公开(公告)号：US20240026198A1

公开(公告)日：2024-01-25

申请号：US18266099

申请日：2021-12-17

Applicant: DENKA COMPANY LIMITED

Inventor： Kosuke WADA ,  Kiyotaka FUJI

IPC: C09K5/00 ,  C01B21/064 ,  C08K3/38 ,  C08J5/18 ,  C08J3/20

CPC classification number: C09K5/00 ,  C01B21/064 ,  C08K3/38 ,  C08J5/18 ,  C08J3/203 ,  C01P2004/51 ,  C01P2006/21 ,  C01P2004/50 ,  C01P2004/62 ,  C01P2004/61 ,  C01P2002/76 ,  C01P2006/32 ,  C08K2201/001 ,  C08K2003/385 ,  C08K2201/005 ,  C08J2383/04

Abstract: A boron nitride powder, containing at least an aggregated boron nitride particle formed by an aggregation of hexagonal boron nitride primary particles, the powder having a particle size distribution including at least a first maximum point, a second maximum point at which a particle size is larger than at the first maximum point, and a third maximum point at which a particle size is larger than at the second maximum point. The heat dissipation sheet is obtained by molding a heat conductive resin composition containing the boron nitride powder and a resin. The method for producing a heat dissipation sheet includes blending the boron nitride powder and a resin to prepare a heat conductive resin composition, molding the heat conductive resin composition into a sheet shape to prepare a heat conductive resin composition sheet, and heating and pressurizing the heat conductive resin composition sheet under a vacuum.

公开(公告)号：US11881337B2

公开(公告)日：2024-01-23

申请号：US17295943

申请日：2018-11-23

Applicant: Littelfuse Electronics (Shanghai) Co., Ltd.

Inventor： Jianhua Chen ,  Chun-Kwan Tsang ,  Zhiyong Zhou ,  Yingsong Fu ,  Edward W. Rutter, Jr.

IPC: H01C7/02 ,  C08J5/18 ,  C08K3/14 ,  C08L23/06 ,  C08L63/00 ,  C08L27/16 ,  C08L77/02

CPC classification number: H01C7/027 ,  C08J5/18 ,  C08K3/14 ,  C08L23/06 ,  C08L63/00 ,  H01C7/021 ,  C08K2201/001 ,  C08L27/16 ,  C08L77/02 ,  C08L2205/035 ,  C08L2207/066

Abstract: A novel polymer positive temperature coefficient (PPTC) material, device, and method of fabrication. One example of polymer positive temperature coefficient (PPTC) includes a polymer matrix, the polymer matrix comprising a first polymer. The PPTC material may further include a conductive filler, disposed in the polymer matrix; and at least one polymer filler, dispersed within the polymer matrix. The at least one polymer filler may comprise a second polymer, different from the first polymer, wherein the at least one polymer comprises a first melting temperature, and wherein the second polymer comprises a second melting temperature, the second melting temperature exceeding the first melting temperature by at least 20 C.

公开(公告)号：US20230407075A1

公开(公告)日：2023-12-21

申请号：US18456660

申请日：2023-08-28

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Naiyong Jing ,  Cheng Gu ,  Klaus Hintzer ,  Tho Q. Nguyen ,  Peter J. Scott ,  Cheng Li ,  Zai-Ming Qiu ,  Yong Wu

IPC: C08L27/18 ,  C08K3/36 ,  H01B3/44

CPC classification number: C08L27/18 ,  C08K3/36 ,  H01B3/445 ,  C08K2201/001 ,  C08L2203/206 ,  C08L2312/06

Abstract: Electronic telecommunication articles are described comprising a crosslinked fluoropolymer layer. In typical embodiments, the crosslinked fluoropolymer layer is a substrate, patterned (e.g. photoresist) layer, insulating layer, passivation layer, cladding, protective layer, or a combination thereof. Also describes are methods of making an electronic telecommunications article and method of forming a patterned fluoropolymer layer. The fluoropolymer preferably comprises at least 80, 85, or 90% by weight of polymerized units of perfluorinated monomers and cure sites selected from nitrile, iodine, bromine, and chlorine. Illustrative electronic communication articles include integrated circuits, printed circuit boards, antennas, and optical fiber cables. Fluoropolymer compositions are also described.

