公开(公告)号：US08810456B2

公开(公告)日：2014-08-19

申请号：US13325273

申请日：2011-12-14

Applicant: Noboru Kato

Inventor： Noboru Kato

IPC: H01Q1/38 ,  H01Q9/28 ,  H01Q7/00 ,  H01Q1/22

CPC classification number: H01Q1/2225 ,  H01Q1/38 ,  H01Q7/00 ,  H01Q9/285

Abstract: A wireless IC device includes a wireless IC chip, a power feeding circuit substrate including a power feeding circuit including inductance elements, and radiation plates including plate-shaped coupling units. The inductance elements have spiral shapes and are wound in directions opposite to each other. The plate-shaped coupling units in the radiation plates are disposed in a vicinity of the inductance elements so as to be perpendicular or substantially perpendicular to the winding axes of the inductance elements, and eddy currents occur in the plate-shaped coupling units so as to couple the power feeding circuit and the radiation plates with each other. The plate-shaped coupling units may also have spiral shapes.

Abstract translation: 无线IC器件包括无线IC芯片，包括电感元件的馈电电路的馈电电路基板和包括板状耦合单元的辐射板。 电感元件具有螺旋形状并沿彼此相反的方向缠绕。 辐射板中的板状耦合单元设置在电感元件附近，以便垂直于或基本上垂直于电感元件的绕组轴线，并且在板形耦合单元中产生涡流，从而 将供电电路和辐射板相互耦合。 板形联接单元也可以具有螺旋形状。

公开(公告)号：US08757500B2

公开(公告)日：2014-06-24

申请号：US12603608

申请日：2009-10-22

Applicant: Noboru Kato ,  Yuya Dokai

Inventor： Noboru Kato ,  Yuya Dokai

IPC: G06K19/06

CPC classification number: G06K19/07749 ,  G06K19/07779 ,  G06K19/07783 ,  G06K19/07784 ,  H01Q1/2225 ,  H01Q1/40 ,  H01Q7/00

Abstract: A wireless IC device has a structure such that the size of a radiation plate and a radiation characteristic may be determined irrespective of an impedance of a wireless IC chip. The wireless IC device includes a wireless IC chip that is arranged to process transmission and reception signals, a spiral matching inductance element and a plane electrode that are located on a surface of a feeder circuit substrate, and a coil-shaped radiation plate located on a radiation substrate. Plane electrodes connected to both ends of the radiation plate are electromagnetically coupled respectively to the inductance element and the plane electrode. The wireless IC chip is operated by a signal received by the radiation plate, and a response signal from the wireless IC chip is radiated outside from the radiation plate.

Abstract translation: 无线IC器件具有能够确定辐射板的尺寸和辐射特性而不考虑无线IC芯片的阻抗的结构。 无线IC器件包括布置成处理发送和接收信号的无线IC芯片，位于馈电电路基板的表面上的螺旋匹配电感元件和平面电极以及位于馈电电路基板的表面上的线圈形辐射板 辐射基板。 连接到辐射板两端的平面电极分别电磁耦合到电感元件和平面电极。 无线IC芯片由辐射板接收的信号操作，并且来自无线IC芯片的响应信号从辐射板向外辐射。

公开(公告)号：US08754738B2

公开(公告)日：2014-06-17

申请号：US13546007

申请日：2012-07-11

Applicant: Noboru Kato ,  Kenichi Ishizuka

Inventor： Noboru Kato ,  Kenichi Ishizuka

IPC: H01F5/00 ,  H01F27/28 ,  H01F27/30

CPC classification number: H01P1/2135 ,  H01F19/04 ,  H01F2027/2809 ,  H01P1/20345 ,  H01Q1/243 ,  H01Q5/371 ,  Y10T29/4902

Abstract: A transformer having a high degree of coupling is connected between, for example, an antenna element and a power feed circuit. The transformer having a high degree of coupling includes a first inductance element connected to the power feed circuit and a second inductance element coupled to the first inductance element. A first end of the first inductance element is connected to the power feed circuit and a second end of the first inductance element is connected to the antenna element. A first end of the second inductance element is connected to the antenna element and a second end of the second inductance element is grounded.

Abstract translation: 具有高度耦合度的变压器连接在例如天线元件和馈电电路之间。 具有高度耦合度的变压器包括连接到馈电电路的第一电感元件和耦合到第一电感元件的第二电感元件。 第一电感元件的第一端连接到馈电电路，并且第一电感元件的第二端连接到天线元件。 第二电感元件的第一端连接到天线元件，第二电感元件的第二端接地。

公开(公告)号：US08723753B2

公开(公告)日：2014-05-13

申请号：US13286296

申请日：2011-11-01

Applicant: Noboru Kato ,  Satoshi Ishino ,  Kenichi Ishizuka ,  Noriyuki Ueki

Inventor： Noboru Kato ,  Satoshi Ishino ,  Kenichi Ishizuka ,  Noriyuki Ueki

IPC: H01Q21/00

CPC classification number: H01Q1/243 ,  H01P1/20 ,  H01Q21/28

Abstract: An antenna device includes a first antenna element that resonates with a first resonant frequency, a second antenna element that resonates with a second resonant frequency, a first frequency stabilizing circuit connected to a feeding end of the first antenna element, and a second frequency stabilizing circuit connected to a feeding end of the second antenna element. The first antenna element and the second antenna element can be arranged along two sides of a case of a communication terminal apparatus, for example.

