公开(公告)号：US20060199003A1

公开(公告)日：2006-09-07

申请号：US11070454

申请日：2005-03-02

Applicant: Russell Cain ,  Bliss Carkhuff ,  Andrew Lennon ,  Micah Carlson

Inventor： Russell Cain ,  Bliss Carkhuff ,  Andrew Lennon ,  Micah Carlson

IPC: G01K1/00 ,  B32B7/12

CPC classification number: G01K3/14 ,  C09J7/29 ,  C09J2201/602 ,  C09J2400/163 ,  G01K3/005 ,  G01K11/06 ,  G01K2007/166 ,  Y10T428/28

Abstract: An apparatus for monitoring a temperature of a structure, comprising: one or more electrically conductive loops adapted to be affixed to the structure, each including first and second elongate connection strips each made of a first metal composition having a first melting point, and a temperature sensitive band connected between the first and second connection strips and made of a second metal composition having a second melting point less than the first melting point. The apparatus further comprises a monitor, connected to respective ends of the first and second connection strips spaced-apart from the temperature sensitive band, configured to detect an open-circuit in the one or more electrically conductive loops caused when the temperature sensitive band separates from either of the connection strips.

Abstract translation: 一种用于监测结构的温度的装置，包括：一个或多个导电环，其适于固定到所述结构上，每个导电环包括第一和第二细长连接条，每个细长连接条由具有第一熔点的第一金属组合物和温度 敏感带连接在第一和第二连接条之间并且由具有小于第一熔点的第二熔点的第二金属组合物制成。 该装置还包括监测器，连接到与温度敏感带间隔开的第一和第二连接条的相应端部，被配置为检测当温度敏感带分离时导致的一个或多个导电环路中的开路 任一个连接条。

公开(公告)号：US06994141B2

公开(公告)日：2006-02-07

申请号：US10338319

申请日：2003-01-08

Applicant: Icko E. T. Iben

Inventor： Icko E. T. Iben

IPC: B32B31/26 ,  G11G5/40

CPC classification number: B29C65/342 ,  B29C66/91214 ,  B29C66/91221 ,  B29C66/91317 ,  B29C66/91411 ,  B29C66/91641 ,  B29C66/91655 ,  B29C66/961 ,  B29C73/00 ,  C09J5/06 ,  C09J2201/602 ,  B29C65/00

Abstract: A process, apparatus, and system are presented for adhesive bond strength recovery in a bonded system, which may be an electronic device, such as, a magnetic drive or magnetic disk drive. The adhesive bond strength of an adhesive bonding material degrades over time and under certain ambient conditions, such as humidity. The process, apparatus, and system are designed to recover at least a portion of the initial adhesive bond strength through the application of joule heating. The adhesive bonding material, and possibly the materials bonded by the adhesive bonding material, is heated via an embedded heat source within the bonded system. The embedded heat source receives electric power from a controlled power source that selectively applies power to achieve optimum heating and adhesive bond strength recovery consistent with a characterization of the bonded system, heat source, and adhesive bonding material.

Abstract translation: 本发明提出了一种粘合系统中的粘合剂粘结强度恢复方法，装置和系统，其可以是诸如磁驱动器或磁盘驱动器的电子装置。 粘合剂粘合材料的粘合强度随着时间和某些环境条件如湿度而降低。 工艺，设备和系统被设计成通过应用焦耳加热来恢复初始粘合剂粘合强度的至少一部分。 粘合剂粘合材料以及可能由粘合剂粘合材料粘合的材料通过嵌入式热源在粘合体系内被加热。 嵌入式热源从受控电源接收电力，该电源选择性地施加电力以实现与粘合系统，热源和粘合剂粘合材料的表征一致的最佳加热和粘合剂粘合强度恢复。

公开(公告)号：US06926956B2

公开(公告)日：2005-08-09

申请号：US10631561

申请日：2003-07-31

Applicant: Isao Inoue ,  Hiroko Takamori ,  Masumi Hyakutome ,  Kazuhito Fujii ,  Hideki Imamura

Inventor： Isao Inoue ,  Hiroko Takamori ,  Masumi Hyakutome ,  Kazuhito Fujii ,  Hideki Imamura

