公开(公告)号：US20150208516A1

公开(公告)日：2015-07-23

申请号：US14606305

申请日：2015-01-27

Applicant: Fuji Electric Holdings Co., Ltd. ,  Niho Handa Co. Ltd.

Inventor： Mitsuo YAMASHITA ,  Tomoaki GOTO ,  Takeshi ASAGI

IPC: H05K3/34 ,  C22C13/00 ,  B23K35/26 ,  B23K1/00 ,  B23K35/02

CPC classification number: H05K3/341 ,  B23K1/0016 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/262 ,  B23K2101/36 ,  B23K2101/42 ,  C22C1/0483 ,  C22C12/00 ,  C22C13/00 ,  C22C28/00 ,  H01L2924/0132 ,  H01L2924/0133 ,  H05K3/3484 ,  H05K2201/0266 ,  H05K2201/0272 ,  H05K2203/04 ,  H05K2203/12 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01029

Abstract: A cream solder obtained by kneading an Sn—Ag—Cu alloy together with a flux, wherein the Sn—Ag—Cu alloy includes a mixture of a first powdery alloy and a second powdery alloy, the first powdery alloy is represented by an Sn—Ag phase diagram having a solid-liquid coexistence region and has a given silver amount which is larger than that in the eutectic composition (3.5 wt. % silver), and the second powdery alloy has a silver amount which is that in the eutectic composition (3.5 wt. % silver) or which is close to that in the eutectic composition and is smaller than that in the first powdery alloy. This cream solder has excellent strength and thermal stability, and satisfactory bonding properties. It is based on an inexpensive Sn—Ag—Cu solder alloy. It is suitable for use as a high-temperature-side lead-free solder material conformable to temperature gradation bonding. Also provided is a method of soldering.

Abstract translation: 通过将Sn-Ag-Cu合金与助熔剂捏合而获得的膏状焊料，其中，Sn-Ag-Cu合金包括第一粉末合金和第二粉末合金的混合物，第一粉末合金由Sn- Ag相图具有固液共存区域，并且具有大于共晶组合物（3.5重量％银）中的银量的给定银量，第二粉末合金的银量为共晶组合物中的银量 3.5重量％的银），或者接近于共晶组合物中的银，并且小于第一粉末合金中的银。 这种膏状焊料具有优异的强度和热稳定性，并且具有令人满意的粘合性能。 它基于廉价的Sn-Ag-Cu焊料合金。 适用于符合温度梯度键合的高温侧无铅焊料。 还提供了一种焊接方法。

公开(公告)号：US20150136219A1

公开(公告)日：2015-05-21

申请号：US14402006

申请日：2013-05-08

Applicant: Material Concept, Inc.

Inventor： Junichi Koike ,  Hoang Tri Hai

IPC: H01L31/02 ,  H01B1/02 ,  H01B1/22 ,  H05K3/12

CPC classification number: H01L31/02013 ,  B22F1/0011 ,  B22F1/0059 ,  C22C1/0425 ,  C22C9/00 ,  H01B1/026 ,  H01B1/22 ,  H01L31/022425 ,  H05K1/092 ,  H05K3/1291 ,  H05K2201/0245 ,  H05K2201/0248 ,  H05K2201/0266 ,  H05K2203/1131 ,  Y02E10/50 ,  Y10T428/2982

Abstract: This conductive paste is such that the printing properties and sintering properties are superior and is formed such that resistance of wiring after sintering is lowered. This conductive paste is characterized by being formed from copper-based metal particles and by an aspect ratio (dmax/dmin), which is defined as the ratio of the maximum diameter (dmax) and minimum diameter (dmin) for the metal particles, being greater than or equal to 1.0 and smaller than 2.2.

