公开(公告)号：US5577657A

公开(公告)日：1996-11-26

申请号：US522890

申请日：1995-09-01

Applicant: Andrew Z. Glovatsky

Inventor： Andrew Z. Glovatsky

IPC: B23K1/002 ,  B23K1/008 ,  H05K3/34

CPC classification number: B23K1/008 ,  H05K3/3494 ,  B23K2201/40 ,  H05K2203/087 ,  H05K3/3447

Abstract: Method of efficiently refiow soldering one or more devices to a printed circuit board with a convective heating oven, each device having a plurality of plate supported electronic connecting pins that are to be soldered within respective mating openings of the printed circuit board for electronic connection, the method comprising: (i) placing a solder paste in each of the openings; (ii) assembling the device to the circuit board by positioning the plate of the device along, but spaced in relation to, the printed circuit board to define a planar space therebetween, with the pins extending into such openings and into the soldered paste to thereby form an assembly; and (iii) passing the assembly through the convective heating oven for a time period to melt the solder paste and form a solid connection upon removal of the convective heat, said passing being carried out by use of convective heat focusing features that guide the convective heat flow between the plate and board to enhance convective heating of the solder paste from both sides of the board.

Abstract translation: 使用对流加热炉将一个或多个装置有效地将一个或多个装置焊接到印刷电路板的方法，每个装置具有多个板支撑的电子连接销，其将被焊接在用于电子连接的印刷电路板的相应匹配开口内， 方法包括：（i）在每个开口中放置焊膏; （ii）通过将装置的板定位在印刷电路板上，但与印刷电路板间隔开来，将装置组装到电路板上，以限定它们之间的平面空间，其中销延伸到这种开口中并进入焊接的浆料 组成; 和（iii）使组件通过对流加热炉一段时间以熔化焊膏并在去除对流热量时形成固体连接，所述通过使用引导对流热的对流热聚焦特征 在板和板之间流动以增强焊膏从板的两侧的对流加热。

公开(公告)号：US5524812A

公开(公告)日：1996-06-11

申请号：US442886

申请日：1995-05-17

Applicant: Masahiro Taniguchi ,  Youichi Nakamura ,  Kazumi Ishimoto ,  Kimihito Kuwabara ,  Toshinori Mimura ,  Kurayasu Hamasaki ,  Kenichi Nakano ,  Manabu Ando

Inventor： Masahiro Taniguchi ,  Youichi Nakamura ,  Kazumi Ishimoto ,  Kimihito Kuwabara ,  Toshinori Mimura ,  Kurayasu Hamasaki ,  Kenichi Nakano ,  Manabu Ando

IPC: B23K1/008 ,  B23K1/012 ,  H02K3/34

CPC classification number: H02K3/34 ,  B23K1/008 ,  B23K1/012 ,  B23K2201/40 ,  B23K2201/42

Abstract: The present invention provides a reflow apparatus and method effective to make constant the internal gas flow direction in a heating section within a reflow furnace. A circulating gas path is formed in a heating unit which collects and causes the gas to flow from a sirocco fan, up the rear side of the heating unit and then down towards a circuit board moving along a transfer path at the front side of the heating unit. Moreover, a plurality of straightening plates are arranged above the transfer path of the heating unit so as to guide the hot gas, which is flowing forwardly downwardly toward the circuit board moving along the transfer path. A blow-down nozzle is provided and includes a plurality of plates aligned in rows in the transferring direction of the circuit boards. The plates have an inverse U-shaped cross section. The blow-down nozzle is arranged below the straightening plates to cause the vertical hot gas flows to flow uniformly over the whole surface of the circuit board.

公开(公告)号：US5516029A

公开(公告)日：1996-05-14

申请号：US267197

申请日：1994-06-29

Applicant: Antonino Grasso ,  Antonio Pinto

Inventor： Antonino Grasso ,  Antonio Pinto

IPC: H01L21/60 ,  B23K20/00 ,  H01L21/607

CPC classification number: H01L24/85 ,  B23K20/005 ,  H01L24/78 ,  B23K2201/40 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2224/78302 ,  H01L2224/78313 ,  H01L2224/85181 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/10253

Abstract: A method for connecting a wire lead between a semiconductor circuit chip and a corresponding terminal connector of a semiconductor device includes providing a bonding tool having a working end formed with at least a pair of grooves of different length, holding one end of the wire lead to the pin of the semiconductor device in one of said grooves and bonding it, and holding the other end of said wire to the chip in the other of said grooves an bonding it. The grooves have different lengths to allow for different wire spans across the bonded connection areas, on the chip and the pins.