IPC: C09J7/02 ,  C09J9/02 ,  B32B5/16 ,  B32B15/04 ,  B32B7/12

CPC classification number: C09J9/02 ,  C09J7/22 ,  C09J7/29 ,  C09J7/35 ,  C09J2201/162 ,  C09J2201/602 ,  C09J2423/006 ,  C09J2453/006 ,  Y10T428/25 ,  Y10T428/252 ,  Y10T428/256 ,  Y10T428/28 ,  Y10T428/2813 ,  Y10T428/2817 ,  Y10T428/2826 ,  Y10T428/2843 ,  Y10T428/2848 ,  Y10T428/2852 ,  Y10T428/2857 ,  Y10T428/31587 ,  Y10T428/31797 ,  Y10T428/31855 ,  Y10T428/31917 ,  Y10T428/3192 ,  Y10T428/31924 ,  Y10T428/31928 ,  Y10T428/31931

Abstract: The present invention has a main object to provide a transparent conductive heat sealing material of which antistatic property does not deteriorates even at a low humidity, and has a transparency to an extent of permitting visual recognition of the contents and a carrier tape lid using the same. To achieve this object, the transparent conductive heat sealing material of the invention is characterized by a heat-sealable synthetic resin, and conductive fine particle having a 50% particle size of up to 1.0 μm.

Abstract translation: 本发明的主要目的是提供即使在低湿度下抗静电性也不劣化的透明导电热封材料，并且具有允许内容物视觉识别的程度的透明度和使用其的载带盖 。 为了达到这个目的，本发明的透明导电热封材料的特征在于可热封的合成树脂，具有至多1.0μm的50％粒径的导电细粒。

公开(公告)号：US06890617B1

公开(公告)日：2005-05-10

申请号：US10181020

申请日：2000-08-18

Applicant: Miho Yamaguchi ,  Yuji Hotta

Inventor： Miho Yamaguchi ,  Yuji Hotta

IPC: C09J7/00 ,  C09J7/02 ,  H01L21/56 ,  H01L21/60 ,  H01L23/14 ,  H01L23/31 ,  H01R4/04 ,  B32B3/10

CPC classification number: H01R4/04 ,  C09J7/10 ,  C09J7/22 ,  C09J7/35 ,  C09J2201/602 ,  C09J2203/326 ,  H01L21/563 ,  H01L23/145 ,  H01L23/3114 ,  H01L24/11 ,  H01L24/12 ,  H01L24/28 ,  H01L24/83 ,  H01L24/94 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/1148 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/274 ,  H01L2224/27438 ,  H01L2224/2919 ,  H01L2224/73203 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/12042 ,  H01L2924/12044 ,  Y10S428/901 ,  Y10T428/24273 ,  Y10T428/249953 ,  Y10T428/249982 ,  Y10T428/249983 ,  Y10T428/249984 ,  Y10T428/28 ,  Y10T428/2852 ,  H01L2924/00

Abstract: A porous adhesive sheet 1 having plural through holes 2 running in about parallel with each other in the thickness direction A of an adhesive organic film 3, wherein the through holes have about congruent sections in the diameter direction from one opening 2a to the other opening 2b and a production method thereof, and a semiconductor wafer with a porous adhesive sheet 31, which includes a semiconductor wafer 32 having an electrode 33, the porous adhesive sheet 1 adhered to the semiconductor wafer, and a conductive part 34 formed by filling a through hole 2 located on the electrode 33 with a conductive material, and a production method thereof are provided.

Abstract translation: 一种多孔粘合片1，其具有在粘合有机膜3的厚度方向A上彼此大致平行的多个通孔2，其中，所述通孔具有从一个开口2a到另一个开口的直径方向上的大致相等的部分 2b及其制造方法，以及具有多孔粘合片31的半导体晶片，其包括具有电极33的半导体晶片32，粘附到半导体晶片的多孔粘合片1和通过填充 设置有导电材料的电极33上的通孔2及其制造方法。

公开(公告)号：US20040206943A1

公开(公告)日：2004-10-21

申请号：US10844307

申请日：2004-05-12

Applicant: Sony Chemicals Corporation

Inventor： Masao Saito ,  Osamu Takamatsu ,  Takayuki Matsushima

IPC: H01B001/00

CPC classification number: H05K3/323 ,  C08F290/062 ,  C08L71/12 ,  C08L2205/02 ,  C08L2312/00 ,  C08L2666/02 ,  C09J4/00 ,  C09J7/10 ,  C09J9/02 ,  C09J11/08 ,  C09J133/068 ,  C09J163/10 ,  C09J2201/602 ,  C09J2463/00 ,  H01L21/6835 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/16 ,  H01L2224/2919 ,  H01L2224/83101 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/07811 ,  H05K2201/0239 ,  Y10T428/14 ,  Y10T428/1462 ,  Y10T428/31935 ,  C08F220/32 ,  H01L2924/00 ,  H01L2924/3512

Abstract: An insulating adhesive film and an anisotropically electroconductive adhesive film satisfying low-temperature curability, high adhesion and high reliability are provided. An anisotropically electroconductive adhesive film of the present invention is so configured that electroconductive particles 7 are dispersed in an insulating adhesive resin 6, comprising as main components: a radical polymerizable resin component having an unsaturated double bond; a resin component having no unsaturated double bond; a phosphoric acid-containing resin component; and a radical polymerization initiator.