Abstract translation: 该导电性糊料使得印刷性能和烧结性能优异，并且形成为使得烧结后的布线的电阻降低。 该导电性糊剂的特征在于由铜基金属粒子形成，长宽比（dmax / dmin）定义为金属粒子的最大直径（dmax）与最小直径（dmin）的比例，为 大于或等于1.0且小于2.2。

公开(公告)号：US08821676B2

公开(公告)日：2014-09-02

申请号：US13099394

申请日：2011-05-03

Applicant: Yusuke Yasuda ,  Toshiaki Morita ,  Eiichi Ide ,  Hiroshi Hozoji ,  Toshiaki Ishii

Inventor： Yusuke Yasuda ,  Toshiaki Morita ,  Eiichi Ide ,  Hiroshi Hozoji ,  Toshiaki Ishii

IPC: B29C65/02 ,  B32B5/02 ,  B32B5/16

CPC classification number: H05K3/321 ,  B22F1/0014 ,  B22F1/0062 ,  B22F3/14 ,  B22F2003/145 ,  B23K35/22 ,  B23K35/3006 ,  B23K35/3013 ,  B23K35/302 ,  B23K35/40 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/37 ,  H01L24/40 ,  H01L24/45 ,  H01L24/83 ,  H01L25/072 ,  H01L2224/29007 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/29311 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29355 ,  H01L2224/2936 ,  H01L2224/29364 ,  H01L2224/29366 ,  H01L2224/29369 ,  H01L2224/29371 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/371 ,  H01L2224/37147 ,  H01L2224/3754 ,  H01L2224/40095 ,  H01L2224/40225 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/48247 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/8384 ,  H01L2224/84801 ,  H01L2224/85205 ,  H01L2224/8584 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01016 ,  H01L2924/01019 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01076 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/13091 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/2076 ,  H05K2201/0224 ,  H05K2201/0257 ,  H05K2201/0266 ,  Y10T428/12028 ,  Y10T428/12181 ,  Y10T428/2991 ,  Y10T428/8305 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/83205 ,  H01L2924/00012

Abstract: A bonding material comprising metal particles coated with an organic substance having carbon atoms of 2 to 8, wherein the metal particles comprises first portion of 100 nm or less, and a second portion larger than 100 nm but not larger than 100 μm, each of the portions having at least peak of a particle distribution, based on a volumetric base. The disclosure is further concerned with a bonding method using the bonding material.

Abstract translation: 一种粘合材料，其包含涂覆有碳原子数为2〜8的有机物质的金属粒子，其中，所述金属粒子包含100nm以下的第一部分和大于100nm但不大于100μm的第二部分， 基于体积基数具有至少峰值分布的部分。 本公开还涉及使用接合材料的接合方法。

公开(公告)号：US20140020938A1

公开(公告)日：2014-01-23

申请号：US14033412

申请日：2013-09-20

Applicant: Fujifilm Corporation

Inventor： Hiroshi MATAKI

IPC: H05K3/22 ,  H05K1/09

CPC classification number: H05K3/227 ,  H01L21/4867 ,  H01L23/5328 ,  H01L2924/0002 ,  H05K1/09 ,  H05K1/097 ,  H05K3/125 ,  H05K3/1283 ,  H05K3/245 ,  H05K2201/0266 ,  H05K2203/0278 ,  H05K2203/1476 ,  H01L2924/00

Abstract: A method of forming copper wiring includes: a wiring pattern formation step of depositing a first suspension onto a substrate to form a wiring pattern of the first suspension on the substrate, the first suspension including dispersed first copper particles having an average particle diameter that is not smaller than 100 nm; a drying step of drying the first copper particles at a temperature lower than 150° C.; a second suspension deposition step of depositing a second suspension onto the wiring pattern, the second suspension including dispersed second copper particles having an average particle diameter that is smaller than the average particle diameter of the first copper particles; a compaction step of reducing voids between the first and second copper particles; a heat application step of applying heat to the first and second copper particles; and a reducing treatment step of subjecting the first and second copper particles to a reducing treatment.