Abstract translation: 天线装置包括与第一谐振频率谐振的第一天线元件，与第二谐振频率谐振的第二天线元件，连接到第一天线元件的馈电端的第一频率稳定电路和第二频率稳定电路 连接到第二天线元件的馈电端。 例如，第一天线元件和第二天线元件可以布置在通信终端设备的壳体的两侧。

公开(公告)号：US08610636B2

公开(公告)日：2013-12-17

申请号：US13163803

申请日：2011-06-20

Applicant: Noboru Kato ,  Jun Sasaki ,  Kosuke Yamada

Inventor： Noboru Kato ,  Jun Sasaki ,  Kosuke Yamada

IPC: H01Q1/50

CPC classification number: H01Q1/2225 ,  G06K19/07749 ,  H01F2017/002

Abstract: A radio frequency IC device includes a radio frequency IC chip, a feeder circuit substrate, and a radiating plate. The feeder circuit substrate includes a feeder circuit that electrically connects to the radio IC chip and that includes a resonance circuit and/or a matching circuit including inductance elements. The feeder circuit substrate is bonded to the radiating plate, which radiates a transmission signal supplied from the feeder circuit and supplies a received signal to the feeder circuit. The inductance elements are arranged in spiral patterns wound in opposite directions and couple to each other in opposite phases. The radio frequency IC device is able to obtain a radio frequency IC device that is not susceptible to being affected by a usage environment, minimizes variations in radiation characteristics, and can be used in a wide frequency band.

Abstract translation: 射频IC器件包括射频IC芯片，馈电电路基板和散热板。 供电电路基板包括电连接到无线电IC芯片并且包括谐振电路和/或包括电感元件的匹配电路的馈电电路。 供电电路基板被接合到辐射板，辐射从馈电电路提供的传输信号，并将接收到的信号提供给馈电电路。 电感元件以相反方向缠绕的螺旋图案布置，并以相反的方式相互耦合。 无线射频IC器件能够获得不易受到使用环境影响的射频IC器件，使辐射特性的变化最小化，可以在宽频带中使用。

公开(公告)号：US08596545B2

公开(公告)日：2013-12-03

申请号：US12944099

申请日：2010-11-11

Applicant: Noboru Kato ,  Jun Sasaki

Inventor： Noboru Kato ,  Jun Sasaki

IPC: G06K19/06 ,  H01L23/02

CPC classification number: G06K19/07749 ,  H01Q1/2225 ,  H01Q7/00

Abstract: A component of a wireless IC device includes a wireless IC chip and a feeding circuit substrate including a plurality of laminated resin layers. The wireless IC chip is included inside the feeding circuit substrate, and an annular electrode is arranged inside the feeding circuit substrate. The component of a wireless IC device and the radiation plate define the wireless IC device.

Abstract translation: 无线IC器件的组件包括无线IC芯片和包括多个层叠树脂层的馈电电路基板。 无线IC芯片包括在供电电路基板的内部，环状电极配置在供电电路基板的内部。 无线IC器件的组件和辐射板限定无线IC器件。

公开(公告)号：US08583043B2

公开(公告)日：2013-11-12

申请号：US13094928

申请日：2011-04-27

Applicant: Noboru Kato ,  Nobuo Ikemoto ,  Yuya Dokai ,  Koji Shiroki

Inventor： Noboru Kato ,  Nobuo Ikemoto ,  Yuya Dokai ,  Koji Shiroki

IPC: H04B7/00

CPC classification number: H01Q9/285 ,  G06K19/07718 ,  G06K19/07735 ,  G06K19/07749 ,  H01L23/60 ,  H01L23/642 ,  H01L23/645 ,  H01L23/66 ,  H01L2223/6677 ,  H01L2924/0002 ,  H01L2924/3011 ,  H01Q1/2225 ,  H01Q1/38 ,  H01Q9/24 ,  H01L2924/00

Abstract: A high-frequency device includes a wireless IC chip and a board which is coupled to the wireless IC chip and electrically connected to radiator plates, and an inductor and/or a capacitance are provided as a static electricity countermeasure element in the board. The inductor is connected in parallel between the wireless IC chip and the radiator plates, and its impedance at the frequency of static electricity is less than an impedance of the wireless IC chip.