公开(公告)号：US20230399487A1

公开(公告)日：2023-12-14

申请号：US18204602

申请日：2023-06-01

Applicant: University of Florida Research Foundation, Inc.

Inventor： Andrew Gabriel Rinzler ,  Svetlana Viktorovna Vasilyeva ,  Maxime Gregory Lemaitre ,  Yunxi Liu ,  Alexander Joseph Schachtner ,  Christopher Calvert Samouce

IPC: C08K3/04 ,  C08J3/03 ,  C08J5/18

CPC classification number: C08K3/041 ,  C08J3/03 ,  C08J5/18 ,  C08J2301/02 ,  C08K2201/001

Abstract: Various examples are provided related to self-assembled carbon nanotube (CNT) films. In one example, a method includes providing a CNT dispersion solution including an aqueous solution comprising a quantity of amphiphilic pendant polymer dispersant; and a plurality of carbon nanotubes in the aqueous solution, the pendant polymer dispersant enabling CNT self-assembly. The method further includes forming a self-assembled CNT film on a surface of a substrate using the CNT dispersion solution.

公开(公告)号：US11827741B2

公开(公告)日：2023-11-28

申请号：US17546294

申请日：2021-12-09

Applicant: Samsung Electronics Co., Ltd.

Inventor： Changho Noh ,  Insu Lee ,  Songwon Hyun ,  Yoonseok Ko ,  Mijeong Kim ,  Keechang Lee ,  Sangsoo Jee

IPC: C08G59/24 ,  C08K3/013 ,  C08G59/62 ,  C08L63/00

CPC classification number: C08G59/245 ,  C08G59/621 ,  C08K3/013 ,  C08L63/00 ,  C08G2170/00 ,  C08G2190/00 ,  C08K2201/001 ,  C08L2203/206

Abstract: An epoxy compound having an aromatic ring represented by Formula 1 or Formula 2, a composition prepared from the epoxy compound, a semiconductor device prepared from the epoxy compound, an electronic device prepared from the epoxy compound, an article prepared from the epoxy compound, and a method of preparing the epoxy compound:

E1-(M1)a1-(L1)b1-(M2)a2-L2-A1-L3-(M3)a3-(L4)b2-(M4)a4-E2  Formula 1

E3-(A2)c1-(L5)b3-(M5)a5-L6-(M6)a6-L7-(M7)a7-(L8)b4-(A3)c2-E4  Formula 2

In Formulae 1 and 2, M1, M2, M3, M4, M5, M6, M7, A1, A2, A3, L1, L2, L3, L4, L5, L6, L7, L8, E1, E2, E3, E4, a1, a2, a3, a4, a5, a6, a7, b1, b2, b3, b4, c1, and c2 are the same as defined in the detailed description.

公开(公告)号：US11817584B2

公开(公告)日：2023-11-14

申请号：US16964313

申请日：2019-01-21

Applicant: IPI TECH INC.

Inventor： Seung Wan Song ,  Hieu Quang Pham ,  Hyun Min Jung

IPC: H01M4/62 ,  C08K3/11 ,  C08G73/10 ,  C08K3/04 ,  C08K3/22 ,  H01M4/505 ,  H01M4/525 ,  H01M10/0525 ,  H01M4/02

CPC classification number: H01M4/622 ,  C08G73/1067 ,  C08K3/04 ,  C08K3/11 ,  C08K3/22 ,  H01M4/505 ,  H01M4/525 ,  H01M10/0525 ,  C08K2003/2203 ,  C08K2003/2262 ,  C08K2003/2289 ,  C08K2003/2293 ,  C08K2201/001 ,  C08K2201/003 ,  H01M2004/028

Abstract: The present invention relates to a binder for a lithium secondary battery, an electrode comprising the same, and a lithium secondary battery comprising the electrode. More specifically, the present invention provides a binder for a lithium secondary battery having excellent cycle life and high energy density, an anode for a lithium secondary battery comprising the same, and a lithium secondary battery prepared therefrom.

公开(公告)号：US20230360820A1

公开(公告)日：2023-11-09

申请号：US18022883

申请日：2021-09-15

Applicant: Mitsui Mining & Smelting Co., Ltd.

