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    Piezoelectric actuator
    41.
    发明授权
    Piezoelectric actuator 有权

    公开(公告)号：US10529911B2

    公开(公告)日：2020-01-07

    申请号：US15392080

    申请日：2016-12-28

    Applicant: MICROJET TECHNOLOGY CO., LTD.

    Inventor： Shih-Chang Chen ,  Chi-Feng Huang ,  Yung-Lung Han ,  Jia-Yu Liao ,  Shou-Hung Chen ,  Che-Wei Huang ,  Hung-Hsin Liao ,  Chao-Chih Chen ,  Jheng-Wei Chen ,  Ying-Lun Chang ,  Chia-Hao Chang ,  Wei-Ming Lee

    IPC: H01L41/09 ,  F04B43/04 ,  F16K99/00

    Abstract: A piezoelectric actuator includes a suspension plate, a piezoelectric ceramic plate, an outer frame and a bracket. The suspension plate is permitted to undergo a curvy vibration from a middle portion to a periphery portion. The piezoelectric ceramic plate is attached on the suspension plate. When a voltage is applied to the piezoelectric ceramic plate, the suspension plate is driven to undergo the curvy vibration. The outer frame is arranged around the suspension plate. The bracket is connected between the suspension plate and the outer frame for elastically supporting the suspension plate, and includes an intermediate part formed in a vacant space between the suspension plate and the outer frame and in parallel with the outer frame and the suspension plate, a first connecting part arranged between the intermediate part and the suspension plate, and a second connecting part arranged between the intermediate part and the outer frame.

    SLIM-TYPE PORTABLE DEVICE
    42.
    发明申请
    SLIM-TYPE PORTABLE DEVICE 审中-公开

    公开(公告)号：US20190302072A1

    公开(公告)日：2019-10-03

    申请号：US16265582

    申请日：2019-02-01

    Applicant: Microjet Technology Co., Ltd.

    Inventor： Hao-Jan Mou ,  Shih-Chang Chen ,  Chi-Chang Yang ,  Chiu-Lin Lee ,  Jia-Yu Liao ,  Ching-Sung Lin ,  Chih-Kai Chen ,  Chi-Feng Huang ,  Yung-Lung Han

    IPC: G01N33/00 ,  G01N1/22

    Abstract: A gas detecting module includes a carrying plate, a sensor, a compartment body and an actuator. The carrying plate has a substrate and a gas opening. The compartment body is divided into a first compartment and a second compartment by a partition plate. The first compartment has an opening. The second compartment has an outlet and accommodates the actuator. The bottom of the compartment body has an accommodation recess receiving the carrying plate, whereby the gas opening is aligned with the outlet, and the sensor packaged on the substrate is disposed within the first compartment through the opening. The partition plate has a notch. The gas detecting module is assembled in a slim-type portable device having a casing. The casing has an inlet aligned with the first compartment. As the actuator is actuated, ambient gas is inhaled into the first compartment, and the sensor detects the gas flowing therethrough.

    Three-dimensional integrated circuit cooling system
    43.
    发明授权
    Three-dimensional integrated circuit cooling system 有权

    公开(公告)号：US10424560B2

    公开(公告)日：2019-09-24

    申请号：US15860349

    申请日：2018-01-02

    Applicant: Microjet Technology Co., Ltd.

    Inventor： Li-Pang Mo ,  Shih-Chang Chen ,  Chi-Feng Huang ,  Yung-Lung Han

    IPC: H01L25/065 ,  H01L23/46 ,  F28F13/06 ,  H01L23/433 ,  H01L23/44

    Abstract: A three-dimensional integrated circuit cooling system is provided for removing heat from a three-dimensional integrated circuit. Plural fluid microchannels are formed among plural middle chip layers and a main chip layer of the three-dimensional integrated circuit. The three-dimensional integrated circuit cooling system comprises a base and a fluid pump. The base has an introduction opening, a discharge opening and a fluid passage. The fluid pump is fixed on the base and seals the edge of the introduction opening. When the fluid pump is enabled, an ambient fluid is driven by the fluid pump, introduced into the fluid passage through the introduction opening, and discharged through the discharge opening. The discharged fluid passes along every fluid microchannel of the three-dimensional integrated circuit as flowing through the plural middle chip layers and the main chip layer so as to perform heat exchange therewith.

    Manufacturing method of fluid control device
    45.
    发明授权
    Manufacturing method of fluid control device 有权

    公开(公告)号：US10343405B2

    公开(公告)日：2019-07-09

    申请号：US15641054

    申请日：2017-07-03

    Applicant: Microjet Technology Co., Ltd.