Abstract translation: 一种形成铜布线的方法包括：布线图形形成步骤，将第一悬浮液沉积在基板上，以在基板上形成第一悬浮液的布线图案，第一悬浮液包括平均粒径不分散的分散的第一铜颗粒 小于100nm; 在低于150℃的温度下干燥第一铜颗粒的干燥步骤; 第二悬浮沉积步骤，将第二悬浮液沉积到所述布线图案上，所述第二悬浮液包括平均粒径小于所述第一铜颗粒的平均粒径的分散的第二铜颗粒; 减少第一和第二铜颗粒之间的空隙的压实步骤; 向第一和第二铜颗粒施加热量的加热步骤; 以及对所述第一和第二铜粒进行还原处理的还原处理工序。

公开(公告)号：US08603624B2

公开(公告)日：2013-12-10

申请号：US13510770

申请日：2010-10-29

Applicant: Takashi Matsuda ,  Kiyotaka Komori ,  Akiyoshi Nozue ,  Takayuki Suzue ,  Mitsuyoshi Nishino ,  Toshiyuki Asahi ,  Yoshito Kitagawa ,  Naoyuki Tani

Inventor： Takashi Matsuda ,  Kiyotaka Komori ,  Akiyoshi Nozue ,  Takayuki Suzue ,  Mitsuyoshi Nishino ,  Toshiyuki Asahi ,  Yoshito Kitagawa ,  Naoyuki Tani

IPC: B32B15/00

CPC classification number: H05K1/0373 ,  B32B5/28 ,  B32B15/14 ,  C08G59/38 ,  C08G59/4021 ,  C08G59/621 ,  C08J5/24 ,  H05K1/0366 ,  H05K2201/012 ,  H05K2201/0209 ,  H05K2201/0266 ,  Y10T428/24917 ,  Y10T428/24994 ,  Y10T428/25 ,  Y10T428/252 ,  Y10T428/254 ,  Y10T428/257 ,  Y10T442/20 ,  Y10T442/3455

Abstract: Disclosed is a prepreg obtained by impregnating a woven fabric base with a thermosetting resin composition, wherein the thermosetting resin composition contains 80 to 200 volume parts of an inorganic filler per 100 volume parts of a thermosetting resin, and the inorganic filler contains (A) gibbsite aluminum hydroxide particles having an average particle diameter (D50) of 2 to 15 μm, (B) at least one inorganic component selected from the group consisting of boehmite particles having an average particle diameter (D50) of 2 to 15 μm and inorganic particles that have an average particle diameter (D50) of 2 to 15 μm and that contain crystal water having a release initiation temperature of 400° C. or higher or contain no crystal water, and (C) aluminum oxide particles having an average particle diameter (D50) of 1.5 μm or smaller, the compounded ratio (volume ratio) of the gibbsite aluminum hydroxide particles (A), the at least one inorganic component (B) selected from the group consisting of the boehmite particles and the inorganic particles, and the aluminum oxide particles (C) being 1:0.1 to 2.5:0.1 to 1.

Abstract translation: 公开了一种通过用热固性树脂组合物浸渍机织织物基底而获得的预浸料，其中热硬化性树脂组合物每100体积份热固性树脂含有80〜200体积份的无机填料，无机填料含有（A）三水铝矿 平均粒径（D50）为2〜15μm的氢氧化铝粒子，（B）至少一种选自平均粒径（D50）为2〜15μm的勃姆石粒子的无机成分和无机粒子， 平均粒径（D50）为2〜15μm，并且含有剥离开始温度为400℃以上或不含结晶水的结晶水，（C）平均粒径（D50）的氧化铝粒子 ）为1.5μm以下，三水铝石氢氧化铝粒子（A），至少一种选自一组的无机成分（B）的配合比（体积比） 勃姆石粒子和无机粒子，氧化铝粒子（C）的比例为1:0.1〜2.5:0.1:1。

