公开(公告)号：US20230389186A1

公开(公告)日：2023-11-30

申请号：US18136303

申请日：2023-04-18

Applicant: InnoLux Corporation

Inventor： Yuan-Lin Wu ,  Kuan-Feng Lee

IPC: H05K1/18

CPC classification number: H05K1/189 ,  H05K2201/10128 ,  H05K2201/09827 ,  H05K2201/10287

Abstract: An electronic device is provided by the present disclosure. The electronic device includes a first main structure, a second main structure adjacent to the first main structure, a connecting structure connecting the first main structure and the second main structure, a first semiconductor disposed on the first main structure and a first insulating structure disposed between the first semiconductor and the first main structure, wherein the first insulating structure has a first groove.

公开(公告)号：US20230380069A1

公开(公告)日：2023-11-23

申请号：US17795543

申请日：2022-06-07

Applicant: WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO.,LTD.

Inventor： Cuilin ZHU ,  Xiang HUANG

IPC: H05K1/18 ,  H05K1/02

CPC classification number: H05K1/189 ,  H05K1/0266 ,  H05K2201/10128

Abstract: The present disclosure provides a display module and a mobile terminal. The display module includes a display panel and a flexible circuit board. The display panel includes a plurality of first binding terminals and a plurality of first alignment marks. The flexible circuit board includes a plurality of second binding terminals and a plurality of second alignment marks. The second binding terminals are bound to the first binding terminals, each of the first alignment marks corresponds to one of the second alignment marks, and each of a plurality of first marks of the first alignment marks corresponds to one of a plurality of second marks of the second alignment marks.

公开(公告)号：US11825613B2

公开(公告)日：2023-11-21

申请号：US17493910

申请日：2021-10-05

Applicant: Samsung Display Co., Ltd.

Inventor： Jeongjin Park ,  Donghyun Lee ,  Junyoung Lee

IPC: H05K3/46 ,  H05K1/14

CPC classification number: H05K3/4679 ,  H05K1/144 ,  H05K2201/10128 ,  H05K2203/104

Abstract: A method includes preparing a substrate including a display area and a non-display area disposed adjacent to the display area, forming first panel magnetic patterns overlapping the non-display area and extending in a first direction on the substrate, forming first film magnetic patterns extending in the first direction on a film, inputting a first magnetism to the first panel magnetic patterns so that the first panel magnetic patterns have a first magnetic property, inputting a second magnetism to the first film magnetic patterns so that the first film magnetic patterns have a second magnetic property, and aligning the film on the substrate so that the first film magnetic patterns overlap the first panel magnetic patterns in a plan view.

公开(公告)号：US20230363091A1

公开(公告)日：2023-11-09

申请号：US18223245

申请日：2023-07-18

Applicant: Samsung Display Co., LTD.

Inventor： Kyu Min HAN ,  Seung Hwan CHEONG

IPC: H05K1/11

CPC classification number: H05K1/118 ,  H05K2201/10128 ,  H05K1/0218

Abstract: A connection member includes a first region, a second region, and a third region, where a number of conductive layers in the second region is greater than a number of conductive layers in the first region and is greater than a number of conductive layers in the third region, a first layer, which is an uppermost layer of the second region, extends to the third region, a second layer, which is a lowermost layer of the third region, extends to the second region, and a side portion of the second region at a boundary between the second region and the third region is covered by the first layer and the second layer.

公开(公告)号：US11812548B2

公开(公告)日：2023-11-07

申请号：US17346718

申请日：2021-06-14

Applicant: Xiamen Tianma Micro-Electronics Co., Ltd.

Inventor： Lei Suo

IPC: H05K1/02 ,  H05K1/14 ,  H05K3/36

CPC classification number: H05K1/0268 ,  H05K1/028 ,  H05K1/14 ,  H05K3/361 ,  H05K2201/10128 ,  H05K2203/16

Abstract: A display module and its formation method are provided in the present disclosure. The display module includes a main flexible circuit board, including a first binding terminal, a second binding terminal, a first test point and a second test point, where the first test point is electrically connected to the first binding terminal, and the second test point is electrically connected to the second binding terminal; and further includes an auxiliary flexible circuit board, including a third binding terminal and a fourth binding terminal, where the third binding terminal is electrically connected to the fourth binding terminal, the first binding terminal is disposed corresponding to the third binding terminal, and the second binding terminal is disposed corresponding to the fourth binding terminal.

公开(公告)号：US20230354524A1

公开(公告)日：2023-11-02

申请号：US18346880

申请日：2023-07-05

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yongyoun KIM ,  Seyoon BAE ,  Joon HEO ,  Sangkyun LEE ,  Minsu JUNG

IPC: H05K1/14 ,  H05K5/02 ,  H05K1/02

CPC classification number: H05K1/148 ,  H05K5/0226 ,  H05K1/0281 ,  H05K2201/10128

Abstract: An electronic device includes: a hinge structure which is a folding area and includes a hinge housing; a first housing connected to the hinge structure; a second housing connected with the first housing through the hinge structure to be rotatable with respect to the first housing; and a flexible printed circuit board (FPCB), which has one end connected to a first printed circuit board (PCB) disposed in the first housing, and the other end connected to a second PCB disposed in the second housing. The FPCB includes a first section and a second section, the second section is extended from one side of the first section, and a variance in a curvature of the second section is greater than a variance in a curvature of the first section when the first housing and the second housing rotate with respect to the hinge structure.

