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公开(公告)号：US20140004291A1
公开(公告)日：2014-01-02
申请号：US14016651
申请日：2013-09-03
Inventor： Metin Sitti , Seok Kim
IPC: C09J7/02
CPC classification number: C09J7/00 , A44B18/0049 , B29C33/3842 , B29C33/424 , B29C33/52 , B29C39/34 , B29C39/36 , B29C39/42 , B29L2031/756 , B81B2203/0361 , B81C99/0085 , B81C2201/034 , C09J9/00 , C09J2201/626 , Y10T428/23957 , Y10T428/2933 , Y10T428/2935 , Y10T428/2976
Abstract: A dry adhesive and a method of forming a dry adhesive. The method includes forming an opening through an etch layer and to a barrier layer, expanding the opening in the etch layer at the barrier layer, filling the opening with a material, removing the barrier layer from the material in the opening, and removing the etch layer from the material in the opening.
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公开(公告)号：US08486348B2
公开(公告)日：2013-07-16
申请号：US12914675
申请日：2010-10-28
Applicant: Leon M. Bellan , Harold G. Craighead , Elizabeth A. Strychalski
Inventor： Leon M. Bellan , Harold G. Craighead , Elizabeth A. Strychalski
CPC classification number: B81C1/00071 , B01L3/502707 , B01L3/502761 , B01L2300/0816 , B81B2201/0214 , B81B2201/051 , B81B2203/0338 , B81C2201/034
Abstract: A device is made by forming sacrificial fibers on a substrate mold. The fibers and mold are covered with a first material. The substrate mold is removed, and the covered fibers are then removed to form channels in the first material.
Abstract translation: 通过在基底模具上形成牺牲纤维来制造器件。 纤维和模具被第一材料覆盖。 去除基底模具，然后除去覆盖的纤维以在第一材料中形成通道。
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公开(公告)号：US08394224B2
公开(公告)日：2013-03-12
申请号：US12974404
申请日：2010-12-21
Applicant: Fahhad H. Alharbi , John D. Bass , Ho-Cheol Kim , Robert D. Miller
Inventor： Fahhad H. Alharbi , John D. Bass , Ho-Cheol Kim , Robert D. Miller
CPC classification number: B32B27/00 , B81B2207/056 , B81C1/00357 , B81C2201/034
Abstract: Layered nanostructures are constructed by imprinting material with a mold, while selectively modifying and removing a portion of the mold. The mold, which includes a pattern of features, is modified so that the portion of the mold that includes the features is made chemically and/or physically distinct from the rest of the mold. That portion of the mold that includes the features is retained while the rest of the mold is removed. The retained portion of the mold provides mechanical support for any adjoining layer or layers.
Abstract translation: 层状纳米结构通过用模具压印材料构成，同时选择性地修改和去除模具的一部分。 包括特征图案的模具被改进，使得包括特征的模具部分在化学和/或物理上与模具的其余部分不同。 包括特征的模具的该部分在模具的其余部分被移除的同时被保留。 模具的保留部分为任何相邻的层提供机械支撑。
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公开(公告)号：US20120328834A1
公开(公告)日：2012-12-27
申请号：US13360261
申请日：2012-01-27
Applicant: Marc A. Unger , Hou-Pu Chou , Todd A. Thorsen , Axel Scherer , Stephen R. Quake
Inventor： Marc A. Unger , Hou-Pu Chou , Todd A. Thorsen , Axel Scherer , Stephen R. Quake
IPC: B32B3/00
CPC classification number: B29C51/00 , B01L3/502707 , B01L3/50273 , B01L3/502738 , B01L2300/0861 , B01L2300/0887 , B01L2300/123 , B01L2400/046 , B01L2400/0481 , B01L2400/0655 , B33Y80/00 , B81B5/00 , B81B2201/036 , B81B2201/054 , B81C1/00119 , B81C2201/019 , B81C2201/034 , C12Q1/6874 , F04B43/043 , F15C1/06 , F15C5/00 , F16K11/20 , F16K13/00 , F16K31/126 , F16K99/0001 , F16K99/0015 , F16K99/0046 , F16K99/0048 , F16K99/0051 , F16K99/0059 , F16K2099/0074 , F16K2099/0076 , F16K2099/0078 , F16K2099/008 , F16K2099/0094 , Y10T137/0491 , Y10T137/0497 , Y10T137/2224 , Y10T137/87249 , Y10T156/10 , Y10T428/24479 , Y10T428/24744 , C12Q2535/125
Abstract: A method of fabricating an elastomeric structure, comprising: forming a first elastomeric layer on top of a first micromachined mold, the first micromachined mold having a first raised protrusion which forms a first recess extending along a bottom surface of the first elastomeric layer; forming a second elastomeric layer on top of a second micromachined mold, the second micromachined mold having a second raised protrusion which forms a second recess extending along a bottom surface of the second elastomeric layer; bonding the bottom surface of the second elastomeric layer onto a top surface of the first elastomeric layer such that a control channel forms in the second recess between the first and second elastomeric layers; and positioning the first elastomeric layer on top of a planar substrate such that a flow channel forms in the first recess between the first elastomeric layer and the planar substrate.
