221/68381 ,  H01L2224/13 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/81191 ,  H01L2224/81801 ,  H01L2224/97 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/15311 ,  H01L2924/15788 ,  H01L2924/351 ,  H05K1/0298 ,  H01L2224/81 ,  H01L2924/00

Abstract: A microelectronic assembly including a dielectric region, a plurality of electrically conductive elements, an encapsulant, and a microelectronic element are provided. The encapsulant may have a coefficient of thermal expansion (CTE) no greater than twice a CTE associated with at least one of the dielectric region or the microelectronic element.

Abstract translation: 提供了包括电介质区域，多个导电元件，密封剂和微电子元件的微电子组件。 密封剂可以具有不大于与电介质区域或微电子元件中的至少一个相关联的CTE的两倍的热膨胀系数（CTE）。