Abstract translation: 高频器件包括无线IC芯片和耦合到无线IC芯片并电连接到散热器板的板，并且在板中提供电感器和/或电容作为静电对抗元件。 电感器并联在无线IC芯片和散热板之间，其静电频率下的阻抗小于无线IC芯片的阻抗。

公开(公告)号：US08461463B2

公开(公告)日：2013-06-11

申请号：US13080783

申请日：2011-04-06

Applicant: Noboru Kato ,  Jun Sasaki ,  Katsumi Taniguchi

Inventor： Noboru Kato ,  Jun Sasaki ,  Katsumi Taniguchi

IPC: H05K1/16

CPC classification number: H05K1/186 ,  H01L23/49822 ,  H01L23/50 ,  H01L23/645 ,  H01L25/16 ,  H01L2224/16225 ,  H01L2924/19106 ,  H05K1/141 ,  H05K1/165 ,  H05K3/284 ,  H05K2201/09481 ,  H05K2201/10045 ,  H05K2203/1316

Abstract: A composite module is obtained which enables high-density mounting of components without increasing its size. A composite module includes a main substrate which is a multilayer circuit board, a sub-substrate mounted on a lower surface of the main substrate, a sealing layer arranged on the lower surface of the main substrate to cover the sub-substrate, the sealing layer defining a mount surface arranged to be mounted on a mount board, and terminal electrodes disposed on the mount surface. The terminal electrodes include at least one first terminal electrode drawn directly from the main substrate and at least one second terminal electrode drawn directly from the sub-substrate.

Abstract translation: 获得了组合模块，其可以在不增加其尺寸的情况下实现组件的高密度安装。 复合模块包括作为多层电路板的主衬底，安装在主衬底的下表面上的子衬底，设置在主衬底的下表面以覆盖副衬底的密封层，密封层 限定安装在安装板上的安装表面和设置在安装表面上的端子电极。 端子电极包括从主衬底直接绘制的至少一个第一端子电极和直接从该辅助衬底引出的至少一个第二端子电极。

公开(公告)号：US08360325B2

公开(公告)日：2013-01-29

申请号：US12861945

申请日：2010-08-24

Applicant: Takeshi Kataya ,  Noboru Kato ,  Satoshi Ishino ,  Nobuo Ikemoto ,  Ikuhei Kimura ,  Koji Shiroki ,  Yuya Dokai

Inventor： Takeshi Kataya ,  Noboru Kato ,  Satoshi Ishino ,  Nobuo Ikemoto ,  Ikuhei Kimura ,  Koji Shiroki ,  Yuya Dokai

IPC: G06K19/06 ,  G06K19/00 ,  H01Q1/38 ,  H01Q9/28

CPC classification number: H01Q9/40 ,  H01L2224/16225 ,  H01L2224/73204 ,  H01Q1/2225 ,  H01Q1/38 ,  H01Q7/00 ,  H01Q9/285 ,  H05K1/16 ,  Y10T29/49016

Abstract: A wireless IC device and an electronic apparatus are obtained, which can achieve miniaturization and improve the gain of a radiator plate (electrode) without providing a dedicated antenna. A wireless IC device is provided, in which a loop electrode is provided in a ground electrode provided on a printed wiring circuit board, and in which a wireless IC chip that processes a transmission/reception signal or an electromagnetic coupling module is coupled to the loop electrode. The ground electrode is coupled to the wireless IC chip or the electromagnetic coupling module via the loop electrode, and transmits or receives a high-frequency signal. The ground electrode is formed with a slit for adjusting a resonant frequency thereof.

Abstract translation: 获得无线IC器件和电子设备，其可以在不提供专用天线的情况下实现小型化并且提高散热器板（电极）的增益。 提供了一种无线IC器件，其中在设置在印刷布线电路板上的接地电极中设置环形电极，并且其中处理发送/接收信号的无线IC芯片或电磁耦合模块耦合到环路 电极。 接地电极通过环形电极耦合到无线IC芯片或电磁耦合模块，并且发送或接收高频信号。 接地电极形成有用于调节其谐振频率的狭缝。

公开(公告)号：US08299929B2

公开(公告)日：2012-10-30

申请号：US12398497

申请日：2009-03-05

Applicant: Noboru Kato ,  Tsuneo Murata

Inventor： Noboru Kato ,  Tsuneo Murata

IPC: G08B13/14

CPC classification number: G06K19/07749 ,  G06K19/07756 ,  H01L2224/16225

Abstract: An inductively coupled module includes a wireless IC chip and a feeder circuit substrate which is connected to the wireless IC chip and which includes a feeder circuit including an inductance element and a capacitance element. The feeder circuit substrate is made of a biodegradable plastic so as to prevent a negative impact of the module on the environment and the human body. The inductively coupled module is adhered on a radiation plate and is used as a wireless IC device of an RFID system.

Abstract translation: 电感耦合模块包括连接到无线IC芯片的无线IC芯片和馈电电路基板，其包括具有电感元件和电容元件的馈电电路。 供电电路基板由可生物降解的塑料制成，以防止模块对环境和人体的负面影响。 电感耦合模块粘附在辐射板上，并用作RFID​​系统的无线IC器件。