Abstract translation: 一种用于连接半导体电路芯片和半导体器件的相应端子连接器之间的引线的方法包括提供一种焊接工具，其具有形成有至少一对不同长度的沟槽的工作端，其将导线的一端保持在 所述半导体器件的引脚在所述凹槽中的一个中并将其接合，并且将所述导线的另一端保持在另一个所述凹槽中的芯片上，从而将其接合。 这些凹槽具有不同的长度，以允许穿过结合的连接区域，芯片和引脚上的不同的导线跨度。

公开(公告)号：US5505777A

公开(公告)日：1996-04-09

申请号：US192709

申请日：1994-02-07

Applicant: Robert L. Ciardella ,  Philip P. Maiorca ,  Alec J. Babiarz ,  Duong La ,  Carlos E. Bouras ,  Mark S. Meier ,  John L. Christofferson ,  Ronald N. Abernathy ,  Stanley C. Aguilar ,  James C. Smith

Inventor： Robert L. Ciardella ,  Philip P. Maiorca ,  Alec J. Babiarz ,  Duong La ,  Carlos E. Bouras ,  Mark S. Meier ,  John L. Christofferson ,  Ronald N. Abernathy ,  Stanley C. Aguilar ,  James C. Smith

IPC: B05B13/00 ,  B05B12/08 ,  B05C5/00 ,  B05C5/02 ,  B05C11/10 ,  B23K3/06 ,  H01L21/56 ,  H01L21/58 ,  H05K3/34 ,  H05K13/04 ,  B05C11/00 ,  B05B15/00 ,  B05B1/02

CPC classification number: B05C11/1034 ,  B05B12/085 ,  B05B17/04 ,  B05C5/001 ,  B05C5/0225 ,  B23K3/0607 ,  H01L24/83 ,  H05K13/0469 ,  H05K3/305 ,  B23K2201/40 ,  H01L21/56 ,  H01L2224/83 ,  H05K2203/013 ,  H05K2203/163 ,  H05K3/3484 ,  Y02P70/613

Abstract: A computer controlled system for high speed surface mount adhesive placement in circuit board production includes a dot generator supported for motion along the X, Y and Z axes. The dot generator ejects a jet of viscous adhesive that breaks away from the nozzle of the dot generator as a result of its own forward momentum. The system includes an automatic circuit board conveyor with adjustable width and pneumatically operated lift and lock mechanisms. The system runs through a self-diagnostic set-up procedure and dot calibration routine. Dot size and location are monitored through a video camera and vision circuit. A computer interfaces with the vision circuit and with motion, dot generator and conveyor controllers so that the system can operate in a high volume production assembly line. Application programs are executed by the system computer typically utilizing CAD data from a disk or a computer integrated manufacturing (CIM) controller. The system automatically assigns dot sizes to specific components based on user specifications or a component library. Dot placement paths are optimized by aligning the in-line points.

Abstract translation: 用于电路板生产中的高速表面贴装粘合剂的计算机控制系统包括支持沿X，Y和Z轴运动的点发生器。 点状发生器由于其自身的向前动量而喷出从点发生器的喷嘴脱离的粘性粘合剂射流。 该系统包括具有可调宽度的自动电路板输送机和气动操作的升降机构。 系统运行自诊断设置程序和点校准程序。 点尺寸和位置通过摄像机和视觉电路进行监控。 计算机与视觉电路和运动点阵发生器和输送机控制器相连接，使得系统能够在大量的生产装配线中运行。 应用程序由系统计算机执行，通常利用来自盘或计算机集成制造（CIM）控制器的CAD数据。 系统根据用户规格或组件库自动将点大小分配给特定组件。 通过对齐直线点来优化点位置路径。

公开(公告)号：US5498850A

公开(公告)日：1996-03-12

申请号：US73539

申请日：1993-06-08

Applicant: Amitabh Das

Inventor： Amitabh Das

IPC: H05B3/03 ,  A24F47/00 ,  B23K26/22 ,  B23K35/00 ,  B23K35/30 ,  H01L21/768 ,  H05B3/02 ,  H05B3/06 ,  H05B3/14 ,  B23K26/00 ,  B23K26/02

CPC classification number: A24F47/008 ,  B23K26/22 ,  B23K35/007 ,  B23K35/302 ,  B23K2035/008 ,  B23K2201/40 ,  H01L2924/0002

Abstract: A method is disclosed for mechanically and electrically bonding metallic materials and semiconductor materials. The method according to the invention may be used, for example, in forming a semiconductor electrical heater, particularly for use in electrical smoking articles. A metallic element, such as a copper alloy power supply tab, is laser welded to a semiconductor element, such as a doped silicon resistive heater element. A laser beam is directed through a hole in the copper alloy tab to melt some silicon material, which flows into the hole in the copper tab, reacts and intermixes with the copper and solidifies to form a slug containing copper silicide. A protective material such as nickel may be applied to protect the copper silicide from oxidation if desired. An ohmic, low resistance contact and high strength bond is provided between the parts.