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公开(公告)号：US20120152448A1
公开(公告)日：2012-06-21
申请号：US12974404
申请日：2010-12-21
Applicant: FAHHAD H. ALHARBI , JOHN D. BASS , HO-CHEOL KIM , ROBERT D. MILLER
Inventor： FAHHAD H. ALHARBI , JOHN D. BASS , HO-CHEOL KIM , ROBERT D. MILLER
CPC classification number: B32B27/00 , B81B2207/056 , B81C1/00357 , B81C2201/034
Abstract: Layered nanostructures are constructed by imprinting material with a mold, while selectively modifying and removing a portion of the mold. The mold, which includes a pattern of features, is modified so that the portion of the mold that includes the features is made chemically and/or physically distinct from the rest of the mold. That portion of the mold that includes the features is retained while the rest of the mold is removed. The retained portion of the mold provides mechanical support for any adjoining layer or layers.
Abstract translation: 层状纳米结构通过用模具压印材料构成，同时选择性地修改和去除模具的一部分。 包括特征图案的模具被改进，使得包括特征的模具部分在化学和/或物理上与模具的其余部分不同。 包括特征的模具的该部分在模具的其余部分被移除的同时被保留。 模具的保留部分为任何相邻的层提供机械支撑。
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Patent Agency Ranking
公开(公告)号：US20120107194A1
公开(公告)日：2012-05-03
申请号：US12914675
申请日：2010-10-28
Applicant: Leon M. Bellan , Harold G. Craighead , Elizabeth A. Strychalski
Inventor： Leon M. Bellan , Harold G. Craighead , Elizabeth A. Strychalski
CPC classification number: B81C1/00071 , B01L3/502707 , B01L3/502761 , B01L2300/0816 , B81B2201/0214 , B81B2201/051 , B81B2203/0338 , B81C2201/034
Abstract: A device is made by forming sacrificial fibers on a substrate mold. The fibers and mold are covered with a first material. The substrate mold is removed, and the covered fibers are then removed to form channels in the first material.
