公开(公告)号：US11646332B2

公开(公告)日：2023-05-09

申请号：US16954724

申请日：2018-12-18

Applicant: Ningbo Sunny Opotech Co., Ltd.

Inventor： Takehiko Tanaka ,  Bojie Zhao ,  Ye Wu ,  Zhewen Mei ,  Mingzhu Wang

IPC: H01L27/146 ,  H04N5/225

CPC classification number: H01L27/14618 ,  H01L27/14636 ,  H01L27/14687 ,  H04N5/2252 ,  H04N5/2253 ,  H04N5/2257

Abstract: A photosensitive assembly includes a circuit board, a photosensitive element mounted on the circuit board and including a first edge, a first metal wire electrically connecting the photosensitive element and the circuit board and spanning the first edge, a first electronic element mounted on the circuit board and having a mounting area corresponding to an extension line of the first edge, and a molding portion formed on the circuit board, surrounding the photosensitive element, extending to the photosensitive element, covering the first electronic element and the first metal wire, and contacting with a surface of the photosensitive element. Also included are a corresponding camera module, a photosensitive assembly jointed panel and a manufacturing method thereof. The damage risk of a gold wire in a molding process can be reduced to a certain extent without adding additional components and changing a die.

公开(公告)号：US11579341B2

公开(公告)日：2023-02-14

申请号：US16479403

申请日：2018-01-26

Applicant: NINGBO SUNNY OPOTECH CO., LTD.

Inventor： Mingzhu Wang ,  Bojie Zhao ,  Chunmei Liu ,  Feifan Chen ,  Zhenyu Chen

IPC: G02B3/00 ,  G02B13/00 ,  H04N5/225

Abstract: A lens (10) and a camera module (100) and a manufacturing method thereof, wherein the lens (10) comprises an edge-cut lens sheet (114), wherein the edge-cut lens sheet (14) includes at least one chord edge (1141) and at least one circular edge (1142), wherein the chord edge (1141) and the circular edge (1142) are adjacently connected to each other, and wherein the chord edge (1141) and the circular edge (1142) have different curvatures, so that the lens sheet (114) becomes narrow and the width of the lens (10) become narrow, to form an ultra-narrow camera module (100).

公开(公告)号：US11533416B2

公开(公告)日：2022-12-20

申请号：US16575357

申请日：2019-09-18

Applicant: NINGBO SUNNY OPOTECH CO., LTD.

Inventor： Mingzhu Wang ,  Bojie Zhao ,  Zhenyu Chen ,  Nan Guo ,  Takehiko Tanaka

IPC: H04N5/225 ,  H01L27/146 ,  H04N5/247 ,  G02B7/00 ,  G02B7/02 ,  H05K1/18 ,  G03B13/36 ,  G02B7/08 ,  H05K3/28 ,  G02B5/20 ,  G02B7/09 ,  H02K41/035 ,  H02N2/02 ,  H05K1/02

Abstract: A camera module and an array camera module based on an integral packing process are disclosed. The camera module or each of the camera module units of the array camera module includes a circuit board, an integral base, a photosensitive element operatively connected to the circuit board, a lens, a light filter holder installed at the integral base and a light filter installed at the light filter holder. The light filter is not required to be directly installed to the integral base, so that the light filter is protected and the requiring area of the light filter is reduced.

公开(公告)号：US11161291B2

公开(公告)日：2021-11-02

申请号：US16307926

申请日：2017-06-06

Applicant: NINGBO SUNNY OPOTECH CO., LTD.

Inventor： Mingzhu Wang ,  Bojie Zhao ,  Takehiko Tanaka ,  Zhen Huang

IPC: B29C45/78 ,  B29C45/26 ,  B29C45/64 ,  H04N5/225 ,  H05K3/28 ,  H05K3/00 ,  B29L31/34

Abstract: A molded circuit board (10) of a camera module (100), manufacturing equipment (200) and a manufacturing method for the molded circuit board. The manufacturing equipment (200) comprises a forming mold (210), which comprises a first mold (211) and a second mold (212) that can be opened or closed, where the first mold (211) and the second mold (212) form a forming cavity (213) when closed. Also, a light window forming block (214) and a base forming guide groove (215) located at the periphery of the light window forming block (214) are provided within the forming cavity (213). When a circuit board is mounted in the forming cavity (213), once a molding material (13) filled into the base forming guide groove (215) is solidified into form by undergoing a transition process from a liquid state to a solid state, a molded base (12) is formed at the position corresponding to the base forming guide groove (215), a through hole of the molded base (12) is formed at the position corresponding to the light window forming block (214), where the molded base (12) is integrally formed on the circuit board so as to form the molded circuit board (10) of the camera module (100). The through hole is used for providing the camera module (100) with an optical path. The molded base (12) can serve as a frame for the camera module (100).

公开(公告)号：US11099353B2

公开(公告)日：2021-08-24

申请号：US15772512

申请日：2016-10-25

Applicant: Ningbo Sunny Opotech Co., Ltd.

Inventor： Mingzhu Wang ,  Bojie Zhao ,  Heng Jiang ,  Liang Ding ,  Feifan Chen ,  Chunmei Liu ,  Nan Guo ,  Shoujie Wang

IPC: G02B7/10 ,  G02B5/20 ,  H04N5/225 ,  G02B7/02 ,  G02B7/00 ,  G02B13/00

Abstract: An adjustable optical lens and camera module, and manufacturing method and applications thereof is disclosed. The camera module includes an optical sensor and an adjustable optical lens. The adjustable optical lens includes an optical structural member and at least two lenses, wherein each of the lenses is arranged in an internal space of the optical structural member. Along a vertical direction of the optical structural member, at least one lens is adapted to be adjustably pre-mounted to an internal space of the optical structural member serving as an adjustable lens. The side wall of the optical structural member is provided with at least one adjustment channel, which is positioned corresponding to the adjustable lens, so that an assembling position of the adjustable lens can be adjusted through the adjustment channel so as to align a central axis line of the adjustable optical lens with a central axis line of the optical sensor.

