公开(公告)号：US20150268414A1

公开(公告)日：2015-09-24

申请号：US14730461

申请日：2015-06-04

Applicant: SUMITOMO ELECTRIC INDUSTRIES, LTD.

Inventor： Tetsuya HAYASHI

IPC: G02B6/02 ,  H04B10/25 ,  G02B6/036

CPC classification number: G02B6/02042 ,  C03B2203/34 ,  G02B6/03627 ,  G02B6/03644 ,  G02B6/0365 ,  G02B6/03666 ,  G02B6/30 ,  G02B6/42 ,  G02B6/4201 ,  H04B10/2504

Abstract: In an optical waveguide having plural cores including a pair of adjacent cores with an identical core structure, a minimum value D of center-center distance between the adjacent cores is 15 μm to 60 μm, each of the plural cores has a bent portion fixed in a radius of curvature Rb of not more than 7 mm, a bend supplementary angle of the bent portion is 58° to 90°, a height of the optical waveguide is defined as a height of not more than 10 mm, and a crosstalk of the adjacent cores is not more than 0.01.

Abstract translation: 在具有多个芯的光波导中，具有相同芯结构的一对相邻芯，相邻芯之间的中心距离的最小值D为15μm〜60μm，多个芯中的每一个具有固定在 曲率半径Rb不大于7mm，弯曲部分的弯曲补角为58°至90°，光波导的高度被定义为不大于10mm的高度，并且 相邻芯不大于0.01。

公开(公告)号：US09112616B2

公开(公告)日：2015-08-18

申请号：US12190884

申请日：2008-08-13

Applicant: Laurence R. McColloch

Inventor： Laurence R. McColloch

IPC: H04B10/00 ,  H04B10/80 ,  H04B10/43 ,  H04B10/40 ,  G02B6/42

CPC classification number: H04B10/801 ,  G02B6/4201 ,  G02B6/4246 ,  G02B6/4249 ,  G02B6/4269 ,  G02B6/428 ,  H04B10/40 ,  H04B10/43

Abstract: An optical transceiver system is provided that comprises multiple parallel transceiver modules that are mounted on a card. The transceiver card is small in terms of spatial dimensions, has very good heat dissipation characteristics, and is capable of simultaneously transmitting and receiving data at a rate equal to or greater than approximately one Tb per second (1 Tb/s). A plurality of the transceiver systems may be interconnected to achieve a communications hub system having even higher bandwidths. In addition, the transceiver system may be configured such that each card has a routing controller mounted thereon for performing router functions. The router functions include, for example: causing signals received by one transceiver module on the card to be routed to and transmitted by another of the transceiver modules; causing signals received by one transceiver module on the card to be retransmitted by the same transceiver module over one of it's optical transmit channels; and causing signals received by one transceiver module on the card to be routed to and transmitted by a transceiver module on a different card.

Abstract translation: 提供了一种光收发器系统，其包括安装在卡上的多个并行收发器模块。 收发器卡在空间尺寸方面小，具有非常好的散热特性，并且能够以等于或大于约每秒Tb（1Tb / s）的速率同时发送和接收数据。 多个收发器系统可以互连以实现具有甚至更高带宽的通信集线器系统。 此外，收发器系统可以被配置为使得每个卡具有安装在其上的路由控制器用于执行路由器功能。 路由器功能包括，例如：使由卡上的一个收发器模块接收的信号被路由到另一个收发器模块并由其发送; 使由卡上的一个收发器模块接收的信号由相同的收发器模块通过其光传输通道之一重发; 并且使得由卡上的一个收发器模块接收的信号被路由到由不同卡上的收发器模块发送和发送。

公开(公告)号：US20150206856A1

公开(公告)日：2015-07-23

申请号：US14592930

申请日：2015-01-09

Applicant: Chee Yee KWOK ,  Aron MICHAEL ,  Yiwei XU

Inventor： Chee Yee KWOK ,  Aron MICHAEL ,  Yiwei XU

IPC: H01L25/065 ,  H01L23/00 ,  H01L23/544

CPC classification number: H01L25/0657 ,  G02B6/12 ,  G02B6/12002 ,  G02B6/12004 ,  G02B6/4201 ,  G02B6/4204 ,  G02B6/43 ,  G02B2006/12104 ,  H01L21/302 ,  H01L23/544 ,  H01L24/70 ,  H01L2223/54426 ,  H01L2225/06527 ,  H01L2225/06534 ,  H01L2924/0002 ,  H01L2924/01014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/00

