公开(公告)号：US10367983B2

公开(公告)日：2019-07-30

申请号：US16101509

申请日：2018-08-12

Applicant: NINGBO SUNNY OPOTECH CO., LTD.

Inventor： Mingzhu Wang ,  Bojie Zhao ,  Takehiko Tanaka ,  Feifan Chen ,  Qimin Mei ,  Liang Ding ,  Heng Jiang

IPC: H04N5/225 ,  H04N13/239 ,  H01L27/146

Abstract: A camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof is provided. The array camera module comprises two or more camera lenses and a circuit unit. The circuit unit comprises a circuit board portion for electrically connecting two or more photosensitive sensors of the array camera module, and a conjoined encapsulation portion integrally encapsulated on the circuit board portion. The camera lenses are respectively arranged along the photosensitive paths of the photosensitive sensors.

公开(公告)号：US10356299B2

公开(公告)日：2019-07-16

申请号：US15057071

申请日：2016-02-29

Applicant: NINGBO SUNNY OPOTECH CO., LTD.

Inventor： Mingzhu Wang ,  Nan Guo ,  Feifan Chen ,  Bojie Zhao ,  Bo Peng ,  Zhen Huang

IPC: H04N5/225

Abstract: A camera module includes a lens, a photosensitive chip and an electrical holder. The electrical holder has an integrated circuit that the electrical holder serves as an integration of a base and a PCB in a conventional camera module, wherein the electrical holder not only forms an assembling unit for connecting a driver and an optical lens but also forms an electrical connection unit for electrically connecting to the driver, a photosensitive chip and a flexible circuit board with each other, so as to minimize an overall size of the camera module.

公开(公告)号：US10222573B2

公开(公告)日：2019-03-05

申请号：US15057041

申请日：2016-02-29

Applicant: NINGBO SUNNY OPOTECH CO., LTD.

Inventor： Mingzhu Wang ,  Bojie Zhao ,  Liang Ding ,  Chunmei Liu ,  Feifan Chen ,  Nan Guo ,  Heng Jiang

IPC: G02B7/00 ,  H04N5/225 ,  G02B7/09 ,  B29C65/78 ,  G02B7/02

Abstract: An adjustable optical lens and camera module and manufacturing method thereof are provided, wherein the camera module includes an optical sensor and an adjustable optical lens. The adjustable optical lens, which is arranged in a photosensitive path of the optical sensor, includes an optical structural member and at least two lenses. Each of the lens is arranged in an internal space of the optical structural member along an axial direction of the optical structural member, wherein before packaging the adjustable optical lens and the optical sensor, at least one position of the lens in the internal space of the optical structural member is able to be adjusted, so that a central axis line of the adjustable optical lens and a central axis line of the optical sensor are coincided, so as to improve the image quality of the camera module.

公开(公告)号：US10175447B2

公开(公告)日：2019-01-08

申请号：US15705225

申请日：2017-09-14

Applicant: NINGBO SUNNY OPOTECH CO., LTD.

Inventor： Mingzhu Wang ,  Bojie Zhao ,  Takehiko Tanaka ,  Nan Guo ,  Zhenyu Chen ,  Heng Jiang ,  Zhongyu Luan ,  Fengsheng Xi ,  Feifan Chen ,  Liang Ding

IPC: G02B7/02 ,  H01L21/56 ,  H01L25/065 ,  G02B5/20 ,  G02B3/00 ,  G02B7/00 ,  H04N5/225 ,  H05K1/02 ,  H05K1/18 ,  B29C45/14 ,  H01L27/146 ,  H04M1/02 ,  B29L31/34

Abstract: An array imaging module includes a molded photosensitive assembly which includes a supporting member, at least a circuit board, at least two photosensitive units, at least two lead wires, and a mold sealer. The photosensitive units are coupled at the chip coupling area of the circuit board. The lead wires are electrically connected the photosensitive units at the chip coupling area of the circuit board. The mold sealer includes a main mold body and has two optical windows. When the main mold body is formed, the lead wires, the circuit board and the photosensitive units are sealed and molded by the main mold body of the mold sealer, such that after the main mold body is formed, the main mold body and at least a portion of the circuit board are integrally formed together at a position that the photosensitive units are aligned with the optical windows respectively.