公开(公告)号：US08481629B2

公开(公告)日：2013-07-09

申请号：US12431303

申请日：2009-04-28

Applicant: Ryo Kuwabara ,  Atsushi Yamaguchi ,  Hidenori Miyakawa

Inventor： Ryo Kuwabara ,  Atsushi Yamaguchi ,  Hidenori Miyakawa

IPC: C04B26/06 ,  C08K3/10 ,  C08K3/34 ,  C08J3/22 ,  H05K1/02

CPC classification number: H05K3/305 ,  C08K3/34 ,  C09J163/00 ,  H05K2201/0209 ,  H05K2201/0266 ,  H05K2201/10689 ,  Y02P70/613

Abstract: A surface mount adhesive includes an epoxy resin, a curing agent, an accelerator, a first filler, and a second filler. The second filler has a specific gravity 1.1 to 3 times that of the first filler, and the second filler has a hardness higher than that of the first filler. The first filler has a largest particle size of 1 to 100 μm, and the second filler has a largest particle size of 1 to 100 μm, a specific gravity of 1.7 to 4.5, and a revised Mohs hardness of 2 to 12. The weight ratio of the first filler to the second filler is from 1:3 to 3:1, and the surface mount adhesive has a specific gravity of 1.2 to 1.5. When the surface mount adhesive is dispensed, dispensing failures are suppressed, and dispensing stability is improved.

Abstract translation: 表面贴装粘合剂包括环氧树脂，固化剂，促进剂，第一填料和第二填料。 第二填料的比重为第一填料的比重为1.1〜3倍，第二填料的硬度比第一填料的硬度高。 第一填料的最大粒度为1-100μm，第二填料的最大粒径为1-100μm，比重为1.7〜4.5，修饰的莫氏硬度为2〜12。重量比 的第一填料与第二填料的比例为1:3至3:1，表面粘合剂的比重为1.2至1.5。 当表面贴装粘合剂被分配时，抑制分配故障，并提高分配稳定性。

公开(公告)号：US20130153279A1

公开(公告)日：2013-06-20

申请号：US13819080

申请日：2011-08-25

Applicant: Katsura Hayashi

Inventor： Katsura Hayashi

IPC: H05K1/11 ,  H05K1/18

CPC classification number: H05K1/115 ,  H05K1/18 ,  H05K3/4673 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2201/0266 ,  H05K2201/09827

Abstract: A wiring board according to an embodiment includes an inorganic insulating layer provided with a via-hole which is a penetrating hole, and a via-conductor which is a penetrating conductor disposed inside the via-hole. The inorganic insulating layer includes first inorganic insulating particles connected to each other and second inorganic insulating particles that are larger in particle size than the first inorganic insulating particles and are connected to each other via the first inorganic insulating particles, and also has, at an inner wall of the via-hole V, a protrusion including at least part of the second inorganic insulating particle. The protrusion is covered with the via-conductor.

Abstract translation: 根据实施例的布线板包括设置有穿孔的通孔的无机绝缘层和布置在通孔内的穿透导体的通孔导体。 无机绝缘层包括彼此连接的第一无机绝缘颗粒和与第一无机绝缘颗粒相比粒径大的第二无机绝缘颗粒，并且通过第一无机绝缘颗粒彼此连接，并且在内部 通孔V的壁，包括至少部分第二无机绝缘颗粒的突起。 突起被通孔导体覆盖。

公开(公告)号：US08465670B2

公开(公告)日：2013-06-18

申请号：US13387236

申请日：2010-07-23

Applicant: Takeshi Kondo ,  Sadanobu Iwase ,  Hironobu Iyama

Inventor： Takeshi Kondo ,  Sadanobu Iwase ,  Hironobu Iyama

IPC: C09K19/00 ,  C09K19/06 ,  C09K19/34 ,  C09K19/52 ,  H05K1/00

CPC classification number: H05K1/056 ,  C08L67/03 ,  C09D167/03 ,  C09K19/3809 ,  H05K2201/0141 ,  H05K2201/0209 ,  H05K2201/0266 ,  Y10T428/10 ,  Y10T428/1036