Abstract: An optical bus of an integrated circuit comprises: a polymer waveguide, a micromirror, and an optical coupler. The polymer waveguide is disposed in a via formed through at least one die layer of the integrated circuit comprising an active circuit. The micromirror is disposed adjacent to the via and optically coupled to the polymer waveguide. The optical coupler is connected to the polymer waveguide to couple the active circuit to the optical bus. A stacked integrated circuit is described comprising such an optical bus. A method of fabricating a rear 45° micromirror on a silicon substrate that can be used in the optical bus is also described. Furthermore, alignment/lock mechanisms for use in a stacked integrated circuit comprising first and second silicon substrates are described.

Abstract translation: 集成电路的光学总线包括：聚合物波导，微镜和光耦合器。 聚合物波导设置在通过包括有源电路的集成电路的至少一个管芯层形成的通孔中。 微反射镜邻近通孔设置并光学耦合到聚合物波导。 光耦合器连接到聚合物波导以将有源电路耦合到光总线。 描述了包括这种光学总线的堆叠集成电路。 还描述了可以在光学总线中使用的在硅衬底上制造后部45°微镜的方法。 此外，描述了用于包括第一和第二硅衬底的堆叠集成电路中的对准/锁定机构。

公开(公告)号：US09081156B2

公开(公告)日：2015-07-14

申请号：US12717352

申请日：2010-03-04

Applicant: Chris K. Togami ,  Gary D. Sasser ,  Frank Flens

Inventor： Chris K. Togami ,  Gary D. Sasser ,  Frank Flens

IPC: G02B6/36 ,  G02B6/42 ,  G02B6/38

CPC classification number: G02B6/4201 ,  G02B6/3885 ,  G02B6/424 ,  G02B6/4246 ,  G02B6/4253 ,  G02B6/428 ,  G02B6/4281 ,  G02B6/4284

Abstract: One embodiment includes a connector comprising a connector housing, a ferrule, and a crimp ring. The connector housing has inner and outer surfaces extending between forward and rear ends of the connector housing. The inner surfaces defined a passageway extending lengthwise between the forward and rear ends. The connector housing includes at least one protrusion formed on one of the outer surfaces that is configured to engage a corresponding connector engaging structure of an alignment guide to secure the connector housing within the alignment guide. The ferrule is configured to mount upon end portions of a plurality of optical fibers of a multi-fiber communication cable. The ferrule is disposed partially within the passageway. The crimp ring encompasses the rear end of the connector housing and is configured to secure the connector to the multi-fiber communication cable.

Abstract translation: 一个实施例包括连接器，其包括连接器壳体，套圈和压接环。 连接器壳体具有在连接器壳体的前端和后端之间延伸的内表面和外表面。 内表面限定了在前端和后端之间纵向延伸的通道。 连接器壳体包括形成在一个外表面上的至少一个突出部，其被构造成与对准引导件的对应的连接器接合结构接合，以将连接器壳体固定在对准引导件内。 套圈构造成安装在多纤维通信电缆的多个光纤的端部上。 套圈部分地设置在通道内。 压接环包围连接器壳体的后端，并且被配置为将连接器固定到多光纤通信电缆。

公开(公告)号：US09069146B2

公开(公告)日：2015-06-30

申请号：US14294603

申请日：2014-06-03

Applicant: Electronics and Telecommunications Research Institute

Inventor： Young-Tak Han ,  Jang Uk Shin ,  Sang-Pil Han ,  Sang Ho Park ,  Yongsoon Baek

IPC: G02B6/12 ,  G02B6/42

CPC classification number: G02B6/4279 ,  G02B6/12002 ,  G02B6/12004 ,  G02B6/325 ,  G02B6/42 ,  G02B6/4201 ,  G02B6/4206 ,  G02B6/4208 ,  G02B6/4257 ,  G02B6/4265 ,  G02B6/4271 ,  G02B6/428 ,  G02B6/4281 ,  G02B2006/12092 ,  G02B2006/12135

Abstract: Provided is an optical module. The optical module includes: an optical bench having a first trench of a first depth and a second trench of a second depth that is lower than the first depth; a lens in the first trench of the optical bench; at least one semiconductor chip in the second trench of the optical bench; and a flexible printed circuit board covering an upper surface of the optical bench except for the first and second trenches, wherein the optical bench is a metal optical bench or a silicon optical bench.