公开(公告)号：US09826132B2

公开(公告)日：2017-11-21

申请号：US15473607

申请日：2017-03-30

Applicant: NINGBO SUNNY OPOTECH CO., LTD.

Inventor： Mingzhu Wang ,  Bojie Zhao ,  Takehiko Tanaka ,  Nan Guo ,  Zhenyu Chen ,  Heng Jiang ,  Zhongyu Luan ,  Fengsheng Xi ,  Feifan Chen ,  Liang Ding

IPC: H04N5/225 ,  G02B7/02 ,  H05K1/02 ,  H04M1/02 ,  G02B3/00 ,  G02B7/00 ,  G02B5/20 ,  H01L27/146

CPC classification number: H04N5/2257 ,  G02B3/0075 ,  G02B5/201 ,  G02B7/006 ,  G02B7/021 ,  H01L27/14625 ,  H04M1/0264 ,  H04N5/2252 ,  H04N5/2253 ,  H04N5/2254 ,  H04N5/2258 ,  H05K1/0203 ,  H05K1/0274 ,  H05K1/183 ,  H05K1/185 ,  H05K1/189 ,  H05K2201/0141 ,  H05K2201/0158 ,  H05K2201/0175 ,  H05K2201/09036 ,  H05K2201/10121

Abstract: An array imaging module includes a molded photosensitive assembly which includes a supporting member, at least a circuit board, at least two photosensitive units, at least two lead wires, and a mold sealer. The photosensitive units are coupled at the chip coupling area of the circuit board. The lead wires are electrically connected the photosensitive units at the chip coupling area of the circuit board. The mold sealer includes a main mold body and has two optical windows. When the main mold body is formed, the lead wires, the circuit board and the photosensitive units are sealed and molded by the main mold body of the mold sealer, such that after the main mold body is formed, the main mold body and at least a portion of the circuit board are integrally formed together at a position that the photosensitive units are aligned with the optical windows respectively.

公开(公告)号：US12041335B2

公开(公告)日：2024-07-16

申请号：US17986436

申请日：2022-11-14

Applicant: NINGBO SUNNY OPOTECH CO., LTD.

Inventor： Mingzhu Wang ,  Nan Guo ,  Zhenyu Chen ,  Bojie Zhao ,  Takehiko Tanaka ,  Feifan Chen ,  Ye Wu

IPC: H04N23/57 ,  G01N15/06 ,  G03B17/02 ,  H04M1/02 ,  H04N23/54 ,  H04N23/55

CPC classification number: H04N23/57 ,  G01N15/0656 ,  G03B17/02 ,  H04M1/0264 ,  H04N23/54 ,  H04N23/55

Abstract: The present disclosure provides a camera module, a circuit board assembly and a manufacturing method thereof, and an electronic device with the camera module, wherein the circuit board assembly comprises at least one electronic component, a substrate, and a molding unit. At least one of the electronic components is connected to the substrate conductively on a back face of the substrate. The molding unit comprises a back molding portion and a molding base, wherein the molding base is bonded to a front face of the substrate integrally when the back molding portion is bonded to at least a part of an area of the back face of the substrate integrally. There may be no need to reserve a position on the front face of the substrate to conductively connect the electronic components, so that the length and width of the camera module can be reduced, thereby reducing the volume of the camera module.

公开(公告)号：US12007583B2

公开(公告)日：2024-06-11

申请号：US18074882

申请日：2022-12-05

Applicant: NINGBO SUNNY OPOTECH CO., LTD.

Inventor： Mingzhu Wang ,  Bojie Zhao ,  Chunmei Liu ,  Feifan Chen ,  Zhenyu Chen

IPC: G02B3/00 ,  G02B13/00 ,  H04N23/54 ,  H04N23/55

CPC classification number: G02B3/00 ,  G02B13/004 ,  H04N23/54 ,  H04N23/55 ,  G02B2003/0093

Abstract: A lens (10) and a camera module (100) and a manufacturing method thereof, wherein the lens (10) comprises an edge-cut lens sheet (114), wherein the edge-cut lens sheet (14) includes at least one chord edge (1141) and at least one circular edge (1142), wherein the chord edge (1141) and the circular edge (1142) are adjacently connected to each other, and wherein the chord edge (1141) and the circular edge (1142) have different curvatures, so that the lens sheet (114) becomes narrow and the width of the lens (10) become narrow, to form an ultra-narrow camera module (100).