    Inventor： Shih-Chang Chen ,  Ying-Lun Chang ,  Hsiang-Dyi Wu ,  Chi-Feng Huang ,  Yung-Lung Han ,  Jia-Yu Liao ,  Jheng-Wei Chen

    IPC: B29C53/04 ,  F04B17/00 ,  F04B43/04 ,  H01L41/23 ,  H01L41/25 ,  B41J2/16 ,  B29C65/48 ,  B29C69/00 ,  B29L31/00

    Abstract: A manufacturing method of a fluid control device is provided. Firstly, a housing, a piezoelectric actuator and a deformable substrate are provided. The piezoelectric actuator includes a piezoelectric element and a vibration plate having a bulge. The deformable substrate includes a flexible plate and a communication plate. The flexible plate includes a movable part. Then, the flexible plate and the communication plate are stacked on and coupled with each other to form the deformable substrate. Then, the housing, the piezoelectric actuator and the deformable substrate are sequentially stacked on each other and coupled with each other. A synchronous deformation process is implemented by applying at least one external force to the deformable substrate, so that the flexible plate and the communication plate of the deformable substrate are subjected to a synchronous deformation, and a specified depth between the movable part and the bulge of the vibration plate is defined.

    Air-cooling heat dissipation device
    46.
    发明授权
    Air-cooling heat dissipation device 有权

    公开(公告)号：US10325832B2

    公开(公告)日：2019-06-18

    申请号：US15894256

    申请日：2018-02-12

    Applicant: Microjet Technology Co., Ltd.

    Inventor： Jia-Yu Liao ,  Shih-Chang Chen ,  Che-Wei Huang ,  Chi-Feng Huang ,  Yung-Lung Han

    IPC: H01L23/467 ,  H01L23/367 ,  H01L23/40 ,  H01L23/36

    Abstract: An air-cooling heat dissipation device is provided for removing heat from an electronic component. The air-cooling heat dissipation device includes a supporting substrate, an air pump and a heat sink. The supporting substrate includes a top surface, a bottom surface, an introduction opening and a thermal conduction plate. The thermal conduction plate is located over the top surface of the supporting substrate and aligned with the introduction opening. The electronic component is disposed on the thermal conduction plate. The air pump is fixed on the bottom surface of the supporting substrate and aligned with the introduction opening. The heat sink is attached on the electronic component. When the air pump is enabled, an ambient air is introduced into the introduction opening to remove the heat from the thermal conduction plate.

    PIEZOELECTRIC ACTUATOR AND PIEZOELECTRIC ACTUATING PLATE THEREOF
    47.
    发明申请
    PIEZOELECTRIC ACTUATOR AND PIEZOELECTRIC ACTUATING PLATE THEREOF 审中-公开

    公开(公告)号：US20180331276A1

    公开(公告)日：2018-11-15

    申请号：US15973976

    申请日：2018-05-08

    Applicant: Microjet Technology Co., Ltd.

    Inventor： Hung-Hsin Liao ,  Shih-Chang Chen ,  Jia-Yu Liao ,  Yung-Lung Han ,  Wei-Ming Lee

    IPC: H01L41/09 ,  H01L41/053 ,  F15B5/00

    CPC classification number: H01L41/098 ,  F15B5/006 ,  H01L41/053 ,  H01L41/332

    Abstract: A piezoelectric actuator for a miniature fluid transportation device is provided and includes a piezoelectric actuating plate and a piezoelectric element. The piezoelectric actuating plate includes a suspension plate, an outer frame, and brackets. The suspension plate has a first thickness. The outer frame is arranged around the suspension plate and has a third thickness. Each of the brackets is connected between the suspension plate and the outer frame and has a fourth thickness. The third thickness is larger than the first thickness, and the first thickness is larger than the fourth thickness. The suspension plate, the outer frame and the brackets are constructed to form different stepped structures to minimize the thickness of the brackets, enhance the elasticity of the brackets. Thus, displacement of the suspension plate in the vertical direction is enhanced and the transportation efficiency of the miniature fluid transportation device is intensified.

    FLUID TRANSPORTATION DEVICE
    48.
    发明申请
    FLUID TRANSPORTATION DEVICE 审中-公开

    公开(公告)号：US20180209411A1

    公开(公告)日：2018-07-26

    申请号：US15875469

    申请日：2018-01-19

    Applicant: Microjet Technology Co., Ltd.

    Inventor： Shih-Chang Chen ,  Jia-Yu Liao ,  Chi-Feng Huang ,  Yung-Lung Han

    IPC: F04B43/04 ,  F04B17/00 ,  F04B19/00 ,  H01L41/09

    Abstract: A fluid transportation device for transportation fluid comprises a valve main body, a valve chamber base, a valve membrane, an actuator and a cover body, and locked and positioned by several locking elements, the electrically conductive locking elements are correspondingly penetrated through the penetration holes of the valve main body, the valve chamber base and the vibration plate of the valve membrane to lock with the corresponding screw holes, and a plurality of thread grooves respectively disposed on the vibration plate, the valve main body and the valve chamber base are corresponding to two thread grooves of the cover body, and an electrode lead of the piezoelectric element is embedded into the two thread grooves of the cover body and embedded into the thread grooves of the vibration plate, valve main body and the valve chamber base, so that the fluid transportation device is assembled.

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