Abstract translation: 提供了一种满足低温固化性，高粘合性和高可靠性的绝缘粘合膜和各向异性导电粘合剂膜。 本发明的各向异性导电粘合剂膜是这样构成的，其中导电颗粒7分散在绝缘粘合树脂6中，其包括作为主要成分的具有不饱和双键的自由基聚合性树脂组分; 不具有不饱和双键的树脂组分; 含磷酸树脂组分; 和自由基聚合引发剂。

公开(公告)号：US20040062919A1

公开(公告)日：2004-04-01

申请号：US10362957

申请日：2003-08-25

Inventor： Berndt Kuchenmeister ,  Erwin Vahle

IPC: B32B007/02

CPC classification number: E04B1/76 ,  B32B27/32 ,  C09J7/29 ,  C09J2201/602 ,  C09J2400/163 ,  C09J2423/006 ,  E04B1/625 ,  E04B2001/925 ,  E04D12/002 ,  Y10T428/24967

Abstract: The invention relates to a heat reflective film for the construction industry, comprising a base film containing polyurethane, characterized in that the base film is damped on both sides with a metallization coating. The heat-reflective film can be diffusion open or diffusion closed.

Abstract translation: 本发明涉及一种用于建筑行业的热反射膜，其包括含有聚氨酯的基膜，其特征在于，所述基膜在金属化涂层的两侧被阻尼。 热反射膜可以扩散开放或扩散封闭。

公开(公告)号：US20030017328A1

公开(公告)日：2003-01-23

申请号：US09980803

申请日：2001-12-03

Inventor： Isao Inoue ,  Hiroko Takamori ,  Masumi Hyakutome ,  Kazuhito Fujii ,  Hideki Imamura

IPC: B32B005/16 ,  B32B027/08

CPC classification number: C09J9/02 ,  C09J7/22 ,  C09J7/29 ,  C09J7/35 ,  C09J2201/162 ,  C09J2201/602 ,  C09J2423/006 ,  C09J2453/006 ,  Y10T428/25 ,  Y10T428/252 ,  Y10T428/256 ,  Y10T428/28 ,  Y10T428/2813 ,  Y10T428/2817 ,  Y10T428/2826 ,  Y10T428/2843 ,  Y10T428/2848 ,  Y10T428/2852 ,  Y10T428/2857 ,  Y10T428/31587 ,  Y10T428/31797 ,  Y10T428/31855 ,  Y10T428/31917 ,  Y10T428/3192 ,  Y10T428/31924 ,  Y10T428/31928 ,  Y10T428/31931

Abstract: The present invention has a main object to provide a transparent conductive heat sealing material of which antistatic property does not deteriorates even at a low humidity, and has a transparency to an extent of permitting visual recognition of the contents and a carrier tape lid using the same. To achieve this object, the transparent conductive heat sealing material of the invention is characterized by a heat-sealable synthetic resin, and conductive fine particle having a 50% particle size of up to 1.0 nullm.

Abstract translation: 本发明的主要目的是提供即使在低湿度下抗静电性也不劣化的透明导电热封材料，并且具有允许内容物视觉识别的程度的透明度和使用其的载带盖 。 为了达到这个目的，本发明的透明导电热封材料的特征在于可热封的合成树脂，具有至多1.0μm的50％粒径的导电细粒。

公开(公告)号：US20180273808A1

公开(公告)日：2018-09-27

申请号：US15763408

申请日：2016-09-28

Applicant: NITTO DENKO CORPORATION

Inventor： Nao Kamakura ,  Yuki Sugo

IPC: C09J7/28 ,  C09J7/24 ,  C09J7/25 ,  C09J9/02 ,  C09J11/04 ,  H01L21/683 ,  H01L23/00

CPC classification number: C09J7/28 ,  B32B9/00 ,  C08K3/08 ,  C08K3/10 ,  C08K2003/0806 ,  C08K2003/085 ,  C08K2003/2248 ,  C08K2003/2286 ,  C08K2201/001 ,  C09J1/00 ,  C09J7/00 ,  C09J7/10 ,  C09J7/20 ,  C09J7/24 ,  C09J7/25 ,  C09J9/02 ,  C09J11/04 ,  C09J2201/602 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2400/16 ,  C09J2433/00 ,  C09J2469/00 ,  H01L21/52 ,  H01L21/6836 ,  H01L24/29 ,  H01L24/73 ,  H01L24/83 ,  H01L2221/68327 ,  H01L2224/27 ,  H01L2224/29239 ,  H01L2224/29247 ,  H01L2224/29286 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/8384 ,  H01L2924/10253 ,  H01L2924/10272 ,  H01L2924/1033 ,  H01L2924/181 ,  H01L2924/00012

