公开(公告)号：US09999123B2

公开(公告)日：2018-06-12

申请号：US15075064

申请日：2016-03-18

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Arata Kishi ,  Tadashi Maeda ,  Tadahiko Sakai

IPC: H05K1/02 ,  H05K1/11 ,  B23K1/00 ,  B23K35/26 ,  B23K35/36 ,  B23K35/362 ,  H05K1/14 ,  H05K1/09 ,  H05K1/00 ,  H05K7/00 ,  H01R12/71

CPC classification number: H05K1/0274 ,  B23K1/0016 ,  B23K35/26 ,  B23K35/264 ,  B23K35/3613 ,  B23K35/362 ,  H01R12/714 ,  H05K1/09 ,  H05K1/092 ,  H05K1/097 ,  H05K1/11 ,  H05K1/111 ,  H05K1/14 ,  H05K3/323 ,  H05K3/3436 ,  H05K3/3463 ,  H05K2201/0108 ,  H05K2201/0133 ,  H05K2201/0218 ,  H05K2201/0326 ,  H05K2201/10136 ,  H05K2201/10909 ,  H05K2201/10916 ,  H05K2201/2036 ,  Y02P70/613

Abstract: A connection structure of circuit members includes a first circuit member, a second circuit member, and a joint portion. The first circuit member has a first main surface on which a light-transparent electrode is provided. The second circuit member has a second main surface on which a metal electrode is provided. The joint portion is interposed between the first main surface and the second main surface. The joint portion includes a resin portion and a solder portion. The solder portion electrically connects the light-transparent electrode and the metal electrode. The light-transparent electrode contains an oxide that includes indium and tin, and the solder portion contains bismuth and indium.

公开(公告)号：US20170253758A1

公开(公告)日：2017-09-07

申请号：US15507363

申请日：2015-08-28

Applicant: University of Louisville Research Foundation, Inc.

Inventor： Theodore DRUFFEL ,  Ruvini DHARMADASA ,  Menaka JHA ,  Delaina AMOS

IPC: C09D11/52 ,  H05K3/12 ,  H05K1/09 ,  C09D11/322 ,  C09D11/037

CPC classification number: C09D11/52 ,  B01J13/02 ,  B22F1/0022 ,  B22F1/025 ,  B22F9/24 ,  B32B15/02 ,  B82Y30/00 ,  B82Y40/00 ,  C09D11/037 ,  C09D11/322 ,  C09D17/006 ,  H05K1/097 ,  H05K3/1291 ,  H05K2201/0218 ,  H05K2203/1157

Abstract: Copper inks are provided that include a plurality of core-shell nanostructures, with each nanostructure including a copper core and a barrier metal shell, a diameter of less than about 500 nm, and a distinct boundary between the copper core and the barrier metal shell. Methods of forming a copper ink are further provided and include an initial step of synthesizing an amount of copper nanoparticles in an aqueous solution. An amount of a barrier metal is then added to the copper nanoparticles to form a dispersion of the barrier metal and the copper nanoparticles, and a reducing agent is subsequently added to the dispersion to produce a copper ink comprising core-shell nanostructures having a copper core and a barrier metal shell. Copper films are then formed by applying that copper ink to a substrate and sintering the copper ink.

公开(公告)号：US09756728B2

公开(公告)日：2017-09-05

申请号：US14423417

申请日：2013-05-22

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： Tadahiko Sakai ,  Hideki Eifuku ,  Koji Motomura

IPC: H05K1/00 ,  H05K1/18 ,  H05K3/32 ,  H01L23/00 ,  H05K1/03 ,  H05K1/14 ,  H05K3/34

CPC classification number: H05K1/18 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/2939 ,  H01L2224/294 ,  H01L2224/29499 ,  H01L2224/32225 ,  H01L2224/81193 ,  H01L2224/81903 ,  H01L2224/83192 ,  H01L2224/8385 ,  H01L2224/9211 ,  H01L2924/351 ,  H05K1/0373 ,  H05K1/147 ,  H05K3/323 ,  H05K3/3436 ,  H05K2201/0209 ,  H05K2201/0218 ,  H05K2201/0221 ,  H05K2201/0233 ,  H05K2203/0278 ,  H05K2203/0425 ,  H05K2203/0465 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/00