公开(公告)号：US20230354504A1

公开(公告)日：2023-11-02

申请号：US17904220

申请日：2020-12-22

Applicant: Samsung Electronics Co., Ltd.

Inventor： Bumhee BAE ,  Sungsoo KIM ,  Kwangmo YANG

IPC: H05K1/02 ,  H05K1/11

CPC classification number: H05K1/0224 ,  H05K1/115 ,  H05K1/028 ,  H05K2201/10128 ,  H05K2201/09263

Abstract: An electronic device includes a first electric element a second electric element, and a circuit board. The circuit board is configured to deliver a signal between the first electric element and the second electric element. The circuit board includes a first portion, a second portion, and a third portion. The second and third portions extend from the first portion with the first portion therebetween. The circuit board also includes at least one signal line extending from the second portion to the third portion, a plurality of ground patterns extending from the second portion to the third portion, a plurality of first conductive vias positioned at the second portion and electrically connecting the plurality of ground patterns, and a plurality of second conductive vias positioned at the third portion and electrically connecting the plurality of ground patterns. The plurality of ground patterns include a meander form at the first portion.

公开(公告)号：US11805689B2

公开(公告)日：2023-10-31

申请号：US18115991

申请日：2023-03-01

Applicant: Samsung Display Co., Ltd.

Inventor： Youngjin Cho ,  Yangwan Kim ,  Joong-Soo Moon ,  Minwoo Byun ,  Changkyu Jin

IPC: H01L27/32 ,  H10K59/131 ,  G06F3/044 ,  G06F3/041 ,  H05K1/14 ,  H10K50/844 ,  H10K59/40 ,  H10K59/123 ,  H10K59/124 ,  H10K77/10 ,  H01L27/12 ,  H10K102/00 ,  H05K1/18

CPC classification number: H10K59/131 ,  G06F3/0412 ,  G06F3/0443 ,  G06F3/0445 ,  G06F3/0446 ,  G06F3/04164 ,  H05K1/147 ,  H10K50/844 ,  H10K59/123 ,  H10K59/124 ,  H10K59/40 ,  H10K77/111 ,  G06F2203/04102 ,  G06F2203/04111 ,  H01L27/124 ,  H01L27/1248 ,  H05K1/189 ,  H05K2201/10128 ,  H10K2102/311

Abstract: An electronic apparatus includes a base substrate having an active area and a peripheral area adjacent to the active area. A plurality of pixels is disposed on the active area. The electronic apparatus also includes a plurality of power lines connected to the pixels. A power pad is disposed on a peripheral area and is configured to receive a power voltage. A power pattern is disposed on the peripheral area and connecting the power lines to the power pad. A plurality of sensing electrodes is disposed on the pixels in the active area. A plurality of sensing pads is disposed on the peripheral area and is electrically connected to the sensing electrodes. The sensing pads overlap with the power pattern.

公开(公告)号：US11803265B2

公开(公告)日：2023-10-31

申请号：US17602583

申请日：2021-01-04

Applicant: Chengdu BOE Optoelectronics Technology Co., Ltd. ,  BOE Technology Group Co., Ltd.

Inventor： Zijian Wang ,  Xu Lu ,  Qing Gong

IPC: G06F3/041 ,  H05K1/18

CPC classification number: G06F3/0412 ,  H05K1/189 ,  H05K2201/10128

Abstract: This disclosure relates to a touch display device, including a display panel, a main flexible printed circuit and a first bridge flexible printed circuit that are connected to the display panel, wherein a touch component including a touch IC is provided on the first bridge flexible printed circuit. The first bridge flexible printed circuit includes a first bonding area in a bonding connection with the display panel. A first electrode signal line led out of the display panel is connected to the first bridge flexible printed circuit via the first bonding area, and is connected to the touch IC via wiring on the first bridge flexible printed circuit.

公开(公告)号：US20230328876A1

公开(公告)日：2023-10-12

申请号：US18208923

申请日：2023-06-13

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Yong Jin SHIN ,  Kyun Ho Kim ,  Uk Jae Jang ,  Bong Im Park

IPC: H05K1/02 ,  H05K1/18 ,  H01L23/498 ,  H05K1/14 ,  G09G3/00

CPC classification number: H05K1/0268 ,  H05K1/18 ,  H01L23/49838 ,  H05K1/14 ,  G09G3/006 ,  G09G2330/12 ,  H01L23/4985 ,  H05K2201/049 ,  H05K2201/10128

Abstract: A display device including: a display panel; a first substrate attached to a side of the display panel; and a second substrate attached to a side of the first substrate, wherein the display panel includes a first panel test pad and a second panel test pad, the first substrate includes a 1-1 circuit test lead overlapping and connected to the first panel test pad, a 1-2 circuit test lead overlapping and connected to the second panel test pad, a 2-1 circuit test lead overlapping and connected to the second substrate, a 1-1 test lead line connected to the 1-1 circuit test lead, a 1-2 test lead line connected to the 1-2 circuit test lead, and a first test lead line connected to the 2-1 circuit test lead, and the 1-1 test lead line and the 1-2 test lead line are connected to the first test lead line.