Abstract translation: 公开了用于机械地和电接合金属材料和半导体材料的方法。 根据本发明的方法可以用于例如形成半导体电加热器，特别是用于电吸烟制品。 诸如铜合金电源接头的金属元件被激光焊接到半导体元件，例如掺杂的硅电阻加热器元件。 激光束被引导通过铜合金接头中的孔，以熔化流入铜片中的孔中的一些硅材料，与铜反应并与之混合并固化以形成含有硅化铜的块状物。 如果需要，可以施加诸如镍的保护材料以保护硅化铜免于氧化。 部件之间提供欧姆，低电阻接触和高强度接合。

公开(公告)号：US5482736A

公开(公告)日：1996-01-09

申请号：US286153

申请日：1994-08-04

Applicant: Thomas P. Glenn ,  Roy D. Hollaway

Inventor： Thomas P. Glenn ,  Roy D. Hollaway

IPC: B23K1/20 ,  H05K3/34 ,  B05D1/28 ,  B23K3/00

CPC classification number: H05K3/3489 ,  B23K1/203 ,  B23K2201/40

Abstract: A method and apparatus for applying flux to a series of metallization contacts or plated contact pad a substrate exposed by an apertured solder mask, employs a compressible transfer pad. A central flux pick-up area is formed on the transfer pad bottom surface. The bottom surface may be spherical and may include a cylindrical post onto which a predetermined amount of flux is transferred, such as by dipping the pick-up area into a reservoir of semi-liquid paste flux. The transfer pad is then positioned over and compressed on the solder mask such that the picked up flux on the flux pick-up area of the transfer pad is pressure forced by compression of the transfer pad through apertures in the solder mask directly and successively into all the series of depressions formed on the substrate until all the depressions are substantially filled with flux. After breaking away and removal of the transfer pad, a solder ball or bonder applied solder is deposited in each flux-containing depression to form a metallurgical bond between the ball and a plated contact pad or package metallization such as a lead frame.

Abstract translation: 一种用于向一系列金属化触点或电镀接触焊盘施加焊剂的方法和装置，其通过有孔焊接掩模暴露的衬底采用可压缩转移垫。 在转印垫底表面上形成中心的吸收区域。 底表面可以是球形的，并且可以包括其上传送预定量的助焊剂的圆柱形柱，例如通过将拾取区域浸入半液体糊剂焊剂的储存器中。 然后将转移垫定位在焊接掩模上并在其上压缩，使得转印垫的助焊剂拾取区上的拾取通量被压力通过压接传递垫通过焊接掩模中的孔直接并连续地变成所有 形成在衬底上的一系列凹陷，直到所有凹陷基本上充满助熔剂。 在分离和移除转移垫之后，将焊球或焊接剂施加的焊料沉积在每个含焊剂的凹陷中以在球和镀覆的接触焊盘或封装金属化（例如引线框架）之间形成冶金结合。

公开(公告)号：US5460653A

公开(公告)日：1995-10-24

申请号：US161693

申请日：1993-12-03

Applicant: Hiroshi Otani ,  Naotoshi Fukushima ,  Yoshihisa Yamazaki

Inventor： Hiroshi Otani ,  Naotoshi Fukushima ,  Yoshihisa Yamazaki

IPC: B05B13/04 ,  B23K1/20 ,  H05K3/34 ,  H05K13/04 ,  B05B3/00 ,  B05C11/00

CPC classification number: H05K13/04 ,  B05B13/041 ,  B23K1/203 ,  H05K3/3489 ,  B23K2201/40

Abstract: A device for applying flux to the rear of a printed circuit board loaded with electronic parts on the front thereof and being transported by spraying the flux. The device has a single nozzle which is movable in a reciprocating motion in a direction perpendicular to the moving direction of the circuit board, thereby applying flux to the entire rear surface of the circuit board in a uniform distribution. The range of reciprocation of the nozzle is controlled on the basis of data generated by a sensor which is responsive to the width of the circuit board in transport. A flux feeding device capable of adjusting the amount of flux to be sprayed from the nozzle and a device for preventing the nozzle from being stopped up are associated with the flux applying device.