Abstract: Disclosed is a component-mounted structure including a first object having a plurality of first electrodes, a second object as an electronic component having second electrodes, a joint portion joining the plurality of first electrodes and the corresponding second electrodes to each other, and a resin-reinforcing portion. The joint portion has a core including at least one of a first metal and a resin particle, and a layer of an intermetallic compound of the first metal and a second metal having a low melting point. The resin-reinforcing portion includes a particulate matter including the core and the intermetallic compound, in a portion except between the first and second electrodes. An amount of the particulate matter included in the portion is 0.1 to 10 vol %.

公开(公告)号：US09318243B2

公开(公告)日：2016-04-19

申请号：US14359958

申请日：2012-11-26

Applicant: SHOWA DENKO K.K.

Inventor： Hiroshi Uchida

IPC: C09D11/52 ,  H01B1/22 ,  H01B13/00 ,  H05K1/09 ,  H05K3/12 ,  C09D11/037 ,  C09D17/00

CPC classification number: H01B13/003 ,  C09D11/037 ,  C09D11/52 ,  C09D17/00 ,  H01B1/22 ,  H05K1/095 ,  H05K3/1283 ,  H05K2201/0218 ,  H05K2201/0257

Abstract: Provided are a conductive pattern forming method and a composition for forming a conductive pattern by photo irradiation or microwave heating, capable of increasing the conductivity of the conductive pattern. A conductive pattern is formed by preparing a composition for forming a conductive pattern comprising, copper particles each having a copper oxide thin film on the entirety or a part of the surface thereof, copper oxide particles, a reducing agent such as a polyhydric alcohol, a carboxylic acid, or a polyalkylene glycol, and a binder resin; forming a printed pattern having any selected shape on a substrate using this composition for forming a conductive pattern; and subjecting the printed pattern to photo irradiation or microwave heating to generate a sintered body of copper.

Abstract translation: 提供一种导电图案形成方法和通过光照射或微波加热形成导电图案的组合物，其能够增加导电图案的导电性。 通过制备形成导电图案的组合物形成导电图案，所述组合物包括在其整个或部分表面上各自具有氧化铜薄膜的铜颗粒，氧化铜颗粒，还原剂如多元醇， 羧酸或聚亚烷基二醇，和粘合剂树脂; 使用该用于形成导电图案的组合物在基板上形成具有任何选定形状的印刷图案; 并对印刷图案进行光照射或微波加热以产生铜烧结体。

公开(公告)号：US20150322276A1

公开(公告)日：2015-11-12

申请号：US14804469

申请日：2015-07-21

Applicant: Henkel IP & Holding GmbH ,  Ablestik (Shanghai) Co. Ltd. ,  Henkel AG & Co. KGAA

Inventor： Jie Cao ,  Jose Garcia-Miralles ,  Allison Yue Xiao ,  Rudie Oldenzijl ,  Gunther Dreezen ,  Qili Wu ,  Jianping Chen

IPC: C09D11/52 ,  H05K3/12

CPC classification number: C09D11/52 ,  C09D11/037 ,  C09D11/10 ,  H05K1/095 ,  H05K3/12 ,  H05K2201/0218 ,  H05K2201/0245 ,  H05K2201/0272

Abstract: This invention is a flexible conductive ink composition comprising (A) a resin binder, (B) silver-plated core conductive particles, and (C) conductive particles having a surface area at least 1.0 m2/g.