Abstract translation: 提供了一种光学模块。 光学模块包括：光学台，其具有第一深度的第一沟槽和第二深度的第二沟槽，其低于第一深度; 在光学工作台的第一沟槽中的透镜; 在所述光学平台的所述第二沟槽中的至少一个半导体芯片; 以及覆盖除了第一和第二沟槽之外的光学台的上表面的柔性印刷电路板，其中所述光学台是金属光学台或硅光学台。

公开(公告)号：US20150160423A1

公开(公告)日：2015-06-11

申请号：US14407228

申请日：2012-06-12

Applicant: FCI Asia Pte Ltd.

Inventor： Gert Droesbeke

IPC: G02B6/42

CPC classification number: G02B6/4284 ,  G02B6/4201 ,  G02B6/423 ,  G02B6/4246 ,  G02B6/426 ,  G02B6/4261 ,  G02B6/4278 ,  G02B6/428 ,  G02B6/4292 ,  H01R12/52

Abstract: A connector with a transceiver and a socket on a substrate receiving the transceiver. The transceiver is movable within the socket into a locked position in a direction parallel to the substrate. The socket and transceiver include complementary locking sections cooperating when the transceiver is in the locked position. During the movement the transceiver wipes over contacts, e.g., on the substrate or on an interposer.

Abstract translation: 带收发器的连接器和接收收发器的基板上的插座。 收发器可在插座内移动到与基板平行的方向上的锁定位置。 插座和收发器包括当收发器处于锁定位置时协作的互补锁定部分。 在移动过程中，收发器例如在基板上或插入件上擦拭触点。

公开(公告)号：US09052445B2

公开(公告)日：2015-06-09

申请号：US13656528

申请日：2012-10-19

Applicant: Cisco Technology, Inc.

Inventor： Kishor Desai ,  Ravinder Kachru ,  Vipulkumar Patel ,  Bipin Dama ,  Kalpendu Shastri ,  Soham Pathak

IPC: H01L21/00 ,  G02B6/12 ,  H01L33/52 ,  G02B6/42 ,  G02B6/43 ,  H01L23/04 ,  H01L23/48 ,  H01L25/16 ,  H01L31/0203 ,  H05K1/02 ,  H01L21/50

CPC classification number: G02B6/4255 ,  G02B6/12 ,  G02B6/13 ,  G02B6/4201 ,  G02B6/4257 ,  G02B6/4292 ,  G02B6/43 ,  H01L21/50 ,  H01L23/04 ,  H01L23/48 ,  H01L25/167 ,  H01L31/0203 ,  H01L33/52 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/1616 ,  H01L2924/165 ,  H01L2924/16788 ,  H05K1/0268 ,  H05K1/0274 ,  H05K2201/10121 ,  H01L2924/0105 ,  H01L2924/01079

Abstract: An opto-electronic assembly is provided comprising a substrate (generally of silicon or glass) for supporting a plurality of interconnected optical and electrical components. A layer of sealing material is disposed to outline a defined peripheral area of the substrate. A molded glass lid is disposed over and bonded to the substrate, where the molded glass lid is configured to create a footprint that matches the defined peripheral area of the substrate. The bottom surface of the molded glass lid includes a layer of bonding material that contacts the substrate's layer of sealing material upon contact, creating a bonded assembly. In one form, a wafer level assembly process is proposed where multiple opto-electronic assemblies are disposed on a silicon wafer and multiple glass lids are molded in a single sheet of glass that is thereafter bonded to the silicon wafer.

Abstract translation: 提供了一种光电子组件，其包括用于支撑多个互连的光学和电气部件的基板（通常为硅或玻璃）。 设置一层密封材料以概述衬底的限定的周边区域。 将模制的玻璃盖设置在基底上并结合到基底上，其中模制的玻璃盖构造成产生与限定的基底周边区域匹配的覆盖区。 模制玻璃盖的底表面包括一层接合材料，其在接触时接触基底的密封材料层，形成结合组件。 在一种形式中，提出了一种晶片级组装工艺，其中多个光电组件设置在硅晶片上，并且多个玻璃盖被模制在一片玻璃中，然后将其粘合到硅晶片上。

