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    Optical bus in 3D integrated circuit stack
    2.
    发明授权
    Optical bus in 3D integrated circuit stack 有权
    光学总线在3D集成电路堆栈

    公开(公告)号：US08958667B2

    公开(公告)日：2015-02-17

    申请号：US13808323

    申请日：2011-07-04

    Applicant: Chee Yee Kwok ,  Aron Michael ,  Yiwei Xu

    Inventor： Chee Yee Kwok ,  Aron Michael ,  Yiwei Xu

    IPC: G02B6/12 ,  G02B6/42 ,  H01L21/00 ,  G02B6/10 ,  G02B6/43 ,  H01L25/065 ,  H01L21/302

    CPC classification number: H01L25/0657 ,  G02B6/12 ,  G02B6/12002 ,  G02B6/12004 ,  G02B6/4201 ,  G02B6/4204 ,  G02B6/43 ,  G02B2006/12104 ,  H01L21/302 ,  H01L23/544 ,  H01L24/70 ,  H01L2223/54426 ,  H01L2225/06527 ,  H01L2225/06534 ,  H01L2924/0002 ,  H01L2924/01014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/00

    Abstract: An optical bus (130) of an integrated circuit (100) comprises: a polymer waveguide (112), a micromirror (114, 116), and an optical coupler (120). The polymer waveguide (112) is disposed in a via (110) formed through at least one die layer (102, 104, 106) of the integrated circuit (100) comprising an active circuit (210). The micromirror (114) is disposed adjacent to the via (110) and optically coupled to the polymer waveguide (112). The optical coupler (120) is connected to the polymer waveguide (112) to couple the active circuit (210) to the optical bus (130). A stacked integrated circuit (100) is described comprising such an optical bus (130). A method (800) of fabricating a rear 45° micromirror on a silicon substrate that can be used in the optical bus (130) is also described. Furthermore, alignment/lock mechanisms for use in a stacked integrated circuit comprising first and second silicon substrates are described.

    Abstract translation: 集成电路（100）的光学总线（130）包括：聚合物波导（112），微镜（114,116）和光耦合器（120）。 聚合物波导（112）设置在通过包括有源电路（210）的集成电路（100）的至少一个管芯层（102,104,106）形成的通孔（110）中。 微镜（114）邻近通孔（110）设置并且光耦合到聚合物波导（112）。 光耦合器（120）连接到聚合物波导（112）以将有源电路（210）耦合到光学总线（130）。 描述了包括这种光学总线（130）的堆叠集成电路（100）。 还描述了可以在光学总线（130）中使用的在硅衬底上制造后部45°微镜的方法（800）。 此外，描述了用于包括第一和第二硅衬底的堆叠集成电路中的对准/锁定机构。

    OPTICAL BUS IN 3D INTEGRATED CIRCUIT STACK
    3.
    发明申请
    OPTICAL BUS IN 3D INTEGRATED CIRCUIT STACK 审中-公开
    三维集成电路堆叠中的光学总线

    公开(公告)号：US20150206856A1

    公开(公告)日：2015-07-23

    申请号：US14592930

    申请日：2015-01-09

    Applicant: Chee Yee KWOK ,  Aron MICHAEL ,  Yiwei XU

    Inventor： Chee Yee KWOK ,  Aron MICHAEL ,  Yiwei XU

    IPC: H01L25/065 ,  H01L23/00 ,  H01L23/544

    CPC classification number: H01L25/0657 ,  G02B6/12 ,  G02B6/12002 ,  G02B6/12004 ,  G02B6/4201 ,  G02B6/4204 ,  G02B6/43 ,  G02B2006/12104 ,  H01L21/302 ,  H01L23/544 ,  H01L24/70 ,  H01L2223/54426 ,  H01L2225/06527 ,  H01L2225/06534 ,  H01L2924/0002 ,  H01L2924/01014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/00