Abstract translation: 本发明是一种柔性导电油墨组合物，其包含（A）树脂粘合剂，（B）镀银芯导电颗粒和（C）表面积至少为1.0m 2 / g的导电颗粒。

公开(公告)号：US08673050B2

公开(公告)日：2014-03-18

申请号：US12850950

申请日：2010-08-05

Applicant: Seiki Sakuyama ,  Taiji Sakai

Inventor： Seiki Sakuyama ,  Taiji Sakai

IPC: B22F1/02 ,  H01B1/02 ,  H01B1/22

CPC classification number: H05K1/115 ,  H01B1/026 ,  H01B1/22 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H05K3/462 ,  H05K2201/0218 ,  H05K2201/0272 ,  H05K2201/10378 ,  H05K2203/0425 ,  H01L2224/0401

Abstract: A conductive material includes a first metal part whose main ingredient is a first metal; a second metal part formed on the first metal part and whose main ingredient is a second metal, the second metal having a melting point lower than a melting point of the first metal, which second metal can form a metallic compound with the first metal; and a third metal part whose main ingredient is a third metal, which third metal can make a eutectic reaction with the second metal.

Abstract translation: 导电材料包括主要成分是第一金属的第一金属部分; 第二金属部分形成在第一金属部分上，其主要成分是第二金属，第二金属的熔点低于第一金属的熔点，第二金属可以与第一金属形成金属化合物; 和主要成分为第三金属的第三金属部分，该第三金属可以与第二金属发生共晶反应。

公开(公告)号：US08506850B2

公开(公告)日：2013-08-13

申请号：US13262326

申请日：2010-03-17

Applicant: Taku Sasaki ,  Hiroshi Natsui

Inventor： Taku Sasaki ,  Hiroshi Natsui

IPC: H01B1/02 ,  H01B1/22 ,  B32B5/16 ,  B05D7/00

CPC classification number: H01B1/22 ,  H05K3/323 ,  H05K2201/0218 ,  Y10T428/2991 ,  Y10T428/2998

Abstract: The present invention provides a conductive fine particle capable of suppressing a blackening phenomenon during storage and thus providing high connection reliability; an anisotropic conductive material containing the conductive fine particle; and a connection structure.The conductive particle which has a base fine particle, and a conductive layer and a low-melting point metal layer that are formed in the stated order on the surface of the base fine particle, wherein the low-melting point metal layer has an arithmetic mean surface roughness of 50 nm or lower.

Abstract translation: 本发明提供能够抑制保存期间的黑化现象的导电性微粒，从而提供高连接可靠性; 含有导电性细颗粒的各向异性导电材料; 和连接结构。 具有基础细颗粒的导电颗粒以及在基体细颗粒的表面上按顺序形成的导电层和低熔点金属层，其中低熔点金属层具有算术平均值 表面粗糙度为50nm以下。

公开(公告)号：US08395052B2

公开(公告)日：2013-03-12

申请号：US12975421

申请日：2010-12-22

Applicant: Tomoyuki Ishimatsu ,  Hiroki Ozeki ,  Hiroshi Hamachi

Inventor： Tomoyuki Ishimatsu ,  Hiroki Ozeki ,  Hiroshi Hamachi

IPC: H05K1/09

CPC classification number: H05K3/323 ,  H05K2201/0212 ,  H05K2201/0218 ,  H05K2201/0221 ,  Y10T29/4913 ,  Y10T428/254 ,  Y10T428/26 ,  Y10T428/2991 ,  Y10T428/31663

Abstract: The present invention aims to provide conductive particles which can reduce the stress while maintaining high hardness (hardly causing cracks even in a state of being crushed in connection process) by improving rolling properties and can ensure adequate conductive reliability not only with respect to ITO substrates, but also with respect to IZO substrates, an anisotropic conductive film provided with the conductive particles, a joined structure provided with the anisotropic conductive film, and a joining method using the anisotropic conductive film. The conductive particles of the present invention include polymer fine particles, and a conductive layer formed on surfaces of the polymer fine particles, wherein an outermost surface shell of the conductive layer is a nickel-palladium alloy layer.