Abstract translation: 通过在基底模具上形成牺牲纤维来制造器件。 纤维和模具被第一材料覆盖。 去除基底模具，然后除去覆盖的纤维以在第一材料中形成通道。
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公开(公告)号：US20110269131A1
公开(公告)日：2011-11-03
申请号：US13127207
申请日：2009-10-28
Applicant: Daniel T. Chiu , Jason S. Kuo
Inventor： Daniel T. Chiu , Jason S. Kuo
CPC classification number: C12M1/00 , B01L3/502707 , B01L3/502715 , B01L3/502723 , B01L3/502753 , B01L2200/027 , B01L2200/0689 , B01L2300/0681 , B01L2300/12 , B01L2400/0418 , B01L2400/0421 , B01L2400/0487 , B01L2400/086 , B29C33/44 , B29C65/08 , B29C65/14 , B29C65/1403 , B29C65/1406 , B29C65/1409 , B29C65/1412 , B29C66/028 , B29C66/1122 , B29C66/5346 , B29C66/71 , B29C66/73151 , B29C66/73365 , B29C66/73751 , B29C66/7392 , B29C66/73921 , B29C66/7394 , B29C66/81267 , B29C66/82661 , B29C2791/006 , B29K2075/00 , B29K2995/0025 , B29K2995/0027 , B29K2995/007 , B29L2031/756 , B81B2201/051 , B81C1/00119 , B81C2201/019 , B81C2201/034 , B29K2033/12
Abstract: Embodiments of the present invention relate to a UV-curable polyurethane-methacrylate (PUMA) substrate for manufacturing microfluidic devices. PUMA is optically transparent, biocompatible, and has stable surface properties. Embodiments include two production processes that are compatible with the existing methods of rapid prototyping, and characterizations of the resultant PUMA microfluidic devices are presented. Embodiments of the present invention also relate to strategies to improve the production yield of chips manufactured from PUMA resin, especially for microfluidic systems that contain dense and high-aspect-ratio features. Described is a mold-releasing procedure that minimizes motion in the shear plane of the microstructures. Also presented are simple yet scalable able methods for forming seals between PUMA substrates, which avoids excessive compressive force that may crush delicate structures. Two methods for forming interconnects with PUMA microfluidic devices are detailed. These improvements produce a microfiltration device containing closely spaced and high-aspect-ratio fins, suitable for retaining and concentrating cells or beads from a highly diluted suspension.
Abstract translation: 本发明的实施方案涉及用于制造微流体装置的可UV固化的聚氨酯 - 甲基丙烯酸酯（PUMA）基材。 PUMA是光学透明的，生物相容的，并且具有稳定的表面性质。 实施例包括与现有快速成型方法兼容的两个生产方法，并且显示所得PUMA微流体装置的特性。 本发明的实施方案还涉及提高由PUMA树脂制造的芯片的生产成本的策略，特别是对于含有密集和高纵横比特征的微流体系统。 描述了使微结构的剪切平面中的运动最小化的脱模程序。 还提出了用于在PUMA基材之间形成密封的简单且可扩展的方法，其避免了可能破坏微细结构的过大的压缩力。 详细说明了与PUMA微流体装置形成互连的两种方法。 这些改进产生了包含紧密间隔和高纵横比的翅片的微滤装置，适用于从高度稀释的悬浮液中保留和浓缩细胞或珠粒。
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48.发明授权Device containing cytophilic islands that adhere cells separated by cytophobic regions 失效包含细胞吸附岛的装置，其附着由细胞疏植区域分离的细胞公开(公告)号：US07993905B2
公开(公告)日：2011-08-09
申请号：US12166287
申请日：2008-07-01
Applicant: Rahul Singhvi , Amit Kumar , George M. Whitesides , Donald E. Ingber , Gabriel P. Lopez , Daniel I. C. Wang , Gregory Stephanopoulos
Inventor： Rahul Singhvi , Amit Kumar , George M. Whitesides , Donald E. Ingber , Gabriel P. Lopez , Daniel I. C. Wang , Gregory Stephanopoulos
CPC classification number: C12N1/00 , B01J19/0046 , B01J2219/00382 , B01J2219/00385 , B01J2219/00585 , B01J2219/00596 , B01J2219/00605 , B01J2219/0061 , B01J2219/00612 , B01J2219/00617 , B01J2219/00619 , B01J2219/00621 , B01J2219/00626 , B01J2219/0063 , B01J2219/00637 , B01J2219/00659 , B01J2219/0072 , B81B2201/0214 , B81C1/00206 , B81C2201/034 , B82Y5/00 , B82Y30/00 , C12N5/0068 , C12N5/067 , C12N2535/10 , C12Q1/02 , C40B60/14
Abstract: The invention provides a device for adhering cells in a specific and predetermined position, and associated methods. The device includes a plate defining a surface and a plurality of cytophilic islands that adhere cells, isolated by cytophobic regions to which cells do not adhere, contiguous with the cytophilic islands. The islands or the regions or both may be formed of a self-assembled monolayer (SAM).