Abstract: A problem is to provide a sheet having a pre-sintering layer, the thickness of which following sintering is such as to be capable of relieving stresses. Solution means relate to a sheet comprising a pre-sintering layer. Viscosity at 90° C. of the pre-sintering layer is not less than 0.27 MPa·s. Thickness of the pre-sintering layer is 30 μm to 200 μm.

公开(公告)号：US20180194920A1

公开(公告)日：2018-07-12

申请号：US15915608

申请日：2018-03-08

Applicant: Lintec of America, Inc.

Inventor： Marcio D. Lima ,  Kanzan Inoue

IPC: C08K3/04 ,  C08K3/08 ,  C08J7/04 ,  C08J5/04

CPC classification number: C08K3/041 ,  B32B5/02 ,  B32B5/12 ,  B32B7/06 ,  B32B7/12 ,  B32B9/007 ,  B32B9/043 ,  B32B15/14 ,  B32B17/10788 ,  B32B17/10889 ,  B32B27/30 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2307/202 ,  B32B2307/732 ,  B32B2307/748 ,  B32B2311/18 ,  B82Y40/00 ,  C08J5/042 ,  C08J5/18 ,  C08J7/047 ,  C08J2383/04 ,  C08J2483/04 ,  C08K3/04 ,  C08K3/042 ,  C08K3/045 ,  C08K3/08 ,  C08K7/06 ,  C08K2003/0831 ,  C08K2003/0881 ,  C08K2201/011 ,  C08L23/0853 ,  C08L29/14 ,  C09J7/22 ,  C09J7/38 ,  C09J9/02 ,  C09J201/02 ,  C09J2201/16 ,  C09J2201/602 ,  C09J2201/606 ,  C09J2205/10 ,  C09J2205/102

Abstract: A flexible sheet comprising a composite sheet, the composite sheet comprising a binder and an aggregate containing a plurality of carbon nanotubes that is disposed in the binder, wherein the aggregate is formed as a waveform structure travelling along a single direction in a plane of the composite sheet, is provided. The disclosed flexible sheets may be used as thermally conductive components, electrically conductive components, antistatic components, electromagnetic wave shields, and/or heating elements, in addition to other possible uses.

公开(公告)号：US20180194102A1

公开(公告)日：2018-07-12

申请号：US15916802

申请日：2018-03-09

Applicant: Lintec of America, Inc.

Inventor： Marcio D. Lima ,  Julia Bykova ,  Takahiro Ueda

IPC: B32B5/12 ,  B32B7/06 ,  B32B7/12 ,  B32B15/14 ,  C09J9/02 ,  C09J201/02

CPC classification number: C08K3/041 ,  B32B5/02 ,  B32B5/12 ,  B32B7/06 ,  B32B7/12 ,  B32B9/007 ,  B32B9/043 ,  B32B15/14 ,  B32B17/10788 ,  B32B17/10889 ,  B32B27/30 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2307/202 ,  B32B2307/732 ,  B32B2307/748 ,  B32B2311/18 ,  B82Y40/00 ,  C08J5/042 ,  C08J5/18 ,  C08J7/047 ,  C08J2383/04 ,  C08J2483/04 ,  C08K3/04 ,  C08K3/042 ,  C08K3/045 ,  C08K3/08 ,  C08K7/06 ,  C08K2003/0831 ,  C08K2003/0881 ,  C08K2201/011 ,  C08L23/0853 ,  C08L29/14 ,  C09J7/22 ,  C09J7/38 ,  C09J9/02 ,  C09J201/02 ,  C09J2201/16 ,  C09J2201/602 ,  C09J2201/606 ,  C09J2205/10 ,  C09J2205/102

Abstract: Examples described include composite nanofibers sheets that have been “infiltrated” with a polymer (i.e., the polymer has flowed past a surface of the nanofiber sheet and into at least some of spaces within the sheet defined by the nanofibers). An adhesive nanofiber tape is formed when the infiltrating polymer is an adhesive and the adhesive infiltrates the nanofiber sheet from a one major surface of the nanofiber sheet. In other described examples, some portions of nanofibers in the sheet have been conformally coated with at least one metal layer.