Abstract translation: 本发明的目的在于提供能够降低应力同时保持高硬度的导电性粒子（即使在连接工序中被破碎的状态下也难以产生裂纹），并且能够确保不仅对于ITO基板的充分的导电性， 而且对于IZO基板，设置有导电颗粒的各向异性导电膜，设置有各向异性导电膜的接合结构以及使用各向异性导电膜的接合方法。 本发明的导电粒子包括聚合物细颗粒和形成在聚合物细颗粒的表面上的导电层，其中导电层的最外表面壳是镍 - 钯合金层。

公开(公告)号：US20120100374A1

公开(公告)日：2012-04-26

申请号：US13335846

申请日：2011-12-22

Applicant: Alfred A. ZINN

Inventor： Alfred A. ZINN

IPC: B32B5/16 ,  B23K1/20 ,  B23K26/22 ,  B22F9/16 ,  B05D5/12 ,  B82Y40/00 ,  B82Y30/00

CPC classification number: C23C24/08 ,  B22F1/0018 ,  B22F1/0062 ,  B22F1/025 ,  B22F9/24 ,  B82Y30/00 ,  H05K1/097 ,  H05K3/3484 ,  H05K3/3494 ,  H05K2201/0218 ,  H05K2201/0257 ,  H05K2201/0266 ,  H05K2203/107 ,  Y10S977/777 ,  Y10T428/12028 ,  Y10T428/12049 ,  Y10T428/12181 ,  Y10T428/2991

Abstract: A composition may have metal nanoparticles having a diameter of 20 nanometers or less and have a fusion temperature of less than about 220° C. A method of fabricating the metal nanoparticles may include preparing a solvent, adding a precursor with a metal to the solvent, adding a first surfactant, mixing in a reducing agent, and adding in a second surfactant to stop nanoparticle formation. Copper and/or aluminum nanoparticle compositions formed may be used for lead-free soldering of electronic components to circuit boards. A composition may include nanoparticles, which may have a copper nanocore, an amorphous aluminum shell and an organic surfactant coating. A composition may have copper or aluminum nanoparticles. About 30-50% of the copper or aluminum nanoparticles may have a diameter of 20 nanometers or less, and the remaining 70-50% of the copper or aluminum nanoparticles may have a diameter greater than 20 nanometers.

Abstract translation: 组合物可以具有直径为20纳米或更小并且具有小于约220℃的熔融温度的金属纳米颗粒。制备金属纳米颗粒的方法可包括制备溶剂，向溶剂中加入前体与金属， 加入第一表面活性剂，在还原剂中混合，并加入第二表面活性剂以阻止纳米颗粒的形成。 形成的铜和/或铝纳米颗粒组合物可用于将电子部件无铅焊接到电路板。 组合物可以包括可以具有铜纳米孔，无定形铝壳和有机表面活性剂涂层的纳米颗粒。 组合物可以具有铜或铝纳米颗粒。 大约30-50％的铜或铝纳米颗粒可以具有20纳米或更小的直径，剩余的70-50％的铜或铝纳米颗粒可以具有大于20纳米的直径。

公开(公告)号：US08153030B2

公开(公告)日：2012-04-10

申请号：US12207138

申请日：2008-09-09

Applicant: Min-Sok Jang ,  Kyung-Hwan Ko ,  Seung-Il Lee ,  Jin-Wook Moon ,  Jeong-Geun Han

Inventor： Min-Sok Jang ,  Kyung-Hwan Ko ,  Seung-Il Lee ,  Jin-Wook Moon ,  Jeong-Geun Han

IPC: H01B1/22

CPC classification number: H05K3/323 ,  B22F1/025 ,  H05K2201/0218 ,  H05K2201/0233 ,  Y10T428/2991

Abstract: In an anisotropic conductive adhesive containing a conductive particle, the conductive particle includes a resin particle that is provided with a cavity formed therein and a conductive layer surrounding a surface of the resin particle. The cavity is formed by mixing the resin particle with a reactant and partially removing the reactant from the resin particle. Thus, the conductive particle may readily absorb an external pressure, thereby providing an improved malleability to the conductive particle.

Abstract translation: 在含有导电性粒子的各向异性导电性粘合剂中，导电性粒子包括树脂粒子，该树脂粒子形成有腔，该导电性层包围树脂粒子的表面。 通过将树脂颗粒与反应物混合并从树脂颗粒中部分除去反应物而形成空腔。 因此，导电性粒子可以容易地吸收外部压力，从而为导电性粒子提供改善的延展性。