Abstract: To provide a liquid crystal polyester composition which is suited for use as a material for forming a liquid crystal polyester film having excellent thermal conductivity. Also, an excellent electronic circuit board is provided by using an insulating film obtained from the liquid crystal polyester composition. The liquid crystal polyester composition of the present invention is composed of a liquid crystal polyester, a solvent and a thermally conductive filler. The thermally conductive filler is contained in the amount of 50 to 90 volume % based on the total amount of the liquid crystal polyester and the thermally conductive filler, and the thermally conductive filler contains 0 to 20 volume % of a first thermally conductive filler having a volume average particle diameter of 0.1 μm or more and less than 1.0 μm, 5 to 40 volume % of a second thermally conductive filler having a volume average particle diameter of 1.0 μm or more and less than 5.0 μm and 40 to 90 volume % of a third thermally conductive filler having a volume average particle diameter of 5.0 μm or more and 30.0 μm or less.

Abstract translation: 提供一种液晶聚酯组合物，其适用于形成具有优异导热性的液晶聚酯膜的材料。 此外，通过使用由液晶聚酯组合物获得的绝缘膜提供了优异的电子电路板。 本发明的液晶聚酯组合物由液晶聚酯，溶剂和导热填料组成。 导热性填料的含量相对于液晶聚酯和导热性填料的总量为50〜90体积％，导热性填料含有0〜20体积％的具有 体积平均粒径为0.1μm以上且小于1.0μm，5〜40体积％的体积平均粒径为1.0μm以上且小于5.0μm的第二导热性填料和40〜90体积％的 第三导热填料，其体积平均粒径为5.0μm以上且30.0μm以下。

公开(公告)号：US08449143B2

公开(公告)日：2013-05-28

申请号：US12600377

申请日：2008-05-14

Applicant: Takeshi Miyakawa ,  Kenji Miyata ,  Taiki Nishi ,  Yoshihiko Okajima

Inventor： Takeshi Miyakawa ,  Kenji Miyata ,  Taiki Nishi ,  Yoshihiko Okajima

IPC: F21V7/00

CPC classification number: H05K1/0274 ,  H01L33/60 ,  H05K1/056 ,  H05K3/28 ,  H05K2201/0209 ,  H05K2201/0227 ,  H05K2201/0266 ,  H05K2201/0338 ,  H05K2201/09909 ,  H05K2201/10106 ,  H05K2201/2054

Abstract: Provided is a metal base circuit board having a new function of a light reflection in addition to the conventional printed circuit board function for mounting electronic parts. The metal base circuit board has a circuit arranged on a metal plate via an insulation layer. A white film is arranged at least one the insulation layer.

Abstract translation: 提供除了用于安装电子部件的常规印刷电路板功能之外，还具有具有光反射的新功能的金属基底电路板。 金属基电路板具有通过绝缘层设置在金属板上的电路。 绝缘层至少布置有白色膜。

公开(公告)号：US20120248380A1

公开(公告)日：2012-10-04

申请号：US13353882

申请日：2012-01-19

Applicant: Taeyoon LEE ,  Jungmok SEO ,  Ja Hoon KOO ,  Seul Ah LEE

Inventor： Taeyoon LEE ,  Jungmok SEO ,  Ja Hoon KOO ,  Seul Ah LEE

IPC: C09D11/00 ,  H05K1/09 ,  H01B1/00 ,  B82Y40/00 ,  B82Y30/00

CPC classification number: H05K1/097 ,  C09D11/52 ,  H05K3/1258 ,  H05K2201/026 ,  H05K2201/0266

Abstract: Provided is a method of manufacturing a nanowire and a nanowire device using a nanowire ink solution. The nanowire ink solution includes nanowires having two or more sizes.

Abstract translation: 提供使用纳米线油墨溶液制造纳米线和纳米线器件的方法。 纳米线油墨溶液包括具有两种或更多种尺寸的纳米线。