公开(公告)号：US11877044B2

公开(公告)日：2024-01-16

申请号：US15999858

申请日：2016-07-28

Applicant: NINGBO SUNNY OPOTECH CO., LTD.

Inventor： Mingzhu Wang ,  Bojie Zhao ,  Takehiko Tanaka ,  Nan Guo ,  Zhenyu Chen ,  Zhen Huang ,  Feifan Chen ,  Liang Ding

IPC: H04N23/57 ,  H04N23/55 ,  G06F1/16 ,  H04N23/67

CPC classification number: H04N23/57 ,  H04N23/55 ,  G06F1/1686 ,  H04N23/67

Abstract: A camera module, an integral base component of same, and a manufacturing method therefor are provided. The camera module includes at least one lens, at least one photosensitive chip, at least one filter, and at least one integral base component. The integral base component includes a base part and a circuit board part. The base part is integrally packaged in the circuit board part. The photosensitive chip is mounted on the circuit board part. The base part forms at least one through hole so as to provide the photosensitive chip with a light path. The lens is arranged on the light path of the photosensitive chip.

公开(公告)号：US11867965B2

公开(公告)日：2024-01-09

申请号：US17145248

申请日：2021-01-08

Applicant: NINGBO SUNNY OPOTECH CO., LTD.

Inventor： Mingzhu Wang ,  Bojie Zhao ,  Liang Ding ,  Chunmei Liu ,  Feifan Chen ,  Nan Guo ,  Heng Jiang

IPC: G02B7/00 ,  H01L27/146 ,  H04N23/54 ,  H04N23/55 ,  H04N23/57 ,  G02B7/02 ,  G02B7/09 ,  B29C65/78

CPC classification number: G02B7/003 ,  B29C65/7802 ,  G02B7/006 ,  G02B7/021 ,  G02B7/025 ,  G02B7/09 ,  H01L27/14618 ,  H04N23/54 ,  H04N23/55 ,  H04N23/57

Abstract: An adjustable optical lens and camera module and manufacturing method thereof are provided, wherein the camera module includes an optical sensor and an adjustable optical lens. The adjustable optical lens, which is arranged in a photosensitive path of the optical sensor, includes an optical structural member and at least two lenses. Each of the lens is arranged in an internal space of the optical structural member along an axial direction of the optical structural member, wherein before packaging the adjustable optical lens and the optical sensor, at least one position of the lens in the internal space of the optical structural member is able to be adjusted, so that a central axis line of the adjustable optical lens and a central axis line of the optical sensor are coincided, so as to improve the image quality of the camera module.

公开(公告)号：US11743569B2

公开(公告)日：2023-08-29

申请号：US17685587

申请日：2022-03-03

Applicant: NINGBO SUNNY OPOTECH CO., LTD.

Inventor： Mingzhu Wang ,  Bojie Zhao ,  Takehiko Tanaka ,  Feifan Chen ,  Qimin Mei ,  Liang Ding ,  Heng Jiang

IPC: H04N23/57 ,  H01L27/146 ,  H04N13/239 ,  H04N23/45 ,  H04N23/51 ,  H04N23/54 ,  H04N23/55

CPC classification number: H04N23/57 ,  H01L27/1469 ,  H01L27/14618 ,  H01L27/14634 ,  H01L27/14636 ,  H04N13/239 ,  H04N23/45 ,  H04N23/51 ,  H04N23/54 ,  H04N23/55 ,  H01L2224/48091 ,  H04N2213/001 ,  H01L2224/48091 ,  H01L2924/00014

Abstract: A camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof is provided. The array camera module comprises two or more camera lenses and a circuit unit. The circuit unit comprises a circuit board portion for electrically connecting two or more photosensitive sensors of the array camera module, and a conjoined encapsulation portion integrally encapsulated on the circuit board portion. The camera lenses are respectively arranged along the photosensitive paths of the photosensitive sensors.