    Abstract: An optical bus of an integrated circuit comprises: a polymer waveguide, a micromirror, and an optical coupler. The polymer waveguide is disposed in a via formed through at least one die layer of the integrated circuit comprising an active circuit. The micromirror is disposed adjacent to the via and optically coupled to the polymer waveguide. The optical coupler is connected to the polymer waveguide to couple the active circuit to the optical bus. A stacked integrated circuit is described comprising such an optical bus. A method of fabricating a rear 45° micromirror on a silicon substrate that can be used in the optical bus is also described. Furthermore, alignment/lock mechanisms for use in a stacked integrated circuit comprising first and second silicon substrates are described.

    Abstract translation: 集成电路的光学总线包括：聚合物波导，微镜和光耦合器。 聚合物波导设置在通过包括有源电路的集成电路的至少一个管芯层形成的通孔中。 微反射镜邻近通孔设置并光学耦合到聚合物波导。 光耦合器连接到聚合物波导以将有源电路耦合到光总线。 描述了包括这种光学总线的堆叠集成电路。 还描述了可以在光学总线中使用的在硅衬底上制造后部45°微镜的方法。 此外，描述了用于包括第一和第二硅衬底的堆叠集成电路中的对准/锁定机构。

    OPTICAL BUS IN 3D INTEGRATED CIRCUIT STACK
    4.
    发明申请
    OPTICAL BUS IN 3D INTEGRATED CIRCUIT STACK 审中-公开
    三维集成电路堆叠中的光学总线

    公开(公告)号：US20130108211A1

    公开(公告)日：2013-05-02

    申请号：US13808323

    申请日：2011-07-04

    Applicant: Chee Yee Kwok ,  Aron Michael ,  Yiwei Xu

    Inventor： Chee Yee Kwok ,  Aron Michael ,  Yiwei Xu

    IPC: G02B6/12 ,  H01L21/302

    CPC classification number: H01L25/0657 ,  G02B6/12 ,  G02B6/12002 ,  G02B6/12004 ,  G02B6/4201 ,  G02B6/4204 ,  G02B6/43 ,  G02B2006/12104 ,  H01L21/302 ,  H01L23/544 ,  H01L24/70 ,  H01L2223/54426 ,  H01L2225/06527 ,  H01L2225/06534 ,  H01L2924/0002 ,  H01L2924/01014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/00

    Abstract: An optical bus (130) of an integrated circuit (100) comprises: a polymer waveguide (112), a micromirror (114, 116), and an optical coupler (120). The polymer waveguide (112) is disposed in a via (110) formed through at least one die layer (102, 104, 106) of the integrated circuit (100) comprising an active circuit (210). The micromirror (114) is disposed adjacent to the via (110) and optically coupled to the polymer waveguide (112). The optical coupler (120) is connected to the polymer waveguide (112) to couple the active circuit (210) to the optical bus (130). A stacked integrated circuit (100) is described comprising such an optical bus (130). A method (800) of fabricating a rear 45° micromirror on a silicon substrate that can be used in the optical bus (130) is also described. Furthermore, alignment/lock mechanisms for use in a stacked integrated circuit comprising first and second silicon substrates are described.

    Abstract translation: 集成电路（100）的光学总线（130）包括：聚合物波导（112），微镜（114,116）和光耦合器（120）。 聚合物波导（112）设置在通过包括有源电路（210）的集成电路（100）的至少一个管芯层（102,104,106）形成的通孔（110）中。 微镜（114）邻近通孔（110）设置并且光耦合到聚合物波导（112）。 光耦合器（120）连接到聚合物波导（112）以将有源电路（210）耦合到光学总线（130）。 描述了包括这种光学总线（130）的堆叠集成电路（100）。 还描述了可以在光学总线（130）中使用的在硅衬底上制造后部45°微镜的方法（800）。 此外，描述了在包括第一和第二硅衬底的堆叠集成电路中使用的对准/锁定机构。

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