Inventor： Kentaro OCHI

IPC: B22F1/054 ,  C25C1/20 ,  C08K3/08 ,  H01B1/22 ,  B22F1/10

CPC classification number: H01B1/22 ,  B22F1/0553 ,  B22F1/056 ,  B22F1/10 ,  C08K3/08 ,  C25C1/20 ,  B22F2301/255 ,  B22F2304/054 ,  B22F2999/00 ,  C08K2003/0806 ,  C08K2201/001 ,  C08K2201/003 ,  C08K2201/011

Abstract: A silver powder containing dendrite silver particles is provided. The dendrite silver particles are in a dendrite shape having one trunk and a plurality of branches branching from the trunk. The thickness of the trunk of the dendrite silver particles is from 10 to 280 nm. The number of the branches per length of the trunk is from 6 to 30 branches/µm. The percentage by number of the dendrite silver particles in the whole of silver particles is 50 N% or more. This silver powder is produced by reducing silver ions through electrolysis of an electrolyte solution containing silver ions and hydantoin or a derivative thereof.

公开(公告)号：US11809126B2

公开(公告)日：2023-11-07

申请号：US17582008

申请日：2022-01-24

Applicant: FUJIFILM Business Innovation Corp.

Inventor： Yasuhiko Kinuta ,  Yuki Tagawa ,  Ken Ozaki ,  Noboru Hirakawa

IPC: G03G15/02 ,  G03G21/18 ,  G03G5/047 ,  G03G5/147 ,  C08K3/04 ,  C08L15/02 ,  C08K3/013

CPC classification number: G03G21/1814 ,  C08K3/04 ,  C08L15/02 ,  G03G5/047 ,  G03G5/147 ,  C08K3/013 ,  C08K2201/001

Abstract: A charging member includes a conductive base material; an elastic layer that is provided on the conductive base material and has a storage elastic modulus G of 5.0 MPa or less at 100 Hz; and a surface layer that is provided on the elastic layer, in which in a Cole-Cole plot obtained by measuring the charging member in a range of 1 MHz to 0.1 Hz by an alternating current impedance method, a resistance component Ra of a capacitive semicircle including 2.5 kHz is 6.3×104Ω or less.

公开(公告)号：US20230348679A1

公开(公告)日：2023-11-02

申请号：US18025687

申请日：2021-08-06

Applicant: DEXERIALS CORPORATION

Inventor： Keisuke ARAMAKI ,  Yuma SATO ,  Yusuke KUBO

IPC: C08K9/02 ,  C08K7/18 ,  C08J5/18

CPC classification number: C08J5/18 ,  C08K7/18 ,  C08K9/02 ,  C08J2383/04 ,  C08K2201/001 ,  C08K2201/013

Abstract: A thermally conductive sheet includes: a binder resin; and a first thermally conductive filler oriented in a thickness direction of the thermally conductive sheet. The thermally conductive sheet has a contact thermal resistance with regard to an adherend of 0.46° C.·cm2/W or less. The first thermally conductive filler is preferably a fibrous thermally conductive filler and/or a flaky thermally conductive filler. The thermally conductive sheet preferably further includes a second thermally conductive filler which is at least one selected from a group consisting of alumina, aluminum, zinc oxide, boron nitride, aluminum nitride, graphite, and a magnetic powder.

公开(公告)号：US20230340258A1

公开(公告)日：2023-10-26

申请号：US18016992

申请日：2021-07-16

Applicant: MEP EUROPE B.V.

Inventor： Bernardus Antonius Gerardus SCHRAUWEN

IPC: C08L69/00 ,  C08K7/18

CPC classification number: C08L69/00 ,  C08K7/18 ,  C08K2201/001 ,  C08L2203/20 ,  C08L2201/02 ,  C08K2201/014

Abstract: The invention relates to a thermoplastic composition comprising: a) 20 to 90 wt % of a thermoplastic resin, b) a laser direct structuring additive, c) optionally ceramic filler particles which do not have a laser direct structuring additive function and d) 0.1 to 5.0 wt % of an acid-modified polymer, wherein b) comprises b1) a conductive metal oxide, wherein the conductive oxide has a resistivity of at most 5×103 Ω·cm and contains at least a metal of Group n of the periodic table and a metal of Group n+1, wherein n is an integer of 3 to 13, and/or b2) calcium copper titanate.