Abstract translation: 一种用于在其前面装载有电子部件的印刷电路板的后部施加助焊剂并通过喷射助焊剂传输的装置。 该装置具有可沿与电路板的移动方向垂直的方向往复运动的单个喷嘴，从而以均匀的分布向电路板的整个后表面施加通量。 喷嘴的往复运动范围根据传感器产生的数据进行控制，传感器响应于运输中电路板的宽度。 能够调节从喷嘴喷射的焊剂量和用于防止喷嘴堵塞的装置的焊剂供给装置与焊剂施加装置相关联。

公开(公告)号：US5377900A

公开(公告)日：1995-01-03

申请号：US175062

申请日：1993-12-29

Applicant: Ernest E. Bergmann

Inventor： Ernest E. Bergmann

IPC: G02B6/24 ,  B23K1/00 ,  G02B6/42 ,  H01L33/00 ,  H05K13/04 ,  B23K31/02 ,  B23K101/36

CPC classification number: B23K1/0008 ,  B23K2201/40

Abstract: A method of mechanically mating two workpieces when one of the workpieces lacks physically matable surface characteristics. An adaptor is formed through crystallographic etching techniques and is precisely positioned and mounted to the surface of the workpiece lacking physical features in order to provide mechanical points of contact for mating with the other workpiece. Solder points are formed on the surface of the workpiece and the adaptor by photolithographic metalization. The adaptor is then solder bump mounted to the surface of the workpiece for highly precise positioning. The adaptor forms precisely positioned points of contact for mechanical mating with the physical features of the other workpiece.

Abstract translation: 当一个工件缺乏物理上适合的表面特性时，机械地配合两个工件的方法。 通过结晶蚀刻技术形成适配器，并且精确地定位并安装到缺少物理特征的工件的表面上，以便提供用于与另一个工件配合的机械接触点。 通过光刻金属化在工件表面和适配器上形成焊点。 然后将适配器焊接凸块安装到工件的表面以进行高精度定位。 适配器形成精确定位的接触点，用于与其他工件的物理特征进行机械配合。

公开(公告)号：US5372292A

公开(公告)日：1994-12-13

申请号：US31240

申请日：1993-03-12

Applicant: Koji Sato ,  Tetsuya Kobaru

Inventor： Koji Sato ,  Tetsuya Kobaru

IPC: H01L21/60 ,  B23K20/02 ,  H01L21/603

CPC classification number: B23K20/02 ,  B23K2201/40

Abstract: A tape bonding apparatus for bonding leads of a film carrier to bumps of a pellet including a linear cam that moves up and down a bonding stage which carries the pellet. A vertical movement adjustment assembly made up with an eccentric shaft, an adjustment lever and an adjusting screw adjusts the relative amount of vertical movement of the bonding stage with respect to the linear cam. A gap sensor detects the amount of the vertical movement of the bonding stage and shows the distance between the leads and the bumps in a numeric value. Thus, the distance or clearance between the leads and the bumps can be adjusted easily.

Abstract translation: 一种胶带接合装置，用于将胶片载体的引线接合到包括在携带颗粒的接合台上上下移动的直线凸轮的颗粒的凸块。 由偏心轴，调节杆和调节螺钉构成的垂直移动调节组件调节接合台相对于线性凸轮的垂直运动的相对量。 间隙传感器检测接合台的垂直移动量，并以数值表示引线与凸块之间的距离。 因此，可以容易地调整引线与凸块之间的距离或间隙。

公开(公告)号：US5368217A

公开(公告)日：1994-11-29

申请号：US112494

申请日：1993-08-25

Applicant: Richard L. Simmons ,  Michael J. Bertram

Inventor： Richard L. Simmons ,  Michael J. Bertram

IPC: B23K20/02 ,  H01L21/603

CPC classification number: B23K20/02 ,  B23K2201/40 ,  H01L2224/16225

Abstract: A high force flip chip bonding method and system that precisely and forcefully engage a flip chip device with a corresponding wiring pattern on a substrate in a manner that prevents flip chip device and substrate shifting during force application. The method includes the steps of determining the centroid of the pattern formed by the interconnects on the flip chip device. The flip chip device is directed toward the substrate for contacting the corresponding wiring pattern with the interconnects and then the interconnects are compressed into the corresponding wiring pattern using a bonding force. The bonding force is directed along a neutral axis of deflection that is coincident with the centroid. Applying the bonding force along the neutral axis of deflection at the centroid minimizes lateral shifting of the flip chip device relative to the substrate to precisely bond the interconnects to the corresponding wiring pattern.

Abstract translation: 一种大力倒装芯片接合方法和系统，其以在应力施加期间防止倒装芯片器件和衬底移位的方式精确地强制地将倒装芯片器件与衬底上的相应布线图案接合。 该方法包括确定由倒装芯片器件上的互连形成的图案的质心的步骤。 倒装芯片器件被引导到用于使相应布线图案与互连件接触的基板，然后使用结合力将互连件压缩成相应的布线图案。 接合力沿着与质心一致的中立偏转轴线引导。 沿着中心的偏转中性轴施加接合力使倒装芯片器件相对于衬底的横向偏移最小化，以将互连精确地结合到相应的布线图案。