公开(公告)号：US11051400B2

公开(公告)日：2021-06-29

申请号：US15057078

申请日：2016-02-29

Applicant: NINGBO SUNNY OPOTECH CO., LTD.

Inventor： Mingzhu Wang ,  Nan Guo ,  Feifan Chen ,  Bojie Zhao ,  Bo Peng ,  Zhen Huang

IPC: H05K1/02 ,  H05K3/00 ,  G02B7/09 ,  H04N5/225 ,  H05K3/32 ,  H05K3/46 ,  H05K3/20

Abstract: A camera module with compression-molded circuit board is manufactured by compression-molding that can obtain properties such as high flatness, ultra-thin, fine wiring width and high integration.

公开(公告)号：US11049898B2

公开(公告)日：2021-06-29

申请号：US15617843

申请日：2017-06-08

Applicant: Ningbo Sunny Opotech Co., Ltd.

Inventor： Mingzhu Wang ,  Nan Guo ,  Jingfei He ,  Zhenyu Chen ,  Bojie Zhao ,  Takehiko Tanaka ,  Feifan Chen ,  Ye Wu ,  Zhen Huang ,  Zhongyu Luan

IPC: H01L27/146 ,  H05K1/18 ,  H04N5/225 ,  H05K3/28 ,  H05K3/00 ,  H05K1/02

Abstract: A method for manufacturing semiconductor modules for image-sensing devices is disclosed. The method may comprise applying a removable layer on a first surface of a printed circuit board (PCB) which comprises a plurality of PCB units; mounting a photosensitive member to a second surface of each of the PCB units; and encapsulating the photosensitive member with an encapsulation layer on each PCB unit. Each PCB unit may comprise at least a semiconductor component on a second surface of the PCB and one or more opening across the first surface and the second surface. The photosensitive member and the removable layer separate the one or more opening from outside, and the photosensitive member is positioned to receive light through the opening. At least one semiconductor component is also encapsulated by the encapsulation layer on each PCB unit.

公开(公告)号：US10897611B2

公开(公告)日：2021-01-19

申请号：US16311896

申请日：2017-06-23

Applicant: NINGBO SUNNY OPOTECH CO., LTD.

Inventor： Zhenyu Chen ,  Mingzhu Wang ,  Xiaojuan Su ,  Bojie Zhao

IPC: H04N17/00 ,  H04N5/225 ,  G02B7/02 ,  H04N5/232

Abstract: Provided are a fixed-focus photographing module, a manufacturing method thereof, and a focusing device and method thereof. The focusing method includes: pre-assembling an optical lens assembly in a lens assembly holder, wherein the optical lens assembly is exposed at the exterior of the lens assembly holder, and the optical lens assembly is located in a photosensing path of a photosensing component assembled in a circuit board to form a pre-assembled photographing module; performing, by the pre-assembled photographing module, a photographing operation to obtain a testing image; adjusting, according to the testing image, a relative position between the optical lens assembly and lens assembly holder until the pre-assemble photographing module outputs a clear image as required; and fixing the optical lens assembly and the lens assembly holder to complete a focusing operation and obtain an assembled fixed-focus photographing module.

公开(公告)号：US10750074B2

公开(公告)日：2020-08-18

申请号：US16427370

申请日：2019-05-31

Applicant: NINGBO SUNNY OPOTECH CO., LTD.

Inventor： Mingzhu Wang ,  Nan Guo ,  Feifan Chen ,  Bojie Zhao ,  Bo Peng ,  Zhen Huang

IPC: H04N5/225

Abstract: A camera module includes a lens, a photosensitive chip and an electrical holder. The electrical holder has an integrated circuit that the electrical holder serves as an integration of a base and a PCB in a conventional camera module, wherein the electrical holder not only forms an assembling unit for connecting a motor and an optical lens but also forms an electrical connection unit for electrically connecting to the motor, a photosensitive chip and a flexible circuit board with each other, so as to minimize an overall size of the camera module.

公开(公告)号：US20180352129A1

公开(公告)日：2018-12-06

申请号：US16101509

申请日：2018-08-12

Applicant: NINGBO SUNNY OPOTECH CO., LTD.

Inventor： Mingzhu WANG ,  Bojie Zhao ,  Takehiko Tanaka ,  Feifan CHEN ,  Qimin MEI ,  Liang DING ,  Heng JIANG

IPC: H04N5/225 ,  H01L27/146 ,  H04N13/239

CPC classification number: H04N5/2257 ,  H01L27/14618 ,  H01L27/14634 ,  H01L27/14636 ,  H01L27/1469 ,  H01L2224/48091 ,  H04N5/2252 ,  H04N5/2253 ,  H04N5/2254 ,  H04N5/2258 ,  H04N13/239 ,  H04N2213/001 ,  H01L2924/00014

Abstract: A camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof is provided. The array camera module comprises two or more camera lenses and a circuit unit. The circuit unit comprises a circuit board portion for electrically connecting two or more photosensitive sensors of the array camera module, and a conjoined encapsulation portion integrally encapsulated on the circuit board portion. The camera lenses are respectively arranged along the photosensitive paths of the photosensitive sensors.