Abstract translation: 本发明提供一种用于将细胞粘附在特定和预定位置的装置以及相关方法。 该装置包括限定表面的板和多个细胞亲和岛，其附着细胞，由细胞不粘附的细胞渗透区隔离，与细胞色素岛邻接。 岛或区域或两者可以由自组装单层（SAM）形成。
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公开(公告)号：US20100230290A1
公开(公告)日：2010-09-16
申请号：US12723147
申请日：2010-03-12
Applicant: Pierre Cusin , Clare Golfier , Jean-Philippe Thiebaud
Inventor： Pierre Cusin , Clare Golfier , Jean-Philippe Thiebaud
CPC classification number: C25D1/10 , B29C33/3842 , B81C99/009 , B81C2201/034
Abstract: The invention relates to a method (3) of fabricating a mould (39, 39′) including the following steps: a) depositing (9) an electrically conductive layer on the top (20) and bottom (22) of a wafer (21) made of silicon-based material; b) securing (13) said wafer to a substrate (23) using an adhesive layer; c) removing (15) one part (26) of said conductive layer from the top of the wafer (21); d) etching (17) said wafer as far as the bottom conductive layer (22) thereof in the shape (26) of said part removed from the top conductive layer (22) to form at least one cavity (25) in said mould. The invention concerns the field of micromechanical parts, particularly for timepiece movements.
Abstract translation: 本发明涉及一种制造模具（39,39'）的方法（3），包括以下步骤：a）在晶片（21）的顶部（20）和底部（22）上沉积（9）导电层 ）由硅基材料制成; b）使用粘合剂层将所述晶片固定（13）到基底（23）上; c）从晶片（21）的顶部去除（15）所述导电层的一部分（26）; d）将所述晶片刻蚀（17）所述晶片至所述部分的形状（26）的底部导电层（22）从顶部导电层（22）去除，以在所述模具中形成至少一个空腔（25）。 本发明涉及微机械部件领域，特别是用于钟表运动。
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公开(公告)号：US07767135B2
公开(公告)日：2010-08-03
申请号：US11975414
申请日：2007-10-19
Applicant: Diane Kimberlie Guilfoyle , Paul John Shustack , Lung-Ming Wu
Inventor： Diane Kimberlie Guilfoyle , Paul John Shustack , Lung-Ming Wu
CPC classification number: C03C17/28 , B81B2201/058 , B81C1/00071 , B81C2201/034 , C03B19/06 , C03C11/00 , C03C17/04 , C03C17/324 , C03C23/0005
Abstract: Disclosed is a method of forming a structured sintered article including providing a mixture comprising a sinterable particulate material and a binder, the binder comprising, as a function of total resin content of the binder, at least 50% by weight of a thermoplastic binder material and at least 5% by weight of a radiation-curable binder material; shaping the mixture with a mold to form a structure; setting the structure by cooling the structure or by allowing the structure to cool; separating the structure from the mold; irradiating the structure so as to at least partially cure the radiation-curable binder material, and debinding and sintering the structure so as to form a structured sintered article. Shaping may include forming a structure having one or more open channels, and sintering may include sintering in together in contact with at least one additional structure so as to cover or enclose the channels.
Abstract translation: 公开了一种形成结构化烧结制品的方法，包括提供包含可烧结颗粒材料和粘合剂的混合物，所述粘合剂包含作为粘合剂的总树脂含量的函数，至少50重量％的热塑性粘合剂材料和 至少5重量％的可辐射固化粘合剂材料; 用模具成型混合物以形成结构; 通过冷却结构或通过使结构冷却来设定结构; 将结构与模具分离; 照射该结构以至少部分地固化可辐射固化的粘合剂材料，以及脱结和烧结该结构以便形成结构化的烧结制品。 成形可以包括形成具有一个或多个开放通道的结构，并且烧结可以包括与至少一个附加结构接触在一起的烧结以覆盖或封闭通道。
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