公开(公告)号：US08993450B2

公开(公告)日：2015-03-31

申请号：US14258358

申请日：2014-04-22

Applicant: Nuvotronics, LLC

Inventor： David W Sherrer

IPC: H01S5/022 ,  G02B6/42 ,  G01B11/26 ,  H01L23/48 ,  H01S5/00 ,  H01S5/024 ,  H01S5/0683

CPC classification number: G02B6/4248 ,  G01B11/16 ,  G01B11/26 ,  G02B6/3692 ,  G02B6/4201 ,  G02B6/4204 ,  G02B6/4206 ,  G02B6/421 ,  G02B6/4214 ,  G02B6/423 ,  G02B6/4239 ,  G02B6/4243 ,  G02B6/4244 ,  G02B6/4257 ,  G02B6/4271 ,  G02B6/4292 ,  H01L23/481 ,  H01L2924/0002 ,  H01S5/0014 ,  H01S5/022 ,  H01S5/02208 ,  H01S5/02216 ,  H01S5/0222 ,  H01S5/02252 ,  H01S5/02272 ,  H01S5/02284 ,  H01S5/02288 ,  H01S5/02415 ,  H01S5/02469 ,  H01S5/0683 ,  H01L2924/00012 ,  H01L2924/00

Abstract: Provided are methods of forming sealed via structures. One method involves: (a) providing a semiconductor substrate having a first surface and a second surface opposite the first surface; (b) forming a layer on the first surface of the substrate; (c) etching a via hole through the substrate from the second surface to the layer, the via hole having a first perimeter at the first surface; (d) forming an aperture in the layer, wherein the aperture has a second perimeter within the first perimeter; and (e) providing a conductive structure for sealing the via structure. Also provided are sealed via structures, methods of detecting leakage in a sealed device package, sealed device packages, device packages having cooling structures, and methods of bonding a first component to a second component.

公开(公告)号：US20150044811A1

公开(公告)日：2015-02-12

申请号：US14492657

申请日：2014-09-22

Applicant: MICRON TECHNOLOGY, INC.

Inventor： Roy Meade ,  Zvi Sternberg ,  Ofer Tehar-Zahav

IPC: H01L31/18 ,  H01L31/0232

CPC classification number: H01L31/1812 ,  G02B6/132 ,  G02B6/136 ,  G02B6/4201 ,  H01L31/02325 ,  H01L31/02327

Abstract: Photonic structures and methods of formation are disclosed in which a photo detector interface having crystalline misfit dislocations is displaced with respect to a waveguide core to reduce effects of dark current on a detected optical signal.

Abstract translation: 公开了光子结构和形成方法，其中具有晶体失配位错的光电检测器接口相对于波导芯位移，以减少暗电流对检测到的光信号的影响。

公开(公告)号：US08950953B2

公开(公告)日：2015-02-10

申请号：US13740149

申请日：2013-01-11

Applicant: Hon Hai Precision Industry Co., Ltd.

Inventor： I-Thun Lin

IPC: G02B6/42

CPC classification number: G02B6/428 ,  G02B6/42 ,  G02B6/4201 ,  G02B6/4204 ,  G02B6/4246 ,  G02B6/4249 ,  G02B6/4292 ,  G02B6/4293

Abstract: An optical connector includes a first printed circuit board (PCB), a second PCB and an optical-electric coupling element. The first PCB includes a supporting surface. The second PCB includes a first surface. The second PCB is positioned on the supporting surface and electrically connected to the first PCB, with the first surface being perpendicular to the supporting surface. The second PCB further includes at least one laser diode and at least one photo diode. The at least one laser diode and the at least one photo diode are positioned on the first surface. The optical-electric coupling element is positioned on the first surface and receives the at least one laser diode and the at least one photo diode. The optical-electric coupling element includes at least two coupling lenses. Each of the at least two coupling lenses aligns with a laser diode or a photo diode.

Abstract translation: 光连接器包括第一印刷电路板（PCB），第二PCB和光电耦合元件。 第一PCB包括支撑表面。 第二PCB包括第一表面。 第二PCB定位在支撑表面上并电连接到第一PCB，其中第一表面垂直于支撑表面。 第二PCB还包括至少一个激光二极管和至少一个光电二极管。 所述至少一个激光二极管和所述至少一个光电二极管位于所述第一表面上。 光电耦合元件位于第一表面上并接收至少一个激光二极管和至少一个光电二极管。 光电耦合元件包括至少两个耦合透镜。 所述至少两个耦合透镜中的每一个与激